PK20DX128VLH5 NXP

Document Number: K20P64M50SF0 Freescale Semiconductor Rev. 4 5/2012 Data Sheet: Technical Data K20P64M50SF0 K20 Sub-Family Supports the following: MK20DN32VLH5, MK20DX32VLH5, MK20DN64VLH5, MK20DX64VLH5, MK20DN128VLH5, MK20DX128VLH5, MK20DN32VMP5, MK20DX32VMP5, MK20DN64VMP5, MK20DX64VMP5, MK20DN128VMP5, MK20DX128VMP5 Features Security and integrity modules Operating Characteristics Hardware CRC module to support fast cyclic Voltage range: 1.71 to 3.6 V redundancy checks Flash write voltage range: 1.71 to 3.6 V 128-bit unique identification (ID) number per chip Temperature range (ambient): -40 to 105C Analog modules Performance 16-bit SAR ADC Up to 50 MHz ARM Cortex-M4 core with DSP Two analog comparators (CMP) containing a 6-bit instructions delivering 1.25 Dhrystone MIPS per DAC and programmable reference input MHz Voltage reference Memories and memory interfaces Timers Up to 128 KB program flash. Programmable delay block Up to 32 KB FlexNVM on FlexMemory devices Eight-channel motor control/general purpose/PWM 2 KB FlexRAM on FlexMemory devices timer Up to 16 KB RAM Two-channel quadrature decoder/general purpose Serial programming interface (EzPort) timer Periodic interrupt timers Clocks 16-bit low-power timer 3 to 32 MHz crystal oscillator Carrier modulator transmitter 32 kHz crystal oscillator Real-time clock Multi-purpose clock generator Communication interfaces System peripherals USB full-/low-speed On-the-Go controller with on- Multiple low-power modes to provide power chip transceiver optimization based on application requirements SPI module 4-channel DMA controller, supporting up to 41 I2C module request sources Three UART modules External watchdog monitor I2S module Software watchdog Low-leakage wakeup unit Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 20112012 Freescale Semiconductor, Inc.Table of Contents 1 Ordering parts...........................................................................3 5.4.1 Thermal operating requirements...........................21 1.1 Determining valid orderable parts......................................3 5.4.2 Thermal attributes.................................................21 2 Part identification......................................................................3 6 Peripheral operating requirements and behaviors....................22 2.1 Description.........................................................................3 6.1 Core modules....................................................................22 2.2 Format...............................................................................3 6.1.1 JTAG electricals....................................................22 2.3 Fields.................................................................................3 6.2 System modules................................................................25 2.4 Example............................................................................4 6.3 Clock modules...................................................................25 3 Terminology and guidelines......................................................4 6.3.1 MCG specifications...............................................25 3.1 Definition: Operating requirement......................................4 6.3.2 Oscillator electrical specifications.........................27 3.2 Definition: Operating behavior...........................................5 6.3.3 32 kHz Oscillator Electrical Characteristics...........29 3.3 Definition: Attribute............................................................5 6.4 Memories and memory interfaces.....................................30 3.4 Definition: Rating...............................................................6 6.4.1 Flash electrical specifications................................30 3.5 Result of exceeding a rating..............................................6 6.4.2 EzPort Switching Specifications............................34 3.6 Relationship between ratings and operating 6.5 Security and integrity modules..........................................35 requirements......................................................................6 6.6 Analog...............................................................................35 3.7 Guidelines for ratings and operating requirements............7 6.6.1 ADC electrical specifications.................................35 3.8 Definition: Typical value.....................................................7 6.6.2 CMP and 6-bit DAC electrical specifications.........40 3.9 Typical value conditions....................................................8 6.6.3 Voltage reference electrical specifications............43 4 Ratings......................................................................................9 6.7 Timers................................................................................44 4.1 Thermal handling ratings...................................................9 6.8 Communication interfaces.................................................44 4.2 Moisture handling ratings..................................................9 6.8.1 USB electrical specifications.................................44 4.3 ESD handling ratings.........................................................9 6.8.2 USB DCD electrical specifications........................45 4.4 Voltage and current operating ratings...............................9 6.8.3 USB VREG electrical specifications......................45 5 General.....................................................................................10 6.8.4 DSPI switching specifications (limited voltage 5.1 AC electrical characteristics..............................................10 range)....................................................................46 5.2 Nonswitching electrical specifications...............................11 6.8.5 DSPI switching specifications (full voltage range).47 5.2.1 Voltage and current operating requirements.........11 6.8.6 I2C switching specifications..................................49 5.2.2 LVD and POR operating requirements.................11 6.8.7 UART switching specifications..............................49 5.2.3 Voltage and current operating behaviors..............12 6.8.8 I2S/SAI Switching Specifications..........................49 5.2.4 Power mode transition operating behaviors..........13 6.9 Human-machine interfaces (HMI)......................................54 5.2.5 Power consumption operating behaviors..............14 6.9.1 TSI electrical specifications...................................54 5.2.6 EMC radiated emissions operating behaviors.......18 7 Dimensions...............................................................................55 5.2.7 Designing with radiated emissions in mind...........19 7.1 Obtaining package dimensions.........................................55 5.2.8 Capacitance attributes..........................................19 8 Pinout........................................................................................56 5.3 Switching specifications.....................................................19 8.1 K20 Signal Multiplexing and Pin Assignments..................56 5.3.1 Device clock specifications...................................19 8.2 K20 Pinouts.......................................................................58 5.3.2 General switching specifications...........................20 9 Revision History........................................................................60 5.4 Thermal specifications.......................................................21 K20 Sub-Family Data Sheet, Rev. 4 5/2012. 2 Freescale Semiconductor, Inc.