SMTAK3-066C Littelfuse

TVS Diodes Surface Mount 3kA > SMTAK3 Series RoHS Pb e4 SMTAK3 Series Description The SMTAK3 series of high current transient suppressors have been specially designed for use in D.C. line protection and any demanding applications. They offer superior clamping characteristics over standard S.A.D. technologies by virtue of the Littelfuse Foldbak technology. Therefore, any voltage rise due to increased current conduction is contained to a minimum, providing the best possible protection level. Features Very low clamping voltage EFT protection of data lines in accordance with Sharp breakdown voltage IEC 61000-4-4 Low slope resistance Agency Recognitions Halogen-free Bi-directional RoHS compliant Foldbak technology for Agency Agency File Number Glass passivated junction superior clamping factor E128662 Pb-free E4 means 2nd Symmetric in leads width level interconnect is for easier soldering during Pb-free and the terminal assembly. Maximum Ratings and Thermal Characteristics finish material is silver IEC 61 000-4-2 ESD O (T =25 C unless otherwise noted) A (IPC/JEDEC J-STD- 15kV(Air), 8kV (Contact) 609A.01) ESD protection of data Parameter Symbol Value Unit UL Recognized to ANSI/ lines in accordance with Operating Storage Temperature T -55 to 150 C UL 497B STG Range IEC 61000-4-2 Operating Junction Temperature T -55 to 125 C J Range 1 Current Rating I 3 kA PP Note: 1. Rated I measured with 8/20s pulse. PP Functional Diagram Bi-direcctional Electrical Characteristics (T =25C unless otherwise noted) A Reverse Max. Test Max. Clamping Voltage Max. Temp Max. Standoff Typical Agency Breakdown Reverse Current V I Peak Pulse Coefficient Capacitance Part Part Voltage I CL pp Approval Voltage V R Leakage BR O I Current (I ) (Note 1) OF V 0 Bias 10kHz T PP BR Numbers Marking (V ) 85 C (Volts) I SO T (I ) V R SO Volts (A) A O Min Max (mA) V Volts I Amps (%/ C) (nF) CL PP SMTAK3-015C S3-015C 15 10 15 16 19 10 28 3,000 0.1 9.0 X SMTAK3-058C S3-058C 58 10 15 64 70 10 110 3,000 0.1 6.0 X SMTAK3-066C S3-066C 66 10 15 72 80 10 120 3,000 0.1 6.0 X SMTAK3-076C S3-076C 76 10 15 85 95 10 140 3,000 0.1 6.0 X Note: 1. Using 8/20s wave shape as defined in IEC 61000-4-5. 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/15/19TVS Diodes Surface Mount 3kA > SMTAK3 Series Soldering Parameters Reflow Condition Leadfree assembly t p - Temperature Min (T ) 150C T s(min) P Pre Heat - Temperature Max (T ) 200C Ramp-up Critical Zone s(max) T to T L P T L t - Time (min to max) (t ) 60 120 secs L s T s(max) Average ramp up rate (Liquidus Temp (T ) to A 3C/second max peak Ramp-down T s(min) t T to T - Ramp-up Rate 3C/second max s S(max) A Preheat - Temperature (T ) (Liquidus) 217C L Reflow 25C - Time (min to max) (t ) 60 150 seconds s t 25C to Peak Time (t) +0/-5 Peak Temperature (T ) 260 C P Time within 5C of actual peak Temperature 30 seconds max (t ) p Flow/Wave Soldering (Solder Dipping) Ramp-down Rate 6C/second max O Peak Temperature : 265 C Time 25C to peak Temperature (T ) 8 minutes Max. P Dipping Time : 10 seconds Do not exceed 260C Soldering : 1 time Physical Specifications Weight Contact manufacturer Case Compound encapsulated Silver plated leads, solderable per Terminal MIL-STD-202 Method 208 Wave Solder Prolefi Figure 1 - Non Lead-free Profile Figure 2 - Lead-free Profile 300 300 Maximum Wave 260C Maximum Wave 240C 250 250 200 200 150 150 100 100 50 50 0 0 0 0. 5 1 1. 5 2 2. 5 3 3. 5 4 0 0.5 1 1.5 2 2.5 3 3.5 4 TIME (MINUTES) TIME (MINUTES) 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 04/15/19 TEMPERATURE ( TEMPERATURE (C) Temperature (T)