LIS302DL

LIS302DL MEMS motion sensor 3-axis - 2g/ 8g smart digital output piccolo accelerometer Feature 2.16 V to 3.6 V supply voltage 1.8 V compatible IOs <1 mW power consumption 2g/ 8g dynamically selectable full-scale 2 LGA 14 (3x5x0.9mm) I C/SPI digital output interface Programmable multiple interrupt generator Click and double click recognition The LIS302DL has dynamically user selectable Embedded high pass filter full scales of 2g/ 8g and it is capable of measuring accelerations with an output data rate Embedded self test of 100 Hz or 400 Hz. 10000g high shock survivability A self-test capability allows the user to check the ECOPACK RoHS and Green compliant functioning of the sensor in the final application. (see Section 9) The device may be configured to generate inertial wake-up/free-fall interrupt signals when a Description programmable acceleration threshold is crossed at least in one of the three axes. Thresholds and The LIS302DL is an ultra compact low-power timing of interrupt generators are programmable three axes linear accelerometer. It includes a by the end user on the fly. sensing element and an IC interface able to provide the measured acceleration to the external The LIS302DL is available in plastic Thin Land 2 world through I C/SPI serial interface. Grid Array package (TLGA) and it is guaranteed to operate over an extended temperature range The sensing element, capable of detecting the from -40 C to +85 C. acceleration, is manufactured using a dedicated process developed by ST to produce inertial The LIS302DL belongs to a family of products sensors and actuators in silicon. suitable for a variety of applications: The IC interface is manufactured using a CMOS Free-fall detection process that allows to design a dedicated circuit Motion activated functions which is trimmed to better match the sensing Gaming and virtual reality input devices element characteristics. Vibration monitoring and compensation Table 1. Device summary Part number Temp range, CPackage Packing LIS302DL -40 to +85 LGA Tray LIS302DLTR -40 to +85 LGA Tape and reel ( 5000 pcs/reel ) LIS302DLTR8 -40 to +85 LGA Tape and reel ( 8000 pcs/reel ) October 2008 Rev 4 1/42 www.st.com 42Contents LIS302DL Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . 10 2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.3 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.3.1 SPI - Serial Peripheral Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.3.2 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.4 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.5.2 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5.3 Self test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 2.5.4 Click and double click recognition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3 Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.1 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2 IC interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1 I2C Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 5.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2.1 SPI Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2.2 SPI Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.2.3 SPI Read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 2/42