Product Information

W9812G6KH-5

W9812G6KH-5 electronic component of Winbond

Datasheet
DRAM 128M SDR SDRAM x16, 200MHz

Manufacturer: Winbond
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 2.2069 ea
Line Total: USD 2.21

417 - Global Stock
Ships to you between
Thu. 30 May to Mon. 03 Jun
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
513 - WHS 1


Ships to you between Thu. 30 May to Mon. 03 Jun

MOQ : 1
Multiples : 1

Stock Image

W9812G6KH-5
Winbond

1 : USD 2.3374
10 : USD 2.0764
108 : USD 1.8509
540 : USD 1.6967
1080 : USD 1.673
2592 : USD 1.5781
5076 : USD 1.5662
10044 : USD 1.5543
25056 : USD 1.5187

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Type
Mounting Style
Package / Case
Data Bus Width
Memory Size
Maximum Clock Frequency
Supply Voltage - Max
Supply Voltage - Min
Supply Current - Max
Minimum Operating Temperature
Maximum Operating Temperature
Series
Packaging
Organization
Brand
Hts Code
Product Type
Factory Pack Quantity :
Subcategory
LoadingGif

Notes:- Show Stocked Products With Similar Attributes.
Image Description
W9812G6KH-6 TR electronic component of Winbond W9812G6KH-6 TR

DRAM 128Mb SDR SDRAM x16, 166MHz T&R
Stock : 0

W9816G6JH-6I electronic component of Winbond W9816G6JH-6I

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V
Stock : 1317

W9812G6KH-6 electronic component of Winbond W9812G6KH-6

DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
Stock : 1031

W9825G2JB-6I electronic component of Winbond W9825G2JB-6I

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA
Stock : 0

W9812G6KH-6I electronic component of Winbond W9812G6KH-6I

DRAM Chip SDRAM 128Mbit 8Mx16 3.3V 54-Pin TSOP-II
Stock : 1394

W9816G6JH-6 electronic component of Winbond W9816G6JH-6

DRAM Chip SDRAM 16Mbit 1Mx16 3.3V 50-Pin TSOP-II
Stock : 630

W9825G2JB-6 electronic component of Winbond W9825G2JB-6

DRAM Chip SDRAM 256Mbit 8Mx32 3.3V 90-Pin TFBGA
Stock : 0

W9825G6JB-6 electronic component of Winbond W9825G6JB-6

DRAM 256M SDR SDRAM x16, 166MHz,
Stock : 0

W9812G6KH-5I electronic component of Winbond W9812G6KH-5I

DRAM 128M SDR SDRAM x16 200MHz Ind temp
Stock : 314

W9816G6JH-7 electronic component of Winbond W9816G6JH-7

DRAM 16M SDR SDRAM 133MHz
Stock : 685

Image Description
AS4C64M16MD2A-25BINTR electronic component of Alliance Memory AS4C64M16MD2A-25BINTR

DRAM 1G 1.2V/1.8V 32Mx32 Mobile DDR2 E-Temp
Stock : 1861

W972GG8KB25I TR electronic component of Winbond W972GG8KB25I TR

DRAM 2Gb DDR2-800, x8. Ind temp T&R
Stock : 0

IS42VM16160K-75BLI-TR electronic component of ISSI IS42VM16160K-75BLI-TR

DRAM 256M, 1.8V, 133Mhz 16Mx16 Mobile SDR
Stock : 0

W9712G6KB25I TR electronic component of Winbond W9712G6KB25I TR

DRAM 128Mb DDR2-800, x16 T&R
Stock : 2475

MT40A1G8WE-083E IT:B electronic component of Micron MT40A1G8WE-083E IT:B

DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0

MT40A1G8WE-075E:B electronic component of Micron MT40A1G8WE-075E:B

DRAM Chip DDR4 SDRAM 8G-Bit 1Gx8 1.2V 78-Pin FBGA
Stock : 0

MT40A512M16JY-083E AUT:B electronic component of Micron MT40A512M16JY-083E AUT:B

MICMT40A512M16JY-083E AUT:B
Stock : 0

MT53D1024M32D4DT-053 WT:D electronic component of Micron MT53D1024M32D4DT-053 WT:D

DRAM LPDDR4 32G 1GX32 FBGA QDP
Stock : 0

EDB8164B4PT-1DAT-F-D electronic component of Micron EDB8164B4PT-1DAT-F-D

DRAM Chip LPDDR2 SDRAM 8Gbit 128M X 64 256-Ball BGA T/R
Stock : 0

MT40A256M16GE-083E AAT:B electronic component of Micron MT40A256M16GE-083E AAT:B

DDR4 4G 256MX16 FBGA
Stock : 0

W9812G6KH 2M 4 BANKS 16 BITS SDRAM Table of Contents- 1. GENERAL DESCRIPTION .............................................................................................................. 3 2. FEATURES ...................................................................................................................................... 3 3. ORDER INFORMATION .................................................................................................................. 3 4. PIN CONFIGURATION .................................................................................................................... 4 5. PIN DESCRIPTION ......................................................................................................................... 5 6. BLOCK DIAGRAM ........................................................................................................................... 6 7. FUNCTIONAL DESCRIPTION ........................................................................................................ 7 7.1 Power Up and Initialization ................................................................................................. 7 7.2 Programming Mode Register .............................................................................................. 7 7.3 Bank Activate Command .................................................................................................... 7 7.4 Read and Write Access Modes .......................................................................................... 7 7.5 Burst Read Command ........................................................................................................ 8 7.6 Burst Write Command ......................................................................................................... 8 7.7 Read Interrupted by a Read................................................................................................ 8 7.8 Read Interrupted by a Write ................................................................................................ 8 7.9 Write Interrupted by a Write ................................................................................................ 8 7.10 Write Interrupted by a Read ................................................................................................ 8 7.11 Burst Stop Command .......................................................................................................... 8 7.12 Addressing Sequence of Sequential Mode......................................................................... 9 7.13 Addressing Sequence of Interleave Mode .......................................................................... 9 7.14 Auto-precharge Command................................................................................................ 10 7.15 Precharge Command ........................................................................................................ 10 7.16 Self Refresh Command ..................................................................................................... 10 7.17 Power Down Mode ............................................................................................................ 11 7.18 No Operation Command ................................................................................................... 11 7.19 Deselect Command .......................................................................................................... 11 7.20 Clock Suspend Mode ........................................................................................................ 11 8. OPERATION MODE ...................................................................................................................... 12 9. ELECTRICAL CHARACTERISTICS ............................................................................................. 13 9.1 Absolute Maximum Ratings .............................................................................................. 13 9.2 Recommended DC Operating Conditions ........................................................................ 13 9.3 Capacitance ...................................................................................................................... 14 9.4 DC Characteristics ............................................................................................................ 14 9.5 AC Characteristics and Operating Condition .................................................................... 15 10. TIMING WAVEFORMS .................................................................................................................. 17 10.1 Command Input Timing ..................................................................................................... 17 10.2 Read Timing ...................................................................................................................... 18 10.3 Control Timing of Input/Output Data ................................................................................. 19 10.4 Mode Register Set Cycle .................................................................................................. 20 Publication Release Date: Feb. 22, 2017 Revision: A05 - 1 - W9812G6KH 11. OPERATING TIMING EXAMPLE .................................................................................................. 21 11.1 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3) .......................................... 21 11.2 Interleaved Bank Read (Burst Length = 4, CAS Latency = 3, Auto-precharge) ............... 22 11.3 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3) .......................................... 23 11.4 Interleaved Bank Read (Burst Length = 8, CAS Latency = 3, Auto-precharge) ............... 24 11.5 Interleaved Bank Write (Burst Length = 8) ....................................................................... 25 11.6 Interleaved Bank Write (Burst Length = 8, Auto-precharge) ............................................ 26 11.7 Page Mode Read (Burst Length = 4, CAS Latency = 3) ................................................... 27 11.8 Page Mode Read / Write (Burst Length = 8, CAS Latency = 3) ....................................... 28 11.9 Auto Precharge Read (Burst Length = 4, CAS Latency = 3) ............................................ 29 11.10 Auto Precharge Write (Burst Length = 4) ......................................................................... 30 11.11 Auto Refresh Cycle ........................................................................................................... 31 11.12 Self Refresh Cycle ............................................................................................................ 32 11.13 Burst Read and Single Write (Burst Length = 4, CAS Latency = 3) ................................. 33 11.14 Power Down Mode ............................................................................................................ 34 11.15 Auto-precharge Timing (Read Cycle) ............................................................................... 35 11.16 Auto-precharge Timing (Write Cycle) ............................................................................... 36 11.17 Timing Chart of Read to Write Cycle ................................................................................ 37 11.18 Timing Chart of Write to Read Cycle ................................................................................ 37 11.19 Timing Chart of Burst Stop Cycle (Burst Stop Command) ............................................... 38 11.20 Timing Chart of Burst Stop Cycle (Precharge Command) ................................................ 38 11.21 CKE/DQM Input Timing (Write Cycle) .............................................................................. 39 11.22 CKE/DQM Input Timing (Read Cycle) .............................................................................. 40 12. PACKAGE SPECIFICATION ......................................................................................................... 41 13. REVISION HISTORY ..................................................................................................................... 42 Publication Release Date: Feb. 22, 2017 Revision: A05 - 2 -

Tariff Desc

8542.32.00 -- Memories
               Monolithic integrated circuits:
Winbond Elec
WINBOND ELECTRONICS
WINBOND ELECTRONICS CORP AMERICA

Looking for help? Visit our FAQ's Section to answer to all your questions

 

X-ON Worldwide Electronics

Welcome To X-ON ELECTRONICS
For over three decades, we have been advocating and shaping the electronic components industry. Our management complements our worldwide business scope and focus. We are committed to innovation, backed by a strong business foundation. If you need a trustworthy supplier of electronic components for your business – look no further.
 

Copyright ©2024  X-ON Electronic Services. All rights reserved.
Please ensure you have read and understood our Terms & Conditions before purchasing.
All prices exclude GST.

Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted Image for all the cards that are accepted