W25R128JVSIQ Winbond

Hot W25R128JVSIQ electronic component of Winbond
W25R128JVSIQ Winbond
W25R128JVSIQ NOR Flash
W25R128JVSIQ  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25R128JVSIQ NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25R128JVSIQ NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25R128JVSIQ
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash RPMC spiFlash, 3V, 128M-bit
Datasheet: W25R128JVSIQ Datasheet (PDF)
Price (USD)
1: USD 3.1928 ea
Line Total: USD 3.19 
Availability : 1670
  
Ship by Fri. 21 Nov to Thu. 27 Nov
QtyUnit Price
1$ 3.1928
10$ 2.248
30$ 1.9499
100$ 1.8672
500$ 1.8313
1000$ 1.8144

Availability 1670
Ship by Fri. 21 Nov to Thu. 27 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 3.1928
10$ 2.248
30$ 1.9499
100$ 1.8672
500$ 1.8313
1000$ 1.8144

   
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We are delighted to provide the W25R128JVSIQ from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25R128JVSIQ and other electronic components in the NOR Flash category and beyond.

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W25R128JV 3V 128M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & RPMC Publication Release Date: September 3, 2018 - Revision B W25R128JV Table of Contents 1. GENERAL DESCRIPTIONS ............................................................................................................. 4 2. FEATURES ....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS ........................................................................... 5 3.1 Pin Configuration SOIC 208-mil ........................................................................................... 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 5 3.3 Pin Description SOIC 208-mil, WSON 6x5-mm / 8x6-mm ................................................... 5 4. PIN DESCRIPTIONS ........................................................................................................................ 6 4.1 Chip Select (/CS) .................................................................................................................. 6 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ..................................... 6 4.3 Serial Clock (CLK) ................................................................................................................ 6 4.4 Reset (/RESET) .................................................................................................................... 6 5. BLOCK DIAGRAM ............................................................................................................................ 7 6. FUNCTIONAL DESCRIPTIONS ....................................................................................................... 8 6.1 SPI Operations ..................................................................................................................... 8 6.1.1 Standard SPI Instructions ....................................................................................................... 8 6.1.2 Dual SPI Instructions .............................................................................................................. 8 6.1.3 Quad SPI Instructions ............................................................................................................. 8 6.1.4 Software Reset & Hardware /RESET pin ................................................................................ 8 6.2 RPMC Operations................................................................................................................. 9 6.3 Write Protection .................................................................................................................. 10 6.3.1 Write Protect Features ......................................................................................................... 10 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 12 7.1 Status Registers ................................................................................................................. 12 7.1.1 Erase/Write In Progress (BUSY) Status Only ................................................................ 12 7.1.2 Write Enable Latch (WEL) Status Only .......................................................................... 12 7.1.3 Block Protect Bits (BP2, BP1, BP0) Volatile/Non-Volatile Writable ................................ 12 7.1.4 Top/Bottom Block Protect (TB) Volatile/Non-Volatile Writable ....................................... 13 7.1.5 Sector/Block Protect Bit (SEC) Volatile/Non-Volatile Writable ....................................... 13 7.1.6 Complement Protect (CMP) Volatile/Non-Volatile Writable ............................................ 13 7.1.7 Status Register Protect (SRL) .............................................................................................. 14 7.1.8 Erase/Program Suspend Status (SUS) Status Only....................................................... 14 7.1.9 Security Register Lock Bits (LB3, LB2, LB1) Volatile/Non-Volatile OTP Writable .......... 15 7.1.10 Quad Enable (QE) Volatile/Non-Volatile Writable ........................................................ 15 7.1.11 Write Protect Selection (WPS) Volatile/Non-Volatile Writable ..................................... 15 7.1.12 Output Driver Strength (DRV1, DRV0) Volatile/Non-Volatile Writable ......................... 16 - 1 -

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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