X-On Electronics has gained recognition as a prominent supplier of GS66502B-TR MOSFETs across the USA, India, Europe, Australia, and various other global locations. GS66502B-TR MOSFETs are a product manufactured by Gan Systems. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

GS66502B-TR Gan Systems

GS66502B-TR electronic component of Gan Systems
GS66502B-TR Gan Systems
GS66502B-TR MOSFETs
GS66502B-TR  Semiconductors

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See Product Specifications
Part No. GS66502B-TR
Manufacturer: Gan Systems
Category: MOSFETs
Description: MOSFET 650V, 7.5A, GaN E-mode, GaNPX package, Bottom-side cooled
Datasheet: GS66502B-TR Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 12.456 ea
Line Total: USD 12.46 
Availability - 271
Ship by Fri. 13 Jun to Tue. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
271
Ship by Fri. 13 Jun to Tue. 17 Jun
MOQ : 1
Multiples : 1
1 : USD 12.456
10 : USD 9.955
100 : USD 8.536
250 : USD 8.492
3000 : USD 7.403

   
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Mounting Style
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Tradename
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the GS66502B-TR from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the GS66502B-TR and other electronic components in the MOSFETs category and beyond.

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GS66502B Bottom-side cooled 650 V E-mode GaN transistor Datasheet Features 650 V enhancement mode power transistor Bottom-side cooled configuration R = 200 m DS(on) I = 7.5 A DS(max) Ultra-low FOM die Low inductance GaNPX package Package Outline Circuit Symbol Simple gate drive requirements (0 V to 6 V) Transient tolerant gate drive (-20 V / +10 V) Very high switching frequency (> 10 MHz) Fast and controllable fall and rise times Reverse current capability Zero reverse recovery loss 2 Small 5.0 x 6.6 mm PCB footprint RoHS3 (6 + 4) compliant Applications Description AC-DC Converters The GS66502B is an enhancement mode GaN-on- DC-DC converters silicon power transistor. The properties of GaN allow Uninterruptable Power Supplies for high current, high voltage breakdown and high Industrial Motor Drives switching frequency. GaN Systems innovates with Appliance Motor Drives industry leading advancements such as patented Fast Battery Charging Island Technology and GaNPX packaging. Island Class D Audio amplifiers Power Adapters Technology cell layout realizes high-current die and Wireless Power Transfer high yield. GaNPX packaging enables low inductance & low thermal resistance in a small package. The GS66502B is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching. Rev 200402 2009-2020 GaN Systems Inc. 1 Submit datasheet feedback GS66502B Bottom-side cooled 650 V E-mode GaN transistor Datasheet Absolute Maximum Ratings (Tcase = 25 C except as noted) Parameter Symbol Value Unit Operating Junction Temperature T -55 to +150 C J Storage Temperature Range T -55 to +150 C S Drain-to-Source Voltage V 650 V DS Drain-to-Source Voltage - transient (Note 1) V 750 V DS(transient) Gate-to-Source Voltage V -10 to +7 V GS Gate-to-Source Voltage - transient (Note 1) V -20 to +10 V GS(transient) Continuous Drain Current (T = 25 C) I 7.5 A case DS Continuous Drain Current (T = 100 C) I 6.3 A case DS Pulse Drain Current (Pulse width 50 s, V = 6 V) (Note 2) I 15 A GS DS Pulse (1) For < 1 s (2) Defined by product design and characterization. Value is not tested to full current in production. Thermal Characteristics (Typical values unless otherwise noted) Parameter Symbol Value Units Thermal Resistance (junction-to-case) bottom side R 2 C /W JC Thermal Resistance (junction-to-ambient) (Note 3) R 31 C /W JA Maximum Soldering Temperature (MSL3 rated) T 260 C SOLD (3) Device mounted on 1.6 mm PCB thickness FR4, 4-layer PCB with 2 oz. copper on each layer. The recommendation for thermal vias under the thermal pad are 0.3 mm diameter (12 mil) with 0.635 mm pitch (25 mil). The copper layers under 2 the thermal pad and drain pad are 25 x 25 mm each. The PCB is mounted in horizontal position without air stream cooling. Ordering Information Ordering Packing Reel Reel Package type Qty code method Diameter Width GS66502B-TR GaNPX Bottom-Side Cooled Tape-and-Reel 3000 13 (330mm) 16mm GS66502B-MR GaNPX Bottom-Side Cooled Mini-Reel 250 7 (180mm) 16mm Rev 200402 2009-2020 GaN Systems Inc. 2 Submit datasheet feedback

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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