W25X10CLSNIGS Winbond

W25X10CLSNIGS electronic component of Winbond
W25X10CLSNIGS Winbond
W25X10CLSNIGS NOR Flash
W25X10CLSNIGS  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W25X10CLSNIGS NOR Flash across the USA, India, Europe, Australia, and various other global locations. W25X10CLSNIGS NOR Flash are a product manufactured by Winbond. We provide cost-effective solutions for NOR Flash, ensuring timely deliveries around the world.

Part No. W25X10CLSNIGS
Manufacturer: Winbond
Category: NOR Flash
Description: NOR Flash
Datasheet: W25X10CLSNIGS Datasheet (PDF)
Price (USD)
2000: USD 0.3175 ea
Line Total: USD 635 
Availability : 0
  
QtyUnit Price
2000$ 0.3175
2500$ 0.3105
5000$ 0.2849
10000$ 0.2803
25000$ 0.2733

Availability 0
Ship by Wed. 19 Nov to Fri. 21 Nov
MOQ : 2000
Multiples : 2000
QtyUnit Price
2000$ 0.3175
2500$ 0.3105
5000$ 0.2849
10000$ 0.2803
25000$ 0.2733

   
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We are delighted to provide the W25X10CLSNIGS from our NOR Flash category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W25X10CLSNIGS and other electronic components in the NOR Flash category and beyond.

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W25X10CL 2.5 / 3 / 3.3 V 1M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI Publication Release Date: February 17, 2014 - 1 - Revision G W25X10CL Table of Contents 1. GENERAL DESCRIPTION ......................................................................................................... 4 2. FEATURES ................................................................................................................................. 4 3. PIN CONFIGURATION SOIC 150-MIL ....................................................................................... 5 4. PAD CONFIGURATION USON 2X3-MM ................................................................................... 5 5. PIN DESCRIPTION SOIC AND USON 2X3-MM ........................................................................ 5 5.1 Package Types ............................................................................................................... 6 5.2 Chip Select (/CS) ............................................................................................................ 6 5.3 Serial Data Input, Output and IOs (DI, DO, IO0 and IO1) .............................................. 6 5.4 Write Protect (/WP) ......................................................................................................... 6 5.5 HOLD (/HOLD)................................................................................................................ 6 5.6 Serial Clock (CLK) .......................................................................................................... 6 6. BLOCK DIAGRAM ...................................................................................................................... 7 7. FUNCTIONAL DESCRIPTION.................................................................................................... 8 7.1 SPI OPERATIONS ......................................................................................................... 8 7.1.1 Standard SPI Instructions ................................................................................................. 8 7.1.2 Dual SPI Instructions ........................................................................................................ 8 7.1.3 Hold Function ................................................................................................................... 8 7.2 WRITE PROTECTION .................................................................................................... 9 7.2.1 Write Protect Features ...................................................................................................... 9 8. CONTROL AND STATUS REGISTERS ................................................................................... 10 8.1 STATUS REGISTER .................................................................................................... 10 8.1.1 BUSY .............................................................................................................................. 10 8.1.2 Write Enable Latch (WEL) .............................................................................................. 10 8.1.3 Block Protect Bits (BP1, BP0) ........................................................................................ 10 8.1.4 Top/Bottom Block Protect (TB) ....................................................................................... 10 8.1.5 Reserved Bits ................................................................................................................. 11 8.1.6 Status Register Protect (SRP) ........................................................................................ 11 8.1.7 Status Register Memory Protection ................................................................................ 12 INSTRUCTIONS ....................................................................................................................... 13 8.1.8 Manufacturer and Device Identification .......................................................................... 13 (1) 8.1.9 Instruction Set ............................................................................................................. 14 8.1.10 Write Enable (06h) ........................................................................................................ 15 8.1.11 Write Enable for Volatile Status Register (50h) ............................................................ 15 8.1.12 Write Disable (04h) ....................................................................................................... 16 8.1.13 Read Status Register (05h) .......................................................................................... 16 8.1.14 Write Status Register (01h) .......................................................................................... 17 8.1.15 Read Data (03h) ........................................................................................................... 18 8.1.16 Fast Read (0Bh) ........................................................................................................... 19 8.1.17 Fast Read Dual Output (3Bh) ....................................................................................... 20 8.1.18 Fast Read Dual I/O (BBh) ............................................................................................. 21 8.1.19 Continuous Read Mode Bits (M7-0) ............................................................................. 23 8.1.20 Continuous Read Mode Reset (FFFFh) ....................................................................... 23 8.1.21 Page Program (02h) ..................................................................................................... 24 8.1.22 Sector Erase (20h) ....................................................................................................... 25 Publication Release Date: February 17, 2014 - 2 - Revision G

Tariff Desc

8542.32.00 32 No ..CMOS and MOS Read Only Memory and Programmable Read Only Memory whether erasable or non-erasable (for example, flash memory, EPROM, E2PROM, EAPROM, NOVRAM, ROM and PROM)
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
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