W25Q16JWSNIME Winbond

W25Q16JWSNIME electronic component of Winbond Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q16JWSNIME NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q16JWSNIME NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q16JWSNIME
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash 1.8V 16M-bit 4Kb Uniform Sector
Datasheet: W25Q16JWSNIME Datasheet (PDF)
Price (USD)
1: USD 0.6875 ea
Line Total: USD 0.69 
Availability : 788
  
Ship by Wed. 19 Nov to Fri. 21 Nov
QtyUnit Price
1$ 0.6875
10$ 0.6725
25$ 0.5544
100$ 0.4873
250$ 0.473
500$ 0.4719
1000$ 0.4598
2500$ 0.4499
5000$ 0.418

Availability 788
Ship by Wed. 19 Nov to Fri. 21 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.6875
10$ 0.6725
25$ 0.5544
100$ 0.4873
250$ 0.473
500$ 0.4719
1000$ 0.4598
2500$ 0.4499
5000$ 0.418

   
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Product Category
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We are delighted to provide the W25Q16JWSNIME from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q16JWSNIME and other electronic components in the NOR Flash category and beyond.

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W25Q16JW 1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: January 15, 2020 -Revision D W25Q16JW Table of Contents GENERAL DESCRIPTIONS ........................................................................................................ 4 FEATURES ................................................................................................................................. 4 PACKAGE TYPES AND PIN CONFIGURATIONS ....................................................................... 5 3.1 Pin Configuration SOIC 150-mil / 208-mil ......................................................................... 5 3.2 Pad Configuration WSON 6x5-mm, XSON2x3-mm........................................................... 5 3.3 Pin Description SOIC 150/208-mil, WSON 6x5-mm, XSON2x3-mm ................................. 5 3.4 Ball Configuration WLCSP ............................................................................................... 6 3.5 Ball Description WLCSP................................................................................................... 6 PIN DESCRIPTIONS ................................................................................................................... 7 4.1 Chip Select (/CS) ............................................................................................................. 7 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ................................... 7 4.3 Write Protect (/WP) .......................................................................................................... 7 4.4 HOLD (/HOLD) ................................................................................................................ 7 4.5 Serial Clock (CLK) ........................................................................................................... 7 (1) 4.6 Reset (/RESET) ............................................................................................................ 7 BLOCK DIAGRAM ....................................................................................................................... 8 FUNCTIONAL DESCRIPTIONS ................................................................................................... 9 6.1 Standard SPI Instructions................................................................................................. 9 6.2 Dual SPI Instructions........................................................................................................ 9 6.3 Quad SPI Instructions ...................................................................................................... 9 6.4 Software Reset & Hardware /RESET pin .......................................................................... 9 6.5 Write Protection ............................................................................................................. 10 Write Protect Features .......................................................................................................... 10 STATUS AND CONFIGURATION REGISTERS ......................................................................... 11 7.1 Status Registers ............................................................................................................ 11 Erase/Write In Progress (BUSY) Status Only ................................................................. 11 Write Enable Latch (WEL) Status Only ........................................................................... 11 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 11 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 12 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 12 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 12 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ................................ 13 Erase/Program Suspend Status (SUS) Status Only ....................................................... 14 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 14 Quad Enable (QE) Volatile/Non-Volatile Writable ......................................................... 14 Write Protect Selection (WPS) Volatile/Non-Volatile Writable....................................... 15 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable .......................... 15 Reserved Bits Non Functional ...................................................................................... 15 Status Register Memory Protection (WPS = 0, CMP = 0) ................................................... 16 Status Register Memory Protection (WPS = 0, CMP = 1) ................................................... 17 Individual Block Memory Protection (WPS=1) .................................................................... 18 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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