X-On Electronics has gained recognition as a prominent supplier of LPS25H Board Mount Pressure Sensors across the USA, India, Europe, Australia, and various other global locations. LPS25H Board Mount Pressure Sensors are a product manufactured by STMicroelectronics. We provide cost-effective solutions for Board Mount Pressure Sensors, ensuring timely deliveries around the world.
We are delighted to provide the LPS25H from our Board Mount Pressure Sensors category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the LPS25H and other electronic components in the Board Mount Pressure Sensors category and beyond.
LPS25H MEMS pressure sensor: 260-1260 hPa absolute digital output barometer Datasheet - production data Applications Altimeter and barometer for portable devices GPS applications Weather Station Equipment Sport Watches Description HCLGA-10L (2.5 x 2.5 x 1.0 mm) The LPS25H is an ultra compact absolute piezoresistive pressure sensor. It includes a monolithic sensing element and an IC interface able to take the information from the sensing element and to provide a digital signal to the external world. Features The sensing element consists of a suspended 260 to 1260 hPa absolute pressure range membrane realized inside a single mono-silicon substrate. It is capable to detect the absolute High-resolution mode: 1 Pa RMS pressure and is manufactured with a dedicated Low power consumption: process developed by ST. Low resolution mode: 4 A The membrane is very small compared to the High resolution mode: 25 A traditionally built silicon micromachined High overpressure capability: 20x full scale membranes. Membrane breakage is prevented Embedded temperature compensation by an intrinsic mechanical stopper. Embedded 24-bit ADC The IC interface is manufactured using a standard CMOS process that allows a high level of Selectable ODR from 1 Hz to 25 Hz integration to design a dedicated circuit which is SPI and IC interfaces trimmed to better match the sensing element Embedded FIFO characteristics. Supply voltage: 1.7 to 3.6 V The LPS25H is available in a cavity holed LGA High shock survivability: 10,000 g package (HCLGA). It is guaranteed to operate over a temperature range extending from -30 C Small and thin package to +105 C. The package is holed to allow ECOPACK lead-free compliant external pressure to reach the sensing element. Table 1. Device summary Order codes Temperature range C Package Packing LPS25HTR Tape and reel HCLGA-10L -30 to +105 HCLGA-10L LPS25H Tray January 2014 DocID023722 Rev 3 1/46 This is information on a product in full production. www.st.comContents LPS25H Contents 1 Block diagram and pin description . 3 1.1 Pin description 3 2 Mechanical and electrical specifications 5 2.1 Mechanical characteristics . 5 2.2 Electrical characteristics . 6 2.3 Communication interface characteristics 7 2.3.1 SPI - serial peripheral interface 7 2.3.2 IC - inter IC control interface 8 2.4 Absolute maximum ratings . 9 3 Functionality 10 3.1 Sensing element 10 3.2 IC interface 10 3.3 Factory calibration 10 3.4 FIFO 11 3.4.1 Bypass mode (F MODE2:0=000 in FIFO CTRL (2Eh)) . 11 3.4.2 FIFO mode (F MODE2:0=001 in FIFO CTRL (2Eh)) . 11 3.4.3 Stream mode (F MODE2:0=010 in FIFO CTRL (2Eh)) . 11 3.4.4 FIFO mean mode (F MODE2:0=110 in FIFO CTRL (2Eh)) 11 4 Application hints . 12 4.1 Soldering information 12 5 Digital interfaces . 13 5.1 IC serial interface 13 5.2 IC serial interface (CS=High) . 13 5.2.1 IC operation . 14 5.3 SPI bus interface . 15 5.3.1 SPI read . 16 5.3.2 SPI write 17 5.3.3 SPI read in 3-wires mode . 18 2/46 DocID023722 Rev 3