ICP-10100, ICP-10101, ICP-10110, ICP-10111 High Accuracy, Low Power, Waterproof Barometric Pressure and Temperature Sensor IC GENERAL INFORMATION FEATURES Pressure operating range: 30 to 110 kPa The ICP-101xx pressure sensor family is based on MEMS Noise and current consumption capacitive technology which provides ultra-low noise at the o 0.4 Pa 10.4 A (ULN mode) lowest power, enabling industry leading relative accuracy, o 0.8 Pa 5.2 A (LN mode) sensor throughput, and temperature stability. The pressure o 3.2 Pa 1.3 A (LP mode) sensor can measure pressure differences with an accuracy of Pressure Sensor Relative Accuracy: 1 Pa for any 1 Pa, an accuracy enabling altitude measurement 10 hPa change over 950 hPa-1050 hPa at 25C differentials as small as 8.5 cm, less than the height of a single Pressure Sensor Absolute Accuracy: 1 hPa over stair step. 950 hPa-1050 hPa, 0C to 65C Consuming only 1.3 A 1 Hz, available in a small footprint 2 Pressure Sensor Temperature Coefficient Offset: mm x 2 mm x 0.72 mm waterproof to 1.5m depth 10-pin LGA 0.5 Pa/C over 25C to 45C at 100 kPa package (ICP-10100), the ICP-101xx is ideally suited for Temperature Sensor Absolute Accuracy: 0.4 C mobile phones, wearable fitness monitoring, drones, and IPx8: Waterproof to 1.5m depth (ICP-10100 & ICP- battery powered IoT. 10110) The ICP-101xx offers an industry leading temperature Temperature operating range: -40 C to 85 C 2 coefficient offset of 0.5 Pa/ C. The combination of high Host Interface: I C at up to 400 kHz accuracy, low power, temperature stability, waterproofing in Single Supply voltage: 1.8V 5% a small footprint enables higher performance barometric RoHS and Green compliant pressure sensing for sports activity identification, mobile indoor/outdoor navigation, and altitude-hold in drones. DEVICE INFORMATION PART PACKAGE LID OPENING NUMBER 3-Hole IPx8 Lid Opening 1-Hole Lid Opening ICP-10100 2x2x0.72mm LGA-10L 3-Hole, IPx8: 1.5m Waterproof ICP-10100 & ICP-10110 ICP-10101 & ICP-10111 ICP-10101 2x2x0.72mm LGA-10L 1-Hole ICP-10110 2x2.5x0.92mm LGA-8L 3-Hole, IPx8: 1.5m Waterproof TYPICAL OPERATING CIRCUIT ICP-10111 2x2.5x0.92mm LGA-8L 1-Hole Denotes RoHS and Green-Compliant Package BLOCK DIAGRAMS AP/HUB I2C ICP-101xx APPLICATIONS Altitude Control of Drones and Flying Toys Mobile Phones Virtual Reality and Gaming Equipment Indoor/Outdoor Navigation (dead-reckoning, floor/elevator/step detection) Vertical velocity monitoring Leisure, Sports, and Fitness Activity Identification Weather Forecasting TDK Corporation InvenSense reserves the right to change the detail Document Number: DS-000186 1745 Technology Drive, San Jose, CA 95110 U.S.A specifications as may be required to permit Revision: 1.0 +1(408) 9887339 improvements in the design of its products. Release Date: 01/02/2018 www.invensense.com ICP-10100, ICP-10101, ICP-10110, ICP-10111 TABLE OF CONTENTS GENERAL INFORMATION ............................................................................................................................................................................... 1 DEVICE INFORMATION ................................................................................................................................................................................. 1 APPLICATIONS ............................................................................................................................................................................................ 1 FEATURES .................................................................................................................................................................................................. 1 TYPICAL OPERATING CIRCUIT ......................................................................................................................................................................... 1 1 INTRODUCTION ......................................................................................................................................................................... 5 1.1 PURPOSE AND SCOPE ....................................................................................................................................................................... 5 1.2 PRODUCT OVERVIEW ....................................................................................................................................................................... 5 2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS .......................................................................................................... 6 2.1 OPERATION RANGES ........................................................................................................................................................................ 6 2.2 OPERATION MODES ........................................................................................................................................................................ 6 2.3 PRESSURE SENSOR SPECIFICATIONS .................................................................................................................................................... 7 2.4 TEMPERATURE SENSOR SPECIFICATIONS .............................................................................................................................................. 7 2.5 RECOMMENDED OPERATION CONDITIONS ........................................................................................................................................... 7 3 ELECTRICAL SPECIFICATIONS ...................................................................................................................................................... 8 3.1 ELECTRICAL CHARACTERISTICS ........................................................................................................................................................... 8 3.2 ABSOLUTE MAXIMUM RATINGS ......................................................................................................................................................... 9 3.3 SENSOR SYSTEM TIMING .................................................................................................................................................................. 9 2 3.4 I C TIMING CHARACTERIZATION ....................................................................................................................................................... 10 4 APPLICATIONS INFORMATION ................................................................................................................................................. 11 4.1 INTERFACE SPECIFICATIONS ............................................................................................................................................................. 11 4.2 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .................................................................................................................................... 11 ICP-10100 and ICP-10101: 2x2x0.72mm 10-pin LGA ....................................................................................................................... 11 ICP-10110 and ICP-10111: 2x2.5x0.92 mm 8-pin LGA ..................................................................................................................... 12 4.3 TYPICAL OPERATING CIRCUIT ........................................................................................................................................................... 13 4.4 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ............................................................................................................................... 15 5 OPERATION AND COMMUNICATION ....................................................................................................................................... 16 5.1 POWER-UP AND COMMUNICATION START ......................................................................................................................................... 16 5.2 MEASUREMENT COMMANDS .......................................................................................................................................................... 16 5.3 STARTING A MEASUREMENT ........................................................................................................................................................... 16 5.4 SENSOR BEHAVIOR DURING MEASUREMENT ...................................................................................................................................... 16 5.5 READOUT OF MEASUREMENT RESULTS.............................................................................................................................................. 16 5.6 SOFT RESET ................................................................................................................................................................................. 17 5.7 READ-OUT OF ID REGISTER ............................................................................................................................................................. 17 5.8 CHECKSUM CALCULATION ............................................................................................................................................................... 17 5.9 CONVERSION OF SIGNAL OUTPUT ..................................................................................................................................................... 18 5.10 READ-OUT OF CALIBRATION PARAMETERS ......................................................................................................................................... 19 5.11 SAMPLE CODE: EXAMPLE C SYNTAX .................................................................................................................................................. 19 5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ...................................................................................................... 21 5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ............................................................................................. 22 5.14 COMMUNICATION DATA SEQUENCES ................................................................................................................................................ 22 6 ASSEMBLY ................................................................................................................................................................................ 24 6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS ........................................................................................................................... 24 Soldering .......................................................................................................................................................................................... 24 Chemical Exposure and Sensor Protection ....................................................................................................................................... 24 Document Number: DS-000186 Page 2 of 33 Revision: 1.0