W25Q512JVBIM Winbond

W25Q512JVBIM electronic component of Winbond
W25Q512JVBIM Winbond
W25Q512JVBIM NOR Flash
W25Q512JVBIM  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25Q512JVBIM NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25Q512JVBIM NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25Q512JVBIM
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash spiFlash, 512M-bit, 4Kb Uniform Sector
Datasheet: W25Q512JVBIM Datasheet (PDF)
Price (USD)
1: USD 7.8625 ea
Line Total: USD 7.86 
Availability : 291
  
Ship by Wed. 06 Aug to Fri. 08 Aug
QtyUnit Price
1$ 7.8625
10$ 6.38
25$ 6.27
50$ 6.215
100$ 5.676
250$ 5.654
480$ 5.214
960$ 5.203

Availability 291
Ship by Wed. 06 Aug to Fri. 08 Aug
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 7.8625
10$ 6.38
25$ 6.27
50$ 6.215
100$ 5.676
250$ 5.654
480$ 5.214
960$ 5.203

   
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W25Q512JVBIM from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25Q512JVBIM and other electronic components in the NOR Flash category and beyond.

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W25Q512JV-DTR 3.0V 512M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI, QPI & DTR Publication Release Date: June 29, 2020 -Revision D W25Q512JV-DTR Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 5 2. FEATURES ....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 6 3.1 Pad Configuration 8x6-mm ................................................................................................... 6 3.2 Pad Description 8x6-mm ...................................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil ............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 Ball Array) ............................................................ 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 9 4.3 Write Protect (/WP) .............................................................................................................. 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET) .................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions ..................................................................................................... 11 6.1.2 Dual SPI Instructions ............................................................................................................ 11 6.1.3 Quad SPI Instructions ........................................................................................................... 12 6.1.4 QPI Instructions .................................................................................................................... 12 6.1.5 SPI / QPI DTR Read Instructions ......................................................................................... 12 6.1.6 3-Byte / 4-Byte Address Modes ............................................................................................ 12 6.1.7 Hold Function ....................................................................................................................... 13 6.1.8 Software Reset & Hardware /RESET pin .............................................................................. 13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Program/Erase/Write In Progress (BUSY) Status Only .................................................. 15 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 15 7.1.3 Block Protect Bits (BP3, BP2, BP1, BP0) Volatile/Non-Volatile Writable ....................... 16 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 16 7.1.5 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 16 7.1.6 Status Register Protect (SRP, SRL) Volatile/Non-Volatile Writable ............................... 16 7.1.7 Erase/Program Suspend Status (SUS) Status Only....................................................... 17 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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