Product Information

W29N01HZDINA

W29N01HZDINA electronic component of Winbond

Datasheet
NAND Flash 1G-bit NAND flash 1.8V 1-bit ECC x8
Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.2045 ea
Line Total: USD 2.2

0 - Global Stock
MOQ: 1  Multiples: 1
Pack Size: 1

 More Buying Options & Price Grid(s)

Availability Price Quantity
0 - Global Stock


Ships to you between Fri. 26 Apr to Thu. 02 May

MOQ : 1
Multiples : 1

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W29N01HZDINA
Winbond

1 : USD 0.3146
10 : USD 0.3095
25 : USD 0.3045
50 : USD 0.2992
100 : USD 0.2933
250 : USD 0.2933
500 : USD 0.2933

0 - Global Stock


Ships to you between Thu. 02 May to Mon. 06 May

MOQ : 260
Multiples : 260

Stock Image

W29N01HZDINA
Winbond

260 : USD 3.082
520 : USD 3.059
2600 : USD 3.0475
5200 : USD 2.9325
10140 : USD 2.9325

Read More Specifications

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Mounting Style
Package / Case
Series
Memory Size
Interface Type
Organisation
Data Bus Width
Supply Voltage - Min
Supply Voltage - Max
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Brand
Moisture Sensitive
Product Type
Factory Pack Quantity :
Subcategory
LoadingGif

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Additional Infomation About Product

W29N01HZ/W W29N01HZ/W 1G-BIT 1.8V NAND FLASH MEMORY th Release Date: January, 11 , 2018 1 Revision C W29N01HZ/W Table of Contents 1. GENERAL DESCRIPTION ............................................................................................................... 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7 3.1 Pin assignment 48 pin TSOP1 (x8) ...................................................................................... 7 3.2 Pin assignment 48 ball VFBGA (x8) ..................................................................................... 8 3.3 Pin assignment 48 ball VFBGA (x16) ................................................................................... 9 3.4 Pin assignment 63 ball VFBGA (x8) ................................................................................... 10 3.5 Pin assignment 63 ball VFBGA (x16) ................................................................................. 11 3.6 Pin Descriptions .................................................................................................................. 12 4. PIN DESCRITPIONS ...................................................................................................................... 13 4.1 Chip Enable ( CE) .............................................................................................................. 13 4.2 Write Enable ( WE) ............................................................................................................ 13 4.3 Read Enable ( RE) ............................................................................................................ 13 4.4 Address Latch Enable (ALE) .............................................................................................. 13 4.5 Command Latch Enable (CLE) .......................................................................................... 13 4.6 Write Protect ( WP) ............................................................................................................ 13 4.7 Ready/Busy (RY/ BY) ........................................................................................................ 13 4.8 Input and Output (I/Ox) ....................................................................................................... 13 5. BLOCK DIAGRAM .......................................................................................................................... 14 6. MEMORY ARRAY ORGANIZATION .............................................................................................. 15 6.1 Array Organization (x8) ...................................................................................................... 15 6.2 Array Organization (x16) .................................................................................................... 16 7. MODE SELECTION TABLE ........................................................................................................... 17 8. COMMAND TABLE......................................................................................................................... 18 9. DEVICE OPERATIONS .................................................................................................................. 19 9.1 READ operation .................................................................................................................. 19 9.1.1 PAGE READ (00h-30h)......................................................................................................... 19 9.1.2 RANDOM DATA OUTPUT (05h-E0h) ................................................................................... 20 9.1.3 READ ID (90h) ...................................................................................................................... 20 9.1.4 READ PARAMETER PAGE (ECh) ....................................................................................... 21 9.1.5 READ STATUS (70h)............................................................................................................ 23 9.2 PROGRAM operation ......................................................................................................... 25 9.2.1 PAGE PROGRAM (80h-10h) ................................................................................................ 25 9.2.2 SERIAL DATA INPUT (80h) .................................................................................................. 25 9.2.3 RANDOM DATA INPUT (85h) .............................................................................................. 26 9.3 COPY BACK operation....................................................................................................... 27 9.3.1 READ for COPY BACK (00h-35h) ........................................................................................ 27 9.3.2 PROGRAM for COPY BACK (85h-10h) ................................................................................ 27 9.4 BLOCK ERASE operation .................................................................................................. 29 9.4.1 BLOCK ERASE (60h-D0h) .................................................................................................... 29 9.5 RESET operation ................................................................................................................ 30 9.5.1 RESET (FFh) ........................................................................................................................ 30 9.6 WRITE PROTECT .............................................................................................................. 31 th Release Date: January, 11 , 2018 2 Revision C

HS Compliance

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)

Winbond may also be referenced as

Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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