Product Information

GT50J325(Q)

GT50J325(Q) electronic component of Toshiba

Datasheet
Trans IGBT Chip N-CH 600V 50A 3-Pin(3+Tab) TO-3P(LH)

Manufacturer: Toshiba
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

4: USD 7.0097 ea
Line Total: USD 28.04

0 - Global Stock
MOQ: 4  Multiples: 4
Pack Size: 4
Availability Price Quantity
0 - WHS 1


Ships to you between Tue. 21 May to Mon. 27 May

MOQ : 4
Multiples : 4

Stock Image

GT50J325(Q)
Toshiba

4 : USD 7.0097
10 : USD 6.4302
50 : USD 6.3016

     
Manufacturer
Product Category
Configuration
Collector Current Dc Max
Collector-Emitter Voltage
Mounting
Package Type
Pin Count
Operating Temperature Max
Operating Temperature Min
Operating Temperature Classification
Channel Type
Gate To Emitter Voltage Max
Rad Hardened
Deleted
Collector Current Dc
LoadingGif

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GT50J325 TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT50J325 High Power Switching Applications Unit: mm Fast Switching Applications Fourth generation IGBT Enhancement mode type Fast switching (FS): Operating frequency up to 50 kHz (reference) High speed: t = 0.05 s (typ.) f Low switching loss : E = 1.30 mJ (typ.) on : E = 1.34 mJ (typ.) off Low saturation Voltage: V = 2.0 V (typ.) CE (sat) FRD included between emitter and collector Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Collector-emitter voltage V 600 V CES Gate-emitter voltage V 20 V GES DC I 50 C Collector current A 1 ms I 100 JEDEC CP DC I 50 F Emitter-collector forward JEITA A current 1 ms I 100 FM TOSHIBA 2-21F2C Collector power dissipation P 240 W C (Tc = 25C) Weight: 9.75 g Junction temperature T 150 C j Storage temperature range T 55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Thermal Characteristics Characteristics Symbol Max Unit Thermal resistance (IGBT) R 0.521 C/W th (j-c) Thermal resistance (diode) R 2.30 C/W th (j-c) Equivalent Circuit Marking Part No. (or abbreviation code) Collector TOSHIBA GT50J325 Lot No. Gate JAPAN A line indicates Emitter lead (Pb)-free package or lead (Pb)-free finish. 1 2006-11-01 GT50J325 Electrical Characteristics (Ta = 25C) Characteristics Symbol Test Condition Min Typ. MaxUnit Gate leakage current I V = 20 V, V = 0 500 nA GES GE CE Collector cut-off current I V = 600 V, V = 0 1.0 mA CES CE GE Gate-emitter cut-off voltage V I = 5 mA, V = 5 V 3.5 6.5 V GE (OFF) C CE Collector-emitter saturation voltage V I = 50 A, V = 15 V 2.0 2.45 V CE (sat) C GE Input capacitance C V = 10 V, V = 0, f = 1 MHz 7900 pF ies CE GE Turn-on delay time t 0.09 d (on) Rise time t 0.07 r Turn-on time t 0.24 on Inductive load Switching time s Turn-off delay time t V = 300 V, I = 50 A 0.30 d (off) CC C V = +15 V, R = 13 GG G Fall time t 0.05 f (Note 1) Turn-off time t 0.43 off (Note 2) Turn-on switching E 1.30 on loss Switching loss mJ Turn-off switching E 1.34 off loss Peak forward voltage V I = 50 A, V = 0 4.2 V F F GE Reverse recovery time t I = 50 A, di/dt = 100 A/s 65 ns rr F Note 1: Switching time measurement circuit and input/output waveforms V GE 90% 10% 0 V GE I L C I V C CC 90% 90% R G V CE V 10% 10% 10% 10% CE 0 t t d (off) d (on) t f t r t t off on Note 2: Switching loss measurement waveforms V GE 90% 10% 0 I C V 5% CE 0 E E off on 2 2006-11-01

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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TS4

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