W25Q256JVEIQ TR Winbond

W25Q256JVEIQ TR electronic component of Winbond
W25Q256JVEIQ TR Winbond
W25Q256JVEIQ TR NOR Flash
W25Q256JVEIQ TR  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q256JVEIQ TR NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q256JVEIQ TR NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q256JVEIQ TR
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 3V, 256M-bit, 4Kb Uniform Sector
Datasheet: W25Q256JVEIQ TR Datasheet (PDF)
Price (USD)
1: USD 3.225 ea
Line Total: USD 3.22 
Availability : 2861
  
Ship by Wed. 06 Aug to Fri. 08 Aug
QtyUnit Price
1$ 3.225
10$ 2.8175
25$ 2.618
500$ 2.53
1000$ 2.431
4000$ 2.42

Availability 2861
Ship by Wed. 06 Aug to Fri. 08 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.225
10$ 2.8175
25$ 2.618
500$ 2.53
1000$ 2.431
4000$ 2.42

   
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RoHS - XON
Icon ROHS
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W25Q256JVEIQ TR from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q256JVEIQ TR and other electronic components in the NOR Flash category and beyond.

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W25Q256JV 3V 256M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: August 03, 2017 Revision G W25Q256JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 6 3.2 Pad Description WSON 8x6-mm .......................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI Operations ................................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 11 6.1.4 3-Byte / 4-Byte Address Modes ............................................................................................ 11 6.1.5 Software Reset & Hardware /RESET pin .............................................................................. 12 6.2 Write Protection .................................................................................................................. 13 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 14 7.1 Status Registers ................................................................................................................. 14 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 14 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 14 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 15 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 15 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 15 7.1.1 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.2 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 7.1.3 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 17 7.1.4 Quad Enable (QE) Volatile/Non-Volatile Writable .......................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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