W25Q32JVTBIQ Winbond

W25Q32JVTBIQ electronic component of Winbond
W25Q32JVTBIQ Winbond
W25Q32JVTBIQ NOR Flash
W25Q32JVTBIQ  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q32JVTBIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q32JVTBIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q32JVTBIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 32M-bit, 4Kb Uniform Sector
Datasheet: W25Q32JVTBIQ Datasheet (PDF)
Price (USD)
1: USD 1.2625 ea
Line Total: USD 1.26 
Availability : 829
  
Ship by Wed. 06 Aug to Fri. 08 Aug
QtyUnit Price
1$ 1.2625
25$ 1.0649
250$ 1.0087
480$ 0.9658
960$ 0.8987
2880$ 0.8811
5280$ 0.8701

Availability 829
Ship by Wed. 06 Aug to Fri. 08 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 1.2625
25$ 1.0649
250$ 1.0087
480$ 0.9658
960$ 0.8987
2880$ 0.8811
5280$ 0.8701

   
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We are delighted to provide the W25Q32JVTBIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q32JVTBIQ and other electronic components in the NOR Flash category and beyond.

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W25Q32JV 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL, QUAD SPI For Industrial & Industrial Plus Grade Publication Release Date: March 27, 2018 -Revision G W25Q32JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC 150/208-mil & VSOP 208-mil ......................................................... 5 3.2 Pad Configuration WSON 6x5-mm/ 8X6-mm, XSON 4x4-mm ............................................ 5 3.3 Pin Description SOIC 150/208-mil, VSOP 208-mil, WSON 6x5-mm/8x6-mm, XSON 4x4- mm 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil ............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Pin Configuration PDIP 300-mil ............................................................................................ 8 3.9 Pin Description PDIP 300-mil ............................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP) ............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 (1) 4.6 Reset (/RESET) ................................................................................................................. 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 Standard SPI Instructions ................................................................................................... 11 6.2 Dual SPI Instructions .......................................................................................................... 11 6.3 Quad SPI Instructions......................................................................................................... 11 6.4 Software Reset & Hardware /RESET pin ........................................................................... 11 6.5 Write Protection .................................................................................................................. 12 Write Protect Features .......................................................................................................... 12 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 13 7.1 Status Registers ................................................................................................................. 13 Erase/Write In Progress (BUSY) Status Only ................................................................. 13 Write Enable Latch (WEL) Status Only ........................................................................... 13 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................. 13 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ........................................ 14 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ........................................ 14 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 14 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ................................ 15 Erase/Program Suspend Status (SUS) Status Only ....................................................... 16 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable ........... 16 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................... 16 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ........................................ 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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