W972GG6KB-25 Winbond

W972GG6KB-25 electronic component of Winbond
W972GG6KB-25 Winbond
W972GG6KB-25 DRAM
W972GG6KB-25  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of W972GG6KB-25 DRAM across the USA, India, Europe, Australia, and various other global locations. W972GG6KB-25 DRAM are a product manufactured by Winbond. We provide cost-effective solutions for DRAM, ensuring timely deliveries around the world.

Part No. W972GG6KB-25
Manufacturer: Winbond
Category: DRAM
Description: DDR2 SDRAM 16M X 8 BANKS X 16 BIT
Datasheet: W972GG6KB-25 Datasheet (PDF)
Price (USD)
1: USD 12.408 ea
Line Total: USD 12.41 
Availability : 201
  
Ship by Thu. 20 Nov to Mon. 24 Nov
QtyUnit Price
1$ 12.408
10$ 10.681
25$ 10.428
50$ 10.428
100$ 9.713
288$ 9.702
576$ 9.515
1008$ 9.35
2592$ 9.317

Availability 201
Ship by Thu. 20 Nov to Mon. 24 Nov
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 12.408
10$ 10.681
25$ 10.428
50$ 10.428
100$ 9.713
288$ 9.702
576$ 9.515
1008$ 9.35
2592$ 9.317

   
Manufacturer
Product Category
Type
Mounting Style
Package / Case
Data Bus Width
Organisation
Memory Size
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Hts Code
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the W972GG6KB-25 from our DRAM category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the W972GG6KB-25 and other electronic components in the DRAM category and beyond.

Image Part-Description
Stock Image W972GG8JB-25
DRAM Chip DDR2 SDRAM 2Gbit 256Mx8 1.8V 60-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG8KB25I
DRAM Chip DDR2 SDRAM 2Gbit 256Mx8 1.8V 60-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG8KB25
DRAM 2Gb DDR2-800, x8
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG6KB25I
DDR2 SDRAM 16M X 8 BANKS X 16 BIT
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG6KB-25 TR
DRAM 2Gb DDR2-800, x16 T&R
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G6KB25I
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG6KB-25K
DRAM Chip SDRAM
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G6KB-25
DRAM Chip DDR2 SDRAM 512Mbit 32Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9751G6KB-18
DRAM 512Mb DDR2-1066, x16
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W972GG8KB25I TR
DRAM 2Gb DDR2-800, x8. Ind temp T&R
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Image Part-Description
Stock Image W9725G6KB25I
DRAM Chip DDR2 SDRAM 256Mbit 16Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG8KB25I
DRAM Chip DDR2 SDRAM 1Gbit 128Mx8 1.8V 60-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6KB25I
DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W971GG6KB-25
DRAM Chip DDR2 SDRAM 1Gbit 64Mx16 1.8V 84-Pin WBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9712G6KB-25
DRAM Chip DDR2 SDRAM 128Mbit 8Mx16 1.8V 84-Pin TFBGA
Stock : 205
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W949D2DBJX5E
DRAM Chip Mobile LPDDR SDRAM 512Mbit 16Mx32 1.8V 90-Pin VFBGA
Stock : 75
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9425G6KH-5
4 M X 4 BANKS X16 BITS DDR SDRAM
Stock : 43
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9425G6JB-5I
DRAM Chip DDR SDRAM 256Mbit 16Mx16 2.5V 60-Pin TFBGA
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5 TR
DRAM 128Mb DDR SDRAM x16 200MHz, 46nm T&R
Stock : 0
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.
Stock Image W9412G6KH-5I
DRAM Chip DDR SDRAM 128Mbit 8Mx16 2.5V 66-Pin TSOP-II
Stock : 8
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges.

W972GG6KB 16M 8 BANKS 16 BIT DDR2 SDRAM Table of Contents- 1. GENERAL DESCRIPTION ................................................................................................................... 4 2. FEATURES ........................................................................................................................................... 4 3. ORDER INFORMATION ....................................................................................................................... 4 4. KEY PARAMETERS ............................................................................................................................. 5 5. BALL CONFIGURATION ...................................................................................................................... 6 6. BALL DESCRIPTION ............................................................................................................................ 7 7. BLOCK DIAGRAM ................................................................................................................................ 8 8. FUNCTIONAL DESCRIPTION .............................................................................................................. 9 8.1 Power-up and Initialization Sequence ................................................................................................... 9 8.2 Mode Register and Extended Mode Registers Operation ................................................................... 10 8.2.1 Mode Register Set Command (MRS)............................................................................... 10 8.2.2 Extend Mode Register Set Commands (EMRS) .............................................................. 11 8.2.2.1 Extend Mode Register Set Command (1), EMR (1) ................................................ 11 8.2.2.2 DLL Enable/Disable ................................................................................................ 12 8.2.2.3 Extend Mode Register Set Command (2), EMR (2) ................................................ 13 8.2.2.4 Extend Mode Register Set Command (3), EMR (3) ................................................ 14 8.2.3 Off-Chip Driver (OCD) Impedance Adjustment ................................................................ 15 8.2.3.1 Extended Mode Register for OCD Impedance Adjustment .................................... 16 8.2.3.2 OCD Impedance Adjust .......................................................................................... 16 8.2.3.3 Drive Mode ............................................................................................................. 17 8.2.4 On-Die Termination (ODT) ............................................................................................... 18 8.2.5 ODT related timings ......................................................................................................... 18 8.2.5.1 MRS command to ODT update delay ..................................................................... 18 8.3 Command Function ............................................................................................................................. 20 8.3.1 Bank Activate Command .................................................................................................. 20 8.3.2 Read Command ............................................................................................................... 21 8.3.3 Write Command ............................................................................................................... 21 8.3.4 Burst Read with Auto-precharge Command ..................................................................... 21 8.3.5 Burst Write with Auto-precharge Command ..................................................................... 21 8.3.6 Precharge All Command .................................................................................................. 21 8.3.7 Self Refresh Entry Command .......................................................................................... 21 8.3.8 Self Refresh Exit Command ............................................................................................. 22 8.3.9 Refresh Command ........................................................................................................... 22 8.3.10 No-Operation Command .................................................................................................. 23 8.3.11 Device Deselect Command .............................................................................................. 23 8.4 Read and Write access modes ........................................................................................................... 23 8.4.1 Posted CAS ................................................................................................................... 23 CAS 8.4.1.1 Examples of posted operation ..................................................................... 23 8.4.2 Burst mode operation ....................................................................................................... 24 8.4.3 Burst read mode operation ............................................................................................... 25 8.4.4 Burst write mode operation .............................................................................................. 25 8.4.5 Write data mask ............................................................................................................... 26 8.5 Burst Interrupt ..................................................................................................................................... 26 8.6 Precharge operation ............................................................................................................................ 27 Publication Release Date: Feb. 13, 2017 Revision: A03 - 1 - W972GG6KB 8.6.1 Burst read operation followed by precharge ..................................................................... 27 8.6.2 Burst write operation followed by precharge .................................................................... 27 8.7 Auto-precharge operation ................................................................................................................... 27 8.7.1 Burst read with Auto-precharge ....................................................................................... 28 8.7.2 Burst write with Auto-precharge ....................................................................................... 28 8.8 Refresh Operation ............................................................................................................................... 29 8.9 Power Down Mode .............................................................................................................................. 29 8.9.1 Power Down Entry ........................................................................................................... 30 8.9.2 Power Down Exit .............................................................................................................. 30 8.10 Input clock frequency change during precharge power down ............................................................. 30 9. OPERATION MODE ........................................................................................................................... 31 9.1 Command Truth Table ........................................................................................................................ 31 9.2 Clock Enable (CKE) Truth Table for Synchronous Transitions ........................................................... 32 9.3 Data Mask (DM) Truth Table ............................................................................................................... 32 9.4 Function Truth Table ........................................................................................................................... 33 9.5 Simplified Stated Diagram ................................................................................................................... 36 10. ELECTRICAL CHARACTERISTICS ................................................................................................... 37 10.1 Absolute Maximum Ratings ................................................................................................................ 37 10.2 Operating Temperature Condition ....................................................................................................... 37 10.3 Recommended DC Operating Conditions ........................................................................................... 37 10.4 ODT DC Electrical Characteristics ...................................................................................................... 38 10.5 Input DC Logic Level ........................................................................................................................... 38 10.6 Input AC Logic Level ........................................................................................................................... 38 10.7 Capacitance ........................................................................................................................................ 39 10.8 Leakage and Output Buffer Characteristics ........................................................................................ 39 10.9 DC Characteristics .............................................................................................................................. 40 10.10 IDD Measurement Test Parameters .......................................................................................... 42 10.11 AC Characteristics ..................................................................................................................... 43 10.11.1 AC Characteristics and Operating Condition for -18 speed grade ................................... 43 10.11.2 AC Characteristics and Operating Condition for -25/25I/-3/-3I speed grade .................... 45 10.12 AC Input Test Conditions ........................................................................................................... 66 10.13 Differential Input/Output AC Logic Levels .................................................................................. 66 10.14 AC Overshoot / Undershoot Specification ................................................................................. 67 10.14.1 AC Overshoot / Undershoot Specification for Address and Control Pins: ........................ 67 10.14.2 AC Overshoot / Undershoot Specification for Clock, Data, Strobe and Mask pins: .......... 67 11. TIMING WAVEFORMS ....................................................................................................................... 68 11.1 Command Input Timing ....................................................................................................................... 68 11.2 ODT Timing for Active/Standby Mode ................................................................................................. 69 11.3 ODT Timing for Power Down Mode .................................................................................................... 69 11.4 ODT Timing mode switch at entering power down mode .................................................................... 70 11.5 ODT Timing mode switch at exiting power down mode ...................................................................... 71 11.6 Data output (read) timing .................................................................................................................... 72 11.7 Burst read operation: RL=5 (AL=2, CL=3, BL=4) ................................................................................ 72 11.8 Data input (write) timing ...................................................................................................................... 73 11.9 Burst write operation: RL=5 (AL=2, CL=3, WL=4, BL=4) .................................................................... 73 11.10 Seamless burst read operation: RL = 5 (AL = 2, and CL = 3, BL = 4) ....................................... 74 11.11 Seamless burst write operation: RL = 5 (WL = 4, BL = 4) .......................................................... 74 11.12 Burst read interrupt timing: RL =3 (CL=3, AL=0, BL=8) ............................................................. 75 11.13 Burst write interrupt timing: RL=3 (CL=3, AL=0, WL=2, BL=8) .................................................. 75 11.14 Write operation with Data Mask: WL=3, AL=0, BL=4) ............................................................... 76 Publication Release Date: Feb. 13, 2017 Revision: A03 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA
MBN15SS1W01-CC Pushbutton by NKK Switches image

Aug 14, 2025
MBN15SS1W01-CC Pushbutton Switches by NKK Switches offer durable SPDT design, smooth tactile action, and reliable performance for industrial, telecom, and commercial applications.
PX2AF1XX050PAAAX Pressure Sensor – Honeywell IP69K image

Jul 3, 2025
The PX2AF1XX050PAAAX Industrial Pressure Sensor by Honeywell provides 0–50 psi absolute sensing with IP69K protection. Perfect for rugged applications. Global delivery from Xon Electronics.
CA3106E2027PBF80 Circular MIL Spec Connector By ITT image

Nov 14, 2025
The CA3106E2027PBF80 Circular MIL Spec Connector by ITT offers rugged, secure, and high-reliability performance for aerospace, defense, and industrial systems operating in harsh environments.
Supplier of MS3106F14S-5PX Circular MIL Spec Connector image

Jul 22, 2024
The MS3106F14S-5PX Circular MIL Spec Connector is an essential component for various high-stakes applications. Its reliability, durability, and versatility make it a preferred choice across industries. With Xon Electronic as your supplier, you are guaranteed to receive top-quality products and exce

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON Electronics
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2025  X-ON Electronics Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing. All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted AS9120 Certified