Si1441EDH www.vishay.com Vishay Siliconix P-Channel 20 V (D-S) MOSFET FEATURES SC-70 (6 leads) SOT-363 Single TrenchFET power MOSFET S 4 Typical ESD performance 1500 V D 5 100 % R tested g D 6 Material categorization: for definitions of compliance please see www.vishay.com/doc 99912 3 G S APPLICATIONS 2 D Load switch for portable devices 1 D - Cellular phone Top View - DSC Marking code: BQ - Portable game console G - MP3 R PRODUCT SUMMARY - GPS V (V) -20 DS R max. ( ) at V = -4.5 V 0.041 DS(on) GS R max. ( ) at V = -2.5 V 0.054 DS(on) GS D R max. ( ) at V = -1.8 V 0.100 P-Channel MOSFET DS(on) GS Q typ. (nC) 12.5 g a I (A) -4 D Configuration Single ORDERING INFORMATION Package SC-70 Lead (Pb)-free and halogen-free Si1441EDH-T1-GE3 ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-source voltage V -20 DS V Gate-source voltage V 10 GS a T = 25 C -4 C T = 70 C -4 C Continuous drain current (T = 150 C) I J D a, b, c T = 25 C -4 A a, b, c T = 70 C -4 A A Pulsed drain current (t = 300 s) I -25 DM T = 25 C -2.3 C Continuous source-drain diode current I S b, c T = 25 C -1.3 A T = 25 C 2.8 C T = 70 C 1.8 C Maximum power dissipation P W D b, c T = 25 C 1.6 A b, c T = 70 C 1 A Operating junction and storage temperature range T , T -55 to +150 J stg C Soldering recommendations (peak temperature) 260 THERMAL RESISTANCE RATINGS PARAMETER SYMBOL TYPICAL MAXIMUM UNIT b, d Maximum junction-to-ambient t 5 s R 60 80 thJA C/W Maximum junction-to-foot (drain) Steady state R 34 45 thJF Notes a. Package limited b. Surface mounted on 1 x 1 FR4 board c. t = 5 s d. Maximum under steady state conditions is 125 C/W S10-1827-Rev. A, 09-Aug-10 Document Number: 66823 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 Si1441EDH www.vishay.com Vishay Siliconix SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN.TYP.MAX.UNIT Static Drain-source breakdown voltage V V = 0 V, I = -250 A -20 - - V DS GS D V temperature coefficient V /T --11 - DS DS J I = -250 A mV/C D V temperature coefficient V /T -2.6 - GS(th) GS(th) J Gate-source threshold voltage V V = V , I = -250 A -0.4 - -1 V GS(th) DS GS D V = 0 V, V = 10 V - - 8 DS GS Gate-source leakage I GSS V = 0 V, V = 4.5 V - - 1 DS GS A V = -20 V, V = 0 V - - -1 DS GS Zero gate voltage drain current I DSS V = -20 V, V = 0 V, T = 55 C - - -10 DS GS J a On-state drain current I V -5 V, V = -10 V -15 - - A D(on) DS GS V = -4.5 V, I = -5 A - 0.034 0.041 GS D a Drain-source on-state resistance R V = -2.5 V, I = -4.4 A - 0.045 0.054 DS(on) GS D V = -1.8 V, I = -1 A - 0.067 0.100 GS D a Forward transconductance g V = -10 V, I = -5 A - 16 - S fs DS D b Dynamic V = -10 V, V = -8 V, I = -5 A - 22 33 DS GS D Total gate charge Q g - 12.5 19 nC Gate-source charge Q V = -10 V, V = -4.5 V, I = -5 A -1.8 - gs DS GS D Gate-drain charge Q -3.3 - gd Gate resistance R f = 1 MHz 80 430 860 g Turn-on delay time t - 150 225 d(on) Rise time t - 300 450 r V = -10 V, R = 1.4 DD L I -4 A, V = -4.5 V, R = 1 Turn-off delay time t -D GEN g16202430 d(off) Fall time t - 560 840 f ns Turn-on delay time t - 50 100 d(on) Rise time t - 90 180 r V = -10 V, R = 1.4 DD L I -4 A, V = -10 V, R = 1 Turn-off delay time t -D GEN g25003750 d(off) Fall time t - 600 900 f Drain-Source Body Diode Characteristics Continuous source-drain diode current I T = 25 C - - -2.3 S C A Pulse diode forward current I -- -25 SM Body diode voltage V I = -4 A, V = 0 V - -0.85 -1.2 V SD S GS Body diode reverse recovery time t -18 36 ns rr Body diode reverse recovery charge Q - 8 16 nC rr I = -4 A, di/dt = 100 A/s, F T = 25 C Reverse recovery fall time t J -18- a ns Reverse recovery rise time t -10- b Notes a. Pulse test pulse width 300 s, duty cycle 2 % b. Guaranteed by design, not subject to production testing Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S10-1827-Rev. A, 09-Aug-10 Document Number: 66823 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000