Product Information

W25M121AVEIT

W25M121AVEIT electronic component of Winbond

Datasheet
Multichip Packages 1Gb Serial NAND flash 3V + 128Mb Serial Flash 3V MCP
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock

MOQ : 1
Multiples : 1

Stock Image

W25M121AVEIT
Winbond

1 : USD 7.5247
10 : USD 5.4763
25 : USD 5.3663
50 : USD 5.3296
100 : USD 4.6662
252 : USD 4.3959
1008 : USD 4.3019
2520 : USD 4.3019
N/A

Obsolete

Read More Specifications

     
Manufacturer
Product Category
Type
Memory Size
Package / Case
Series
Mounting Style
Maximum Clock Frequency
Minimum Operating Temperature
Maximum Operating Temperature
Hts Code
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.

More Products By Manufacturer "Winbond"

Image Description
W9712G6KB25I electronic component of Winbond W9712G6KB25I

DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 255

W9825G6KH-6 electronic component of Winbond W9825G6KH-6

IC SDRAM 256MBIT 166MHZ 54TSOP
Stock : 5270

W9712G6KB-25 electronic component of Winbond W9712G6KB-25

DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 48

Hot W9425G6KH-5 electronic component of Winbond W9425G6KH-5

4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 3436

W9412G6KH-5I electronic component of Winbond W9412G6KH-5I

DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 284

W9412G6KH-5 electronic component of Winbond W9412G6KH-5

DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 412

W9864G6KH-6 electronic component of Winbond W9864G6KH-6

DRAM Chip SDRAM 64Mbit 4Mx16 3.3V 54-Pin TSOP-II
Stock : 11

W9816G6JH-7 electronic component of Winbond W9816G6JH-7

DRAM 16M SDR SDRAM 133MHz
Stock : 685

W956D8MBKX5I electronic component of Winbond W956D8MBKX5I

DRAM 64Mb HyperRAM x8 200MHz Ind temp 1.8V
Stock : 0

W9751G8NB-25 electronic component of Winbond W9751G8NB-25

DRAM 512Mb DDR2-800, x8
Stock : 0

More Products By Category "Multichip Packages"

Image Description
S71VS128RC0AHK4L0 electronic component of Infineon S71VS128RC0AHK4L0

Multichip Packages Nor
Stock : 0

S71VS064RB0AHT4L0 electronic component of Infineon S71VS064RB0AHT4L0

Multichip Packages Nor
Stock : 490

S71VS128RB0AHK4L0 electronic component of Infineon S71VS128RB0AHK4L0

Multichip Packages Nor
Stock : 0

MT29RZ2B2DZZHHTB-18I.88F TR electronic component of Micron MT29RZ2B2DZZHHTB-18I.88F TR

Multichip Packages MASSFLASH/LPDDR2 4G
Stock : 999

MT29C1G12MAAJVAMD-5 IT TR electronic component of Micron MT29C1G12MAAJVAMD-5 IT TR

Multichip Packages MASSFLASH/MOBILE DDR 1.5G
Stock : 0

MT29RZ2B1DZZHGWD-18I.83G TR electronic component of Micron MT29RZ2B1DZZHGWD-18I.83G TR

Multichip Packages MASSFLASH/LPDDR2 3G
Stock : 0

W25M512JVEIQ electronic component of Winbond W25M512JVEIQ

Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 120

W25M02GWZEIG electronic component of Winbond W25M02GWZEIG

Multichip Packages 2G-bit Serial NAND flash, 1.8V
Stock : 0

W25M161AVEIT electronic component of Winbond W25M161AVEIT

Multichip Packages 1Gb Serial NAND flash 3V + 16Mb Serial Flash 3V MCP
Stock : 3968

W25M512JVEIQ TR electronic component of Winbond W25M512JVEIQ TR

Multichip Packages spiFlash, 512M-bit, 4Kb Uniform Sector
Stock : 4217

Additional Infomation About Product

W25M121AV Featuring SERIAL MCP FLASH MEMORY With Multi I/O SPI & Concurrent Operations 3V 128M-bit Serial NOR Flash Memory & 3V 1G-bit Serial NAND Flash Memory Publication Release Date: August 21, 2017 Preliminary Revision A W25M121AV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 2 2. FEATURES ....................................................................................................................................... 3 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 4 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 4 3.2 Pad Description WSON 8x6-mm .......................................................................................... 4 4. DEVICE CONFIGURATION & PIN DESCRIPTIONS ....................................................................... 5 4.1 Serial MCP (SpiStack ) Device Configuration ..................................................................... 5 4.2 Chip Select (/CS) .................................................................................................................. 5 4.3 Serial Input & Output (DI, DO and IO0, IO1, IO2, IO3) ........................................................ 5 4.4 Serial Clock (CLK) ................................................................................................................ 6 5. CONCURRENT OPERATION DESCRIPTIONS .............................................................................. 6 6. SOFTWARE DIE SELECT (C2H) INSTRUCTION ........................................................................... 7 7. SOFTWARE RESET ........................................................................................................................ 8 7.1.1 Enable Reset (66h) and Reset Device (99h) .......................................................................... 9 7.1.2 Device Reset (FFh) ................................................................................................................. 9 8. PACKAGE SPECIFICATIONS ....................................................................................................... 10 8.1 8-Pad WSON 8x6-mm (Package Code E) ......................................................................... 10 9. ORDERING INFORMATION .......................................................................................................... 11 9.1 Valid Part Numbers and Top Side Marking ........................................................................ 12 10. REVISION HISTORY ...................................................................................................................... 13 - 1 -

HS Compliance

Tariff Desc

8542.32.00 31 No ..Random Access Memory (RAM) including Single Inline Memory Modules (SIMMS), Dual Inline Memory Modules (DIMMS), Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random Access Memory (SD RAM), Rambus Dynamic Random Access Memory (RD RAM) and other similar memory

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

Resources

Company

Support

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
  +61 8 9358 9358 |   sales@x-on.com.au |   Chat
 
Policies | Terms and Conditions | Sitemap

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted