X-On Electronics has gained recognition as a prominent supplier of NTLUS4930NTBG mosfet across the USA, India, Europe, Australia, and various other global locations. NTLUS4930NTBG mosfet are a product manufactured by ON Semiconductor. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

NTLUS4930NTBG ON Semiconductor

NTLUS4930NTBG electronic component of ON Semiconductor
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Part No.NTLUS4930NTBG
Manufacturer: ON Semiconductor
Category:MOSFET
Description: Trans MOSFET N-CH 30V 6.1A 6-Pin UDFN EP T/R
Datasheet: NTLUS4930NTBG Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8061 ea
Line Total: USD 0.81

Availability - 853
Ships to you between
Thu. 13 Jun to Mon. 17 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
722 - WHS 1


Ships to you between Thu. 13 Jun to Mon. 17 Jun

MOQ : 1
Multiples : 1
1 : USD 0.8061
10 : USD 0.6705
100 : USD 0.537
500 : USD 0.4681
1000 : USD 0.4105
3000 : USD 0.3737
9000 : USD 0.36
24000 : USD 0.3588

     
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Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
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Package / Case
Packaging
Technology
Channel Mode
Power Dissipation
Operating Temperature Classification
Operating Temp Range
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Mounting
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Gate-Source Voltage Max
Continuous Drain Current
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Rad Hardened
Drain-Source On-Volt
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Cnhts
Hts Code
Mxhts
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NTLUS4930N MOSFET Power, Single, N-Channel, Cool, UDFN6, 2.0x2.0x0.55 mm 30 V, 6.1 A NTLUS4930N THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit Junction-to-Ambient Steady State (Note 3) R 75.7 JA Junction-to-Ambient t 5 s (Note 3) R 32.9 C/W JA Junction-to-Ambient Steady State min Pad (Note 4) R 191.4 JA 3. Surface-mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq 2 oz including traces). 2 4. Surface-mounted on FR4 board using the minimum recommended pad size of 30 mm , 2 oz. Cu. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Units OFF CHARACTERISTICS Drain-to-Source Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D Drain-to-Source Breakdown Voltage V /T I = 250 A, ref to 25C +16 mV/C (BR)DSS J D Temperature Coefficient Zero Gate Voltage Drain Current I V = 0 V, T = 25C 1.0 A DSS GS J V = 24 V DS Gate-to-Source Leakage Current I V = 0 V, V = 20 V 10 A GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.2 1.8 2.2 V GS(TH) GS DS D Negative Threshold Temp. Coefficient V /T 4.4 mV/C GS(TH) J Drain-to-Source On Resistance R m V = 10 V, I = 6.1 A 19 28.5 DS(on) GS D V = 4.5 V, I = 5.5 A 27 36 GS D Forward Transconductance g V = 1.5 V, I = 6.0 A 16 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE pF Input Capacitance C 476 ISS V = 0 V, f = 1 MHz, GS Output Capacitance C 197 OSS V = 15 V DS Reverse Transfer Capacitance C 100 RSS Total Gate Charge Q 4.8 nC G(TOT) Threshold Gate Charge Q 0.4 G(TH) V = 4.5 V, V = 15 V GS DS I = 5.5 A D Gate-to-Source Charge Q 1.54 GS Gate-to-Drain Charge Q 2.15 GD Q V = 10 V, V = 15 V 8.7 nC G(TOT) GS DS I = 5.5 A D SWITCHING CHARACTERISTICS, VGS = 4.5 V (Note 6) ns Turn-On Delay Time t 8.7 d(ON) Rise Time t 14.4 r V = 4.5 V, V = 15 V, GS DD I = 5.5 A, R = 3 D G Turn-Off Delay Time t 9.1 d(OFF) Fall Time t 3.3 f SWITCHING CHARACTERISTICS, VGS = 10 V (Note 6) ns Turn-On Delay Time t 4.1 d(ON) Rise Time t 12.2 r V = 10 V, V = 15 V, GS DD I = 6.1 A, R = 3 D G Turn-Off Delay Time t 11.6 d(OFF) Fall Time t 2.2 f DRAIN-SOURCE DIODE CHARACTERISTICS Forward Diode Voltage V V T = 25C 0.80 1.0 SD J V = 0 V, GS I = 1.65 A S T = 125C 0.67 J 5. Pulse Test: pulse width 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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