Product Information

NLX2G00CMX1TCG

NLX2G00CMX1TCG electronic component of ON Semiconductor

Datasheet
NAND Gate 2-Element 2-IN CMOS 8-Pin ULLGA T/R

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

3206: USD 0.1312 ea
Line Total: USD 420.63

0 - Global Stock
MOQ: 3206  Multiples: 3206
Pack Size: 3206
Availability Price Quantity
0 - WHS 1


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 1
Multiples : 3000

Stock Image

NLX2G00CMX1TCG
ON Semiconductor

1 : USD 0.1435
3001 : USD 0.099

0 - WHS 2


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 3206
Multiples : 3206

Stock Image

NLX2G00CMX1TCG
ON Semiconductor

3206 : USD 0.1312

0 - WHS 3


Ships to you between Fri. 17 May to Thu. 23 May

MOQ : 3000
Multiples : 3000

Stock Image

NLX2G00CMX1TCG
ON Semiconductor

3000 : USD 0.1435
3001 : USD 0.099

     
Manufacturer
Product Category
High Level Output Current
Low Level Output Current
Packaging
Number Of Outputs
Mounting
Operating Temp Range
Operating Supply Voltage Typ
Logical Function
Operating Temperature Classification
Number Of Inputs
Operating Supply Voltage Min
Package Type
Number Of Elements
Quiescent Current
Technology
Rad Hardened
Operating Supply Voltage Max
Pin Count
LoadingGif

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NLX2G00 Dual 2-Input NAND Gate The NLX2G00 is an advanced high-speed dual 2-input CMOS NAND gate in ultra-small footprint. The NLX2G00 input structures provide protection when voltages up to 7.0 volts are applied, regardless of the supply voltage. NLX2G00 MAXIMUM RATINGS Symbol Parameter Value Unit V DC Supply Voltage 0.5 to +7.0 V CC V DC Input Voltage 0.5 to +7.0 V IN V DC Output Voltage 0.5 to V + 0.5 V OUT CC I DC Input Diode Current V < GND 50 mA IK IN I DC Output Diode Current V < GND 50 mA OK OUT I DC Output Source/Sink Current 50 mA O I DC Supply Current per Supply Pin 100 mA CC I DC Ground Current per Ground Pin 100 mA GND T Storage Temperature Range 65 to 150 C STG T Lead Temperature, 1 mm from Case for 10 Seconds TBD C L T Junction Temperature Under Bias TBD C J Thermal Resistance (Note 1) TBD C/W JA P Power Dissipation in Still Air at 85C TBD mW D MSL Moisture Sensitivity Level 1 F Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 0.125 in R V ESD Withstand Voltage Human Body Model (Note 2) > 2000 V ESD Machine Model (Note 3) > 200 Charged Device Model (Note 4) N/A I Latchup Performance Above V and Below GND at 125C (Note 5) 500 mA Latchup CC Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mmby1 inch, 2ounce copper trace with no air flow. 2. Tested to EIA/JESD22A114 A. 3. Tested to EIA/JESD22A115 A. 4. Tested to JESD22C101A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit V Power DC Supply Voltage Operating 1.65 5.5 V CC Data Retention Only 1.5 5.5 V Digital Input Voltage (Note 6) 0 5.5 V IN V Output Voltage 0 V V OUT CC T Operating FreeAir Temperature 55 +125 C A t/ V Input Transition Rise or Fall Rate V = 1.8 V 0.15 V 0 20 ns/V CC V = 2.5 V 0.2 V 0 20 CC V = 3.3 V 0.3 V 0 10 CC V = 5.0 V 0.5 V 0 5 CC 6. Unused inputs may not be left open. All inputs must be tied to a high or lowlogic input voltage level.

Tariff Desc

8542.39.23 No ..Linear/analogue and peripheral integrated circuits, timers, voltage regulators, A/D and D/A converters, telecommunication and modem integrated circuits, other than board level products Free

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