MCP9805 Memory Module Digital Temperature Sensor Features Description Meets JEDEC Standard JC42.4 for Mobile Microchip Technology Inc.s MCP9805 digital tempera- Platform Memory Module Thermal Sensor ture sensor converts temperatures between -40C and Temperature-to-Digital Converter +125C to a digital word. This sensor is designed to Accuracy with 0.25 C/LSb Resolution: meet the JEDEC standard JC42.4 for Mobile Platform Memory Module Thermal Sensor. This device provides - 1C (max.) from +75C to +95C an accuracy of 1C (max.) from a temperature range - 2C (max.) from +40C to +125C of +75C to +95C (active range) and 2C (max.) from - 3C (max.) from -20C to +125C +40C to +125C (monitor range) as defined in the Programmable Temperature Monitor Boundary JEDEC standard. Critical Temperature Output The MCP9805 comes with user-programmable Operating Voltage Range: 3.0V to 3.6V registers that provide flexibility for DIMM 2 2-wire Interface: SMBus/Standard mode I C temperature-sensing applications. The registers allow Compatible user-selectable settings such as Shutdown or Low-Power modes and the specification of tempera- Operating Current: 200 A (typ.) ture event and critical output boundaries. When the Shutdown Current: 0.1 A (typ.) temperature changes beyond the specified boundary Available Packages: 2x3 DFN-8, TSSOP-8 limits, the MCP9805 outputs an Event signal. The user has the option of setting the Event output signal polarity Typical Applications as either an active-low or active-high comparator Dual In-line Memory Module (DIMM) output for thermostat operation, or as a temperature Personal Computers (PCs) and Servers event interrupt output for microprocessor-based Hard Disk Drives and Other PC Peripherals systems. The Event output can also be configured as a General Purpose Temperature Sensor critical temperature output. This sensor has a 2-wire industry-standard SMBus 2 Typical Application and Standard mode I C compatible (100kHz bus clock) serial interface protocol, allowing up to eight sen- Memory Module sors to be controlled in a single serial bus. These fea- tures make the MCP9805 ideal for sophisticated Memory multi-zone temperature-monitoring applications. Package Types Temperature Sensor SPD* MCP9805 8-Pin DFN (2x3) MCP9805 EEPROM V 1 8 A0 DD Event 2 A1 7 A2 SCLK 3 6 R GND 4 SDA 5 8-Pin TSSOP V 1 8 A0 DD R Event 2 A1 7 SCLK A2 3 6 3.3 V GND SDA 4 5 DD SPD SDA SCLK Event * Serial Presence Detect 2005 Microchip Technology Inc. DS21977B-page 1MCP9805 Notice: Stresses above those listed under Maximum 1.0 ELECTRICAL ratings may cause permanent damage to the device. This is CHARACTERISTICS a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Absolute Maximum Ratings Exposure to maximum rating conditions for extended periods V ....................................................................... 6.0V may affect device reliability. DD Voltage at all Input/Output pins .... GND 0.3V to 5.5V Storage temperature ..........................-65C to +150C Ambient temp. with power applied .....-40C to +125C Junction Temperature (T )................................ +150C J ESD protection on all pins (HBM:MM)....... (4 kV:200V) Latch-Up Current at each pin ........................ 200 mA DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, V = 3.0V to 3.6V, GND = Ground and T = -20C to +125C. DD A Parameters Sym Min Typ Max Unit Conditions Power Supply Operating Voltage Range V 3.0 3.6 V DD Operating Current I 200 500 A Continuous Operation DD Shutdown Current I 0.1 2 A Shutdown Mode SHDN Power-On Reset Threshold (POR) V 2.2 VV Falling Edge POR DD Power Supply Rejection PSR 0.3 C DC PSR 0.5 C V = 3.3V + 150 mVpp AC DD (0 to 1 MHz), T = +25C A Temperature Sensor Accuracy Accuracy with 0.25 C/LSb Resolution: +75C to +95C T -1.0 0.5 +1.0 C Active Temp. Range ACY +40C to +125C T -2.0 1.0 +2.0 C Monitor Temp. Range ACY -20C to +125C T -3.0 2.0 +3.0 C ACY T = -40C T 2 C A ACY Internal ADC Conversion Time (10-bits + Sign): 0.25 C/LSb t 65 125 ms 17 samples/sec. (typ.) CONV Event Output (Open-Drain) High-Level Current (leakage) I 1 AV = 3.6V OH OH Low-Level Voltage V 0.4 VI = 3 mA OL OL Thermal Response Response Time (Note): DFN t 0.7 s Time to 63% of +22C (Air) RES to +125C (Oil Bath) TSSOP t 1.5 s RES Note: Thermal response with 1x1 inch dual-sided copper clad. DS21977B-page 2 2005 Microchip Technology Inc.