W25R128JVPIQ Winbond

W25R128JVPIQ electronic component of Winbond
W25R128JVPIQ Winbond
W25R128JVPIQ NOR Flash
W25R128JVPIQ  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25R128JVPIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25R128JVPIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25R128JVPIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash RPMC spiFlash 3V 128M-bit
Datasheet: W25R128JVPIQ Datasheet (PDF)
Price (USD)
1: USD 3.6125 ea
Line Total: USD 3.61 
Availability : 0
  
QtyUnit Price
1$ 3.6125
10$ 3.036
20$ 2.86
50$ 2.717
100$ 2.475
500$ 2.442
1000$ 2.376

Availability 0
Ship by Wed. 26 Nov to Fri. 28 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.6125
10$ 3.036
20$ 2.86
50$ 2.717
100$ 2.475
500$ 2.442
1000$ 2.376

   
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We are delighted to provide the W25R128JVPIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25R128JVPIQ and other electronic components in the NOR Flash category and beyond.

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W25R128JV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & RPMC Publication Release Date: September 3, 2018 - Revision B W25R128JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 5 4. PIN DESCRIPTIONS ........................................................................................................................ 6 4.1 Chip Select (/CS) .................................................................................................................. 6 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 6 4.3 Serial Clock (CLK) ................................................................................................................ 6 4.4 Reset (/RESET) .................................................................................................................... 6 5. BLOCK DIAGRAM ............................................................................................................................ 7 6. FUNCTIONAL DESCRIPTIONS ....................................................................................................... 8 6.1 SPI Operations ..................................................................................................................... 8 6.1.1 Standard SPI Instructions ....................................................................................................... 8 6.1.2 Dual SPI Instructions .............................................................................................................. 8 6.1.3 Quad SPI Instructions ............................................................................................................. 8 6.1.4 Software Reset & Hardware /RESET pin ................................................................................ 8 6.2 RPMC Operations................................................................................................................. 9 6.3 Write Protection .................................................................................................................. 10 6.3.1 Write Protect Features ......................................................................................................... 10 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 12 7.1 Status Registers ................................................................................................................. 12 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 12 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 12 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 12 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 13 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ....................................... 13 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 13 7.1.7 Status Register Protect (SRL) .............................................................................................. 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only....................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 15 7.1.10 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................ 15 7.1.11 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ..................................... 15 7.1.12 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ......................... 16 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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