3.3 mm Si7121ADN www.vishay.com Vishay Siliconix P-Channel 30 V (D-S) MOSFET FEATURES PRODUCT SUMMARY TrenchFET Power MOSFET V (V) R ( ) MAX. I (A) Q (TYP.) DS DS(on) D g Low thermal resistance PowerPAK package e 0.0150 at V = -10 V -18 GS e 100 % R and UIS tested g -30 0.0200 at V = -6 V -18 16 nC GS e 0.0260 at V = -4.5 V -18 Material categorization: GS For definitions of compliance please see www.vishay.com/doc 99912 PowerPAK 1212-8 Single D APPLICATIONS D 8 D 7 Notebook computers and mobile D 6 S 5 computing - Adaptor switch / Load switch - Battery management G 11 - Power management 2 SS 3 S 4 S 1 G Top View Bottom View D Ordering Information: P-Channel MOSFET Si7121ADN-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS (T = 25 C, unless otherwise noted) A PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V -30 DS V Gate-Source Voltage V 25 GS e T = 25 C -18 C e T = 70 C -18 C Continuous Drain Current (T = 150 C) I J D a,b T = 25 C -12 A a,b T = 70 C -9.6 A A Pulsed Drain Current (t = 100 s) I -50 DM e T = 25 C -18 C Continuous Source-Drain Diode Current I S a,b T = 25 C -2.9 A Avalanche Current I -14 AS L = 0.1 mH Single-Pulse Avalanche Energy E 9.8 mJ AS T = 25 C 27.8 C T = 70 C 17.8 C Maximum Power Dissipation P W D a,b T = 25 C 3.5 A a,b T = 70 C 2.2 A Operating Junction and Storage Temperature Range T , T -50 to 150 J stg C c,d Soldering Recommendations (Peak Temperature) 260 Notes a. Surface mounted on 1 x 1 FR4 board. b. t = 10 s. c. See solder profile (www.vishay.com/doc 73257). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection. d. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components. e. Package limited. S13-2638-Rev. A, 30-Dec-13 Document Number: 62930 1 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000 3.3 mmSi7121ADN www.vishay.com Vishay Siliconix THERMAL RESISTANCE RATINGS PARAMETER SYMBOLTYPICALMAXIMUMUNIT a,b Maximum Junction-to-Ambient t 10 s R 29 36 thJA C/W Maximum Junction-to-Case (Drain) Steady State R 3.3 4.5 thJC Notes a. Surface mounted on 1 x 1 FR4 board. b. Maximum under steady state conditions is 81 C/W. SPECIFICATIONS (T = 25 C, unless otherwise noted) J PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Static Drain-Source Breakdown Voltage V V = 0 V, I = -250 A -30 - - V DS GS D V Temperature Coefficient V /T --23 - DS DS J I = -250 A mV/C D V Temperature Coefficient V /T -4.8 - GS(th) GS(th) J Gate-Source Threshold Voltage V V = V , I = -250 A -1.2 - -2.5 V GS(th) DS GS D Gate-Source Leakage I V = 0 V, V = 25 V - - 100 nA GSS DS GS V = -30 V, V = 0 V - - -1 DS GS Zero Gate Voltage Drain Current I A DSS V = -30 V, V = 0 V, T = 55 C - - -10 DS GS J a On-State Drain Current I V -5 V, V = -10 V -20 - - A D(on) DS GS V = -10 V, I = -7 A - 0.0125 0.0150 GS D a Drain-Source On-State Resistance R V = -6 V, I = -5 A - 0.0160 0.0200 DS(on) GS D V = -4.5 V, I = -3 A - 0.0210 0.0260 GS D a Forward Transconductance g V = -15 V, I = -7 A - 52 - S fs DS D b Dynamic Input Capacitance C -1870 - iss Output Capacitance C V = -15 V, V = 0 V, f = 1 MHz -245 - pF oss DS GS Reverse Transfer Capacitance C -212 - rss V = -15 V, V = -10 V, I = -12 A - 33 50 DS GS D Total Gate Charge Q g -16 25 nC Gate-Source Charge Q V = -15 V, V = -4.5 V, I = -12 A -5.6 - gs DS GS D Gate-Drain Charge Q -5.5- gd Gate Resistance R f = 1 MHz 0.64 3.2 6.4 g Turn-On Delay Time t -38 57 d(on) Rise Time t -34 51 V = -15 V, R = 1.6 r DD L I -9.6 A, V = -4.5 V, R = 1 Turn-Off DelayTime t -2D GEN g436 d(off) Fall Time t -10 20 f ns Turn-On Delay Time t -8 16 d(on) Rise Time t -9 18 r V = -15 V, R = 1.6 DD L I -9.6 A, V = -10 V, R = 1 Turn-Off DelayTime t -2D GEN g233 d(off) Fall Time t -7 14 f Drain-Source Body Diode Characteristics c Continuous Source-Drain Diode Current I T = 25 C - - -18 S C A d Pulse Diode Forward Current I -- -50 SM Body Diode Voltage V I = -9.6 A - -0.8 -1.2 V SD F Body Diode Reverse Recovery Time t -21 32 ns rr Body Diode Reverse Recovery Charge Q -12 20 nC rr I = -9.6 A, dI/dt = 100 A/s, T = 25 C F J Reverse Recovery Fall Time t -11 - a ns Reverse Recovery Rise Time t -10 - b Notes a. Pulse test pulse width 300 s, duty cycle 2 %. b. Guaranteed by design, not subject to production testing. c. Package limited. d. t = 100 s. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. S13-2638-Rev. A, 30-Dec-13 Document Number: 62930 2 For technical questions, contact: pmostechsupport vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc 91000