MK30DN512VLL10

Document Number: K30P100M100SF2V2 Freescale Semiconductor Rev. 3, 6/2013 Data Sheet: Technical Data K30P100M100SF2V2 K30 Sub-Family Supports the following: MK30DN512VLL10 Features Human-machine interface Operating Characteristics Segment LCD controller supporting up to 40 Voltage range: 1.71 to 3.6 V frontplanes and 8 backplanes, or 44 frontplanes and Flash write voltage range: 1.71 to 3.6 V 4 backplanes, depending on the package size Temperature range (ambient): -40 to 105C Low-power hardware touch sensor interface (TSI) General-purpose input/output Performance Up to 100 MHz ARM Cortex-M4 core with DSP Analog modules instructions delivering 1.25 Dhrystone MIPS per Two 16-bit SAR ADCs MHz Programmable gain amplifier (PGA) (up to x64) integrated into each ADC Memories and memory interfaces 12-bit DAC Up to 512 KB program flash memory on non- Two transimpedance amplifiers FlexMemory devices Three analog comparators (CMP) containing a 6-bit Up to 128 KB RAM DAC and programmable reference input Serial programming interface (EzPort) Voltage reference Clocks Timers 3 to 32 MHz crystal oscillator Programmable delay block 32 kHz crystal oscillator Eight-channel motor control/general purpose/PWM Multi-purpose clock generator timer Two 2-channel quadrature decoder/general purpose System peripherals timers Multiple low-power modes to provide power Periodic interrupt timers optimization based on application requirements 16-bit low-power timer Memory protection unit with multi-master Carrier modulator transmitter protection Real-time clock 16-channel DMA controller, supporting up to 63 request sources Communication interfaces External watchdog monitor Two Controller Area Network (CAN) modules Software watchdog Three SPI modules Low-leakage wakeup unit Two I2C modules Five UART modules Security and integrity modules Secure Digital host controller (SDHC) Hardware CRC module to support fast cyclic I2S module redundancy checks 128-bit unique identification (ID) number per chip Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20122013 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.2 Thermal attributes.................................................21 1.1 Determining valid orderable parts......................................3 6 Peripheral operating requirements and behaviors....................22 2 Part identification......................................................................3 6.1 Core modules....................................................................22 2.1 Description.........................................................................3 6.1.1 Debug trace timing specifications.........................22 2.2 Format...............................................................................3 6.1.2 JTAG electricals....................................................23 2.3 Fields.................................................................................3 6.2 System modules................................................................26 2.4 Example............................................................................4 6.3 Clock modules...................................................................26 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................26 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................28 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz oscillator electrical characteristics.............30 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................31 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................31 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort switching specifications.............................33 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................34 requirements......................................................................6 6.6 Analog...............................................................................34 3.7 Guidelines for ratings and operating requirements............7 6.6.1 ADC electrical specifications.................................34 3.8 Definition: Typical value.....................................................7 6.6.2 CMP and 6-bit DAC electrical specifications.........41 3.9 Typical value conditions....................................................8 6.6.3 12-bit DAC electrical characteristics.....................44 4 Ratings......................................................................................9 6.6.4 Voltage reference electrical specifications............47 4.1 Thermal handling ratings...................................................9 6.7 Timers................................................................................48 4.2 Moisture handling ratings..................................................9 6.8 Communication interfaces.................................................48 4.3 ESD handling ratings.........................................................9 6.8.1 CAN switching specifications................................48 4.4 Voltage and current operating ratings...............................9 6.8.2 DSPI switching specifications (limited voltage 5 General.....................................................................................10 range)....................................................................49 5.1 AC electrical characteristics..............................................10 6.8.3 DSPI switching specifications (full voltage range).50 5.2 Nonswitching electrical specifications...............................10 6.8.4 Inter-Integrated Circuit Interface (I2C) timing........52 5.2.1 Voltage and current operating requirements.........10 6.8.5 UART switching specifications..............................53 5.2.2 LVD and POR operating requirements.................11 6.8.6 SDHC specifications.............................................53 5.2.3 Voltage and current operating behaviors..............12 6.8.7 I2S/SAI switching specifications............................54 5.2.4 Power mode transition operating behaviors..........14 6.9 Human-machine interfaces (HMI)......................................60 5.2.5 Power consumption operating behaviors..............15 6.9.1 TSI electrical specifications...................................60 5.2.6 EMC radiated emissions operating behaviors.......18 6.9.2 LCD electrical characteristics................................61 5.2.7 Designing with radiated emissions in mind...........19 7 Dimensions...............................................................................62 5.2.8 Capacitance attributes..........................................19 7.1 Obtaining package dimensions.........................................62 5.3 Switching specifications.....................................................19 8 Pinout........................................................................................63 5.3.1 Device clock specifications...................................19 8.1 K30 signal multiplexing and pin assignments....................63 5.3.2 General switching specifications...........................20 8.2 K30 pinouts.......................................................................67 5.4 Thermal specifications.......................................................21 9 Revision history.........................................................................68 5.4.1 Thermal operating requirements...........................21 K30 Sub-Family Data Sheet, Rev. 3, 6/2013. 2 Freescale Semiconductor, Inc.