REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline S to device type 01. Add device type 02 to drawing for case 89-12-07 Michael A. Frye outlines R, S, and 2. Add vendors CAGE 75569 and 27014 to device type 01. Add vendors CAGE 61722 and 75569 to device type 02. Editorial changes to table I and throughout drawing. B Add notes to figure 4, switching waveforms and test circuit. Update the 06-04-18 Thomas M. Hess boilerplate to current requirements as specified in MIL-PRF-38535. Editorial changes throughout. - jak C Add footnote 4/ to I test in table I. jak 10-01-06 Thomas M. Hess CC REV SHEET REV SHEET REV STATUS REV C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY James E. Nicklaus DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 STANDARD CHECKED BY 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87656 01 R A Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54FCT273 Octal D-type flip-flop with clear, TTL compatible inputs 02 54FCT273A Octal D-type flip-flop with clear, TTL compatible inputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (V ) ........................................................................... -0.5 V dc to +6.0 V dc CC DC input voltage range (V ) ......................................................................... -0.5 V dc to V + 0.5 V dc IN CC DC output voltage range (V ) .................................................................... -0.5 V dc to V + 0.5 V dc OUT CC DC input diode current (I ) ........................................................................... -20 mA IK DC output diode current (I ) ........................................................................ -50 mA OK DC output current (I ) ................................................................................ 100 mA OUT Storage temperature range (T ) ................................................................ -65C to +150 C STG Maximum power dissipation (P ) ................................................................. 500 mW D Lead temperature (soldering, 10 seconds) ................................................... +300C Thermal resistance, junction-to-case ( ) .................................................... See MIL-STD-1835 JC Junction temperature (T ) ............................................................................. +175C J 1.4 Recommended operating conditions. Supply voltage range (V ) ........................................................................... +4.5 V dc to +5.5 V dc CC Maximum low level input voltage (V )........................................................... 0.8 V IL Minimum high level input voltage (V ) .......................................................... 2.0 V IH Case operating temperature range (T ) ........................................................ -55C to +125 C C Minimum setup time, high or low, data to CP (t ): s Device type 01 ............................................................................................ 3.5 ns Device type 02 ............................................................................................ 3.0 ns Minimum hold time, high or low, data to CP (t ): h Device type 01 ............................................................................................ 2.5 ns Device type 02 ............................................................................................ 2.0 ns Minimum CP pulse width, high or low (t ): w1 Device type 01 ............................................................................................ 7.0 ns Device type 02 ............................................................................................ 6.0 ns Minimum removal time, MR to CP (t ): REM Device type 01 ............................................................................................ 5.0 ns Device type 02 ............................................................................................ 3.0 ns Minimum MR pulse width, low (t ): w2 Device type 01 ............................................................................................ 7.0 ns Device type 02 ............................................................................................ 6.0 ns 1/ Unless other wise specified, all voltages are referenced to ground. SIZE STANDARD 5962-87656 A MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS REVISION LEVEL SHEET COLUMBUS, OHIO 43218-3990 C 2 DSCC FORM 2234 APR 97