Product Information

W9425G6JB-5I TR

W9425G6JB-5I TR electronic component of Winbond

Datasheet
DRAM 256Mb DDR SDRAM x16, 200Mhz, Ind temp T&R

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
N/A

Obsolete
Availability Price Quantity
0 - WHS 1

MOQ : 2500
Multiples : 2500
2500 : USD 6.6191
5000 : USD 6.5528
10000 : USD 6.4865
15000 : USD 6.4215
20000 : USD 6.3578
25000 : USD 6.2941
30000 : USD 6.2319
50000 : USD 6.1682
100000 : USD 6.1073
N/A

Obsolete
0 - WHS 2

MOQ : 2500
Multiples : 2500
2500 : USD 4.407
5000 : USD 4.394
10000 : USD 4.303
N/A

Obsolete
     
Manufacturer
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W9425G6JB 4 M 4 BANKS 16 BITS DDR SDRAM Table of Contents- 1. GENERAL DESCRIPTION ............................................................................................................. 4 2. FEATURES .................................................................................................................................... 4 3. ORDER INFORMATION ................................................................................................................ 4 4. KEY PARAMETERS ...................................................................................................................... 5 5. BALL CONFIGURATION ............................................................................................................... 6 6. BALL DESCRIPTION ..................................................................................................................... 7 7. BLOCK DIAGRAM ......................................................................................................................... 8 8. FUNCTIONAL DESCRIPTION ....................................................................................................... 9 8.1 Power Up Sequence ............................................................................................................ 9 8.2 Command Function ........................................................................................................... 10 8.2.1 Bank Activate Command ........................................................................................ 10 8.2.2 Bank Precharge Command .................................................................................... 10 8.2.3 Precharge All Command ........................................................................................ 10 8.2.4 Write Command ...................................................................................................... 10 8.2.5 Write with Auto-precharge Command .................................................................... 10 8.2.6 Read Command ...................................................................................................... 10 8.2.7 Read with Auto-precharge Command .................................................................... 10 8.2.8 Mode Register Set Command ................................................................................ 11 8.2.9 Extended Mode Register Set Command ................................................................ 11 8.2.10 No-Operation Command ........................................................................................ 11 8.2.11 Burst Read Stop Command .................................................................................... 11 8.2.12 Device Deselect Command .................................................................................... 11 8.2.13 Auto Refresh Command ......................................................................................... 11 8.2.14 Self Refresh Entry Command ................................................................................. 12 8.2.15 Self Refresh Exit Command ................................................................................... 12 8.2.16 Data Write Enable /Disable Command ................................................................... 12 8.3 Read Operation ................................................................................................................. 12 8.4 Write Operation ................................................................................................................. 13 8.5 Precharge .......................................................................................................................... 13 8.6 Burst Termination .............................................................................................................. 13 8.7 Refresh Operation ............................................................................................................. 13 8.8 Power Down Mode ............................................................................................................ 14 8.9 Input Clock Frequency Change during Precharge Power Down Mode ............................ 14 Publication Release Date: Oct. 04, 2012 - 1 - Revision A03 W9425G6JB 8.10 Mode Register Operation .................................................................................................. 14 8.10.1 Burst Length field (A2 to A0) .................................................................................. 14 8.10.2 Addressing Mode Select (A3) ................................................................................. 15 8.10.3 CAS Latency field (A6 to A4) .................................................................................. 16 8.10.4 DLL Reset bit (A8) .................................................................................................. 16 8.10.5 Mode Register /Extended Mode register change bits (BA0, BA1) ......................... 16 8.10.6 Extended Mode Register field ................................................................................ 16 8.10.7 Reserved field ......................................................................................................... 16 9. OPERATION MODE .................................................................................................................... 17 9.1 Simplified Truth Table ........................................................................................................ 17 9.2 Function Truth Table ......................................................................................................... 18 9.3 Function Truth Table for CKE ............................................................................................ 21 9.4 Simplified Stated Diagram ................................................................................................. 22 10. ELECTRICAL CHARACTERISTICS ............................................................................................ 23 10.1 Absolute Maximum Ratings ............................................................................................... 23 10.2 Recommended DC Operating Conditions ......................................................................... 23 10.3 Capacitance ....................................................................................................................... 24 10.4 Leakage and Output Buffer Characteristics ...................................................................... 24 10.5 DC Characteristics ............................................................................................................. 25 10.6 AC Characteristics and Operating Condition ..................................................................... 26 10.7 AC Test Conditions ............................................................................................................ 27 11. SYSTEM CHARACTERISTICS FOR DDR SDRAM .................................................................... 29 11.1 Table 1: Input Slew Rate for DQ, DQS, and DM ............................................................... 29 11.2 Table 2: Input Setup & Hold Time Derating for Slew Rate ................................................ 29 11.3 Table 3: Input/Output Setup & Hold Time Derating for Slew Rate .................................... 29 11.4 Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate .................... 29 11.5 Table 5: Output Slew Rate Characteristics (X16 Devices only) ........................................ 29 11.6 System Notes: ................................................................................................................... 30 12. TIMING WAVEFORMS ................................................................................................................ 32 12.1 Command Input Timing ..................................................................................................... 32 12.2 Timing of the CLK Signals ................................................................................................. 32 12.3 Read Timing (Burst Length = 4) ........................................................................................ 33 12.4 Write Timing (Burst Length = 4) ........................................................................................ 34 12.5 DM, DATA MASK (W9425G6JB) ...................................................................................... 35 12.6 Mode Register Set (MRS) Timing ..................................................................................... 36 12.7 Extend Mode Register Set (EMRS) Timing ....................................................................... 37 12.8 Auto-precharge Timing (Read Cycle, CL = 2) ................................................................... 38 Publication Release Date: Oct. 04, 2012 - 2 - Revision A03

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

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