Product Information

NVD5802NT4G

NVD5802NT4G electronic component of ON Semiconductor

Datasheet
ON Semiconductor MOSFET DPAK 3W SMT PBF

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 428
Multiples : 428

Stock Image

NVD5802NT4G
ON Semiconductor

428 : USD 0.9065
N/A

Obsolete
0 - WHS 2

MOQ : 1
Multiples : 1

Stock Image

NVD5802NT4G
ON Semiconductor

1 : USD 4.0219
10 : USD 1.6516
100 : USD 1.3228
500 : USD 1.1623
1000 : USD 1.039
2500 : USD 1.0242
5000 : USD 1.0242
10000 : USD 0.9853
25000 : USD 0.9452
N/A

Obsolete
     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Qualification
Series
Brand
Factory Pack Quantity :
Configuration
Transistor Type
Cnhts
Fall Time
Hts Code
Mxhts
Product Type
Rise Time
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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NTD5802N, NVD5802N MOSFET Power, Single, N-Channel, DPAK 40 V, 101 A Features NTD5802N, NVD5802N THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit JunctiontoCase (Drain) R 1.6 C/W JC JunctiontoAmbient Steady State (Note 1) R 60 JA JunctiontoAmbient Steady State (Note 2) R 105 JA 1. Surfacemounted on FR4 board using 1 in sq pad size, 1 oz Cu. 2. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V 40 V V = 0 V, I = 10 A (BR)DSS GS D DraintoSource Breakdown Voltage V /T 40 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, GS V = 40 V DS T = 150C 50 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 250 A 1.5 3.5 V GS(TH) GS DS D Negative Threshold Temperature Co- V /T 7.4 mV/C GS(TH) J efficient DraintoSource On Resistance R V = 10 V, I = 50 A 3.6 4.4 m DS(on) GS D V = 5.0 V, I = 50 A 6.5 7.8 GS D Forward Transconductance gFS V = 15 V, I = 15 A 16.8 S DS D CHARGES AND CAPACITANCES Input Capacitance C 5300 pF iss V = 0 V, f = 1.0 MHz, GS Output Capacitance C 850 oss V = 12 V DS Reverse Transfer Capacitance C 550 rss Input Capacitance C V = 0 V, f = 1.0 MHz, 5025 pF GS iss V = 25 V DS Output Capacitance C 580 oss Reverse Transfer Capacitance C 400 rss Total Gate Charge Q 75 100 nC G(TOT) Threshold Gate Charge Q 6.0 G(TH) V = 10 V, V = 15 V, GS DS I = 50 A D GatetoSource Charge Q 18 GS GatetoDrain Charge Q 15 GD SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 14 ns d(on) Rise Time t 52 r V = 10 V, V = 20 V, GS DS I = 50 A, R = 2.0 D G TurnOff Delay Time t 39 d(off) Fall Time t 8.5 f Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width 300 s, Duty Cycle 2%. 4. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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