DESD5V0S1BLP3 LOW CAPACITANCE BIDIRECTIONAL TVS DIODE Features Mechanical Data Ultra-Small, Low Profile Leadless Surface Mount Package (0.6 * Case: X3-DFN0603-2 0.3 * 0.3mm) Case Material: Molded Plastic, Green Molding Compound. UL IEC 61000-4-2 (ESD): Air 30kV, Contact 30kV Flammability Classification Rating 94V-0 1 Channel of ESD Protection Moisture Sensitivity: Level 1 per J-STD-020 Low Channel Input Capacitance Terminals: Finish Matte Tin over Copper leadframe, solderable Typically Used in Cellular Handsets, Portable Electronics, per MIL-STD-202, Method 208 Communication Systems, Computers and Peripherals Weight: 0.0002 grams (approximate) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) X3-DFN0603-2 Pin 1 Pin 2 Top View Device Schematic Bottom View Ordering Information (Note 4) Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel DESD5V0S1BLP3-7 Standard ZZ 7 8 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See DESD5V0S1BLP3 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Conditions Peak Pulse Power Dissipation P 145 W 8/20s, Per Figure 3 PP Peak Pulse Current I 10 A 8/20s, Per Figure 3 PP ESD Protection Contact Discharge V 30 kV Standard IEC 61000-4-2 ESD Contact ESD Protection Air Discharge V 30 kV Standard IEC 61000-4-2 ESD Air Thermal Characteristics Characteristic Symbol Value Unit Package Power Dissipation (Note 5) P 250 mW D Thermal Resistance, Junction to Ambient (Note 5) 500 C/W R JA Operating and Storage Temperature Range T , T -65 to +150 C J STG Electrical Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Min Typ Max Unit Test Conditions Reverse Standoff Voltage V 5 V RWM Channel Leakage Current (Note 6) I 1 100 nA V = 5V RM RWM 10 V I = 1A, tp = 8/20S PP Clamping Voltage, Positive Transients V CL 14.5 V I = 10A, tp = 8/20S PP Breakdown Voltage 6 9.5 V V I = 1mA BR R Differential Resistance 0.5 R I = 10A, t = 8/20s DIF PP p 22 28 V = 0V, f = 1MHz R Channel Input Capacitance C pF T 16 22 V = 5V, f = 1MHz R Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at