TCR2LN11,LF(SE Toshiba

TCR2LN series TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic TCR2LN series Ultra low quiescent current 200 mA CMOS Low Dropout Regulator in ultra small package The TCR2LN series are CMOS general purpose single output voltage regulators with an on/off control input, featuring ultra low quiescent bias current and low dropout voltage. These voltage regulators are available in fixed output voltages between 0.8 V and 3.6 V and capable of driving up to 200 mA. They feature overcurrent protection and auto-discharge option. The TCR2LN series is offered in the ultra small plastic mold package SDFN4/SDFN4E (0.8 mm x 0.8 mm x 0.38 mm) and has a low dropout voltage of 250 mV (2.5 V output, I = 150 mA). As small ceramic input and OUT output capacitors 0.1 F can be used with the TCR2LN series, these devices are ideal for portable applications that require high-density board SDFN4/SDFN4E assembly such as cellular phones. Weight : 0.6 mg ( typ.) Features Low quiescent bias current (I = 2 A (max) at I = 0 mA, T = -40 to 85 C) B OUT j Low dropout voltage V = 250 mV (typ.) at 2.5 V-output, I = 150 mA DO OUT Wide range output voltage line up (V = 0.8 to 3.6 V) OUT High VOUT accuracy 1.0 % (1.8 V VOUT) Overcurrent protection Auto-discharge Pull down connection between CONTROL and GND Ceramic capacitors can be used (C = 0.1 F, C = 0.1 F) IN OUT Ultra small package SDFN4 (0.8 mm x 0.8 mm x 0.38 mm) Start of commercial production 2014-08 2021 2021-08-31 1 Toshiba Electronic Devices & Storage Corporation TCR2LN series Absolute Maximum Ratings (Ta = 25C) Characteristics Symbol Rating Unit Input voltage V 6.0 V IN Control voltage V -0.3 to 6.0 V CT Output voltage V -0.3 to V + 0.3 V OUT IN Output current I 200 mA OUT Power dissipation P 300 (Note1) mW D Operating temperature range T 40 to 85 C opr Junction temperature T 150 C j Storage temperature range T 55 to 150 C stg Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (Handling Precautions/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note1: Rating at mounting on a board Glass epoxy (FR4) board dimension: 40 mm x 40 mm (both sides of board) t = 1.6 mm Metal pattern ratio: a surface approximately 50 %, the reverse side approximately 50 % Through hole hall: diameter 0.5 mm x 24 Pin Assignment (top view) V IN CONTROL 4 3 * 1 2 V OUT GND *Center electrode should be connected to GND or Open 2021 2021-08-31 2 Toshiba Electronic Devices & Storage Corporation