BGA2869,115 NXP

BGA2869,115 electronic component of NXP
BGA2869,115 NXP
BGA2869,115 RF Amplifier
BGA2869,115  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of BGA2869,115 RF Amplifier across the USA, India, Europe, Australia, and various other global locations. BGA2869,115 RF Amplifier are a product manufactured by NXP. We provide cost-effective solutions for RF Amplifier, ensuring timely deliveries around the world.

Part No.BGA2869,115
Manufacturer:NXP
Category:RF Amplifier
Description:NXP Semiconductors RF Amplifier GP AMPLIFIER
Datasheet:BGA2869,115 Datasheet (PDF)
Shipping Charges:Click here for details
AI Image
Price (USD)
  
42: USD 0.246 ea
Line Total: USD 10.33 
Availability : 0
  
QtyUnit Price
42$ 0.246
100$ 0.1968
250$ 0.1948
500$ 0.1812
1000$ 0.1775
  

Availability0
Ship by Thu. 25 Jun to Wed. 01 Jul
MOQ : 3000
Multiples : 3000
QtyUnit Price
3000$ 0.2847
6000$ 0.2847
9000$ 0.2847
12000$ 0.2778
15000$ 0.2764


Availability0
Ship by Thu. 25 Jun to Wed. 01 Jul
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 2.7058
10$ 1.6813
30$ 1.3418
100$ 1.1487
500$ 1.0619
1000$ 1.0245


Availability0
Ship by Tue. 23 Jun to Thu. 25 Jun
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.1725
10$ 0.71
25$ 0.5724
100$ 0.4136
250$ 0.3916
500$ 0.374
1000$ 0.363
3000$ 0.2376

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Operating Frequency
P1dB - Compression Point
Gain
NF - Noise Figure
OIP3 - Third Order Intercept
Packaging
Brand
Factory Pack Quantity :
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the BGA2869,115 from our RF Amplifier category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BGA2869,115 and other electronic components in the RF Amplifier category and beyond.

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BGA2869 MMIC wideband amplifier Rev. 3 10 July 2015 Product data sheet 1. Product profile 1.1 General description Silicon Monolithic Microwave Integrated Circuit (MMIC) wideband amplifier with internal matching circuit in a 6-pin SOT363 plastic SMD package. 1.2 Features and benefits Internally matched to 50 A gain of 31.7 dB at 950 MHz Output power at 1 dB gain compression = 10 dBm at 950 MHz Supply current = 24.0 mA at a supply voltage of 5.0 V Reverse isolation > 39 dB up to 2150 MHz Good linearity with low second order and third order products Noise figure = 3.1 dB at 950 MHz Unconditionally stable (K > 1) No output inductor required 1.3 Applications LNB IF amplifiers General purpose low noise wideband amplifier for frequencies between DC and 2.2 GHz 2. Pinning information Table 1. Pinning Pin Description Simplified outline Graphic symbol 1V CC 6 5 4 1 2, 5 GND2 6 3 3RF OUT 4 GND1 4 2, 5 132 6RF IN sym052BGA2869 NXP Semiconductors MMIC wideband amplifier 3. Ordering information Table 2. Ordering information Type number Package Name Description Version BGA2869 - plastic surface-mounted package 6 leads SOT363 4. Marking Table 3. Marking Type number Marking code Description BGA2869 MD* * = - : made in Hong Kong * = p : made in Hong Kong * = W : made in China * = t : made in Malaysia 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit V supply voltage RF input AC coupled 0.5 +7.0 V CC I supply current - 36 mA CC P total power dissipation T = 90 C-200mW tot sp T storage temperature 40 +125 C stg T junction temperature - 125 C j P drive power - +10 dBm drive 6. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit R thermal resistance from junction to P = 200 mW T =90 C 300 K/W th(j-sp) tot sp solder point 7. Characteristics Table 6. Characteristics V = 5.0 V Z = Z = 50 P = 34 dBm T = 25 C measured on demo board unless otherwise specified. CC S L i amb Symbol Parameter Conditions Min Typ Max Unit V supply voltage 4.5 5.0 5.5 V CC I supply current 21.8 24.0 26.0 mA CC BGA2869 All information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2015. All rights reserved. Product data sheet Rev. 3 10 July 2015 2 of 13

Tariff Desc

8542.31.00 51 No ..Application Specific (Digital) Integrated Circuits (ASIC)

Electronic integrated circuits: Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits
Monolithic integrated circuits:
Freescale
FREESCALE SEMI
Freescale Semicon
FREESCALE SEMICONDUC
Freescale Semiconductor
Freescale Semiconductor - NXP
NXP
NXP Freescale
NXP (FREESCALE)
NXP / Freescale
NXP SEMI
NXP Semicon
NXP SEMICONDUCTOR
NXP Semiconductors
NXP USA Inc.
PH3
PHI
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