W25N02KVSFIR TR Winbond

W25N02KVSFIR TR electronic component of Winbond
W25N02KVSFIR TR Winbond
W25N02KVSFIR TR NAND Flash
W25N02KVSFIR TR  Semiconductors
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X-On Electronics has gained recognition as a prominent supplier of W25N02KVSFIR TR NAND Flash across the USA, India, Europe, Australia, and various other global locations. W25N02KVSFIR TR NAND Flash are a product manufactured by Winbond. We provide cost-effective solutions for NAND Flash, ensuring timely deliveries around the world.

Part No. W25N02KVSFIR TR
Manufacturer: Winbond
Category: NAND Flash
Description: NAND Flash 2G-bit Serial NAND flash, 3V
Datasheet: W25N02KVSFIR TR Datasheet (PDF)
Price (USD)
N/A

Obsolete

Availability 0
MOQ : 1000
Multiples : 1000
QtyUnit Price
1000$ 4.5487
2000$ 4.5252
N/A

Obsolete
   
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We are delighted to provide the W25N02KVSFIR TR from our NAND Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25N02KVSFIR TR and other electronic components in the NAND Flash category and beyond.

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W25N02KVxxIR/U 3V 2G-BIT SLC QSPINAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & SEQUENTIAL READ Publication Release Date: June 25, 2021 Revision G W25N02KVxxIR/U Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm .......................................................................................... 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.4 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP) ............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Device Operation Flow ....................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 Hold Function ........................................................................................................................ 12 6.2 Write Protection .................................................................................................................. 13 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 14 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 14 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) Volatile Writable, OTP lockable .................. 14 7.1.2 Write Protection Enable Bit (WP-E) Volatile Writable, OTP lockable ................................. 15 7.1.3 Status Register Protect Bits (SRP1, SRP0) Volatile Writable, OTP lockable ..................... 15 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 16 7.2.1 One Time Program Lock Bit (OTP-L) OTP lockable .......................................................... 16 7.2.2 Enter OTP Access Mode Bit (OTP-E) Volatile Writable ..................................................... 16 7.2.3 Status Register-1 Lock Bit (SR1-L) OTP lockable ............................................................. 16 7.2.4 ECC Enable Bit (ECC-E) Volatile Writable ......................................................................... 17 7.2.5 Output Driver Strength (ODS-1, ODS-0) Volatile Writable ................................................. 19 7.2.6 Hold Disable (H-DIS) Volatile Writable............................................................................... 19 7.2.7 Buffer Read / Sequential Read Mode Bit (BUF) Volatile Writable ...................................... 19 7.3 Status Register-3 (Status Only) .......................................................................................... 20 7.3.1 Cumulative ECC Status (ECC-1, ECC-0) Status Only ....................................................... 20 7.3.2 Program Failure (P-FAIL) Status Only ............................................................................... 21 7.3.3 Erase Failure (E-FAIL) Status Only ................................................................................... 21 7.3.4 Write Enable Latch (WEL) Status Only .............................................................................. 21 7.3.5 Erase/Program In Progress (BUSY) Status Only ............................................................... 21 7.4 Extended internal ECC feature registers ............................................................................ 22 7.4.1 ECC Bit Flip Count Detection (BFD) Volatile Writable ....................................................... 22 Publication Release Date: June 25, 2021 - 1 - Revision G

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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