FCX558 400V PNP HIGH VOLTAGE TRANSISTOR IN SOT89 Features Mechanical Data BV > -400V Case: SOT89 CEO I = -200mA High Continuous Current C Case Material: Molded Plastic. Green Molding Compound. I = -500mA Peak Pulse Current CM UL Flammability Rating 94V-0 Excellent h Characteristics up to -100mA FE Moisture Sensitivity: Level 1 per J-STD-020 Low Saturation Voltage V < -200mV -20mA CE(sat) Terminals: Finish - Matte Tin Plated Leads, Complementary NPN Type: FCX458 Solderable per MIL-STD-202, Method 208 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Weight: 0.05 grams (Approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability SOT89 C E B C C B E Top View Top View Device Symbol Pin Out Ordering Information (Note 4) Product Compliance Marking Reel Size (inches) Tape Width (mm) Quantity per Reel FCX558TA AEC-Q101 P58 7 12 1,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See FCX558 Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Limit Unit Collector-Base Voltage V -400 V CBO Collector-Emitter Voltage V -400 V CEO Emitter-Base Voltage V -7 V EBO Continuous Collector Current -200 mA IC Peak Pulse Current -500 mA I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit (Note 5) 0.7 (Note 6) 1 Power Dissipation W P D (Note 7) 1.5 (Note 8) 2 (Note 5) 178 (Note 6) 125 Thermal Resistance, Junction to Ambient Air RJA (Note 7) 83 C/W (Note 8) 60 Thermal Resistance, Junction to Lead (Note 9) R 22 JL Operating and Storage Temperature Range T T -65 to +150 C J, STG ESD Ratings (Note 10) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the exposed collector pad on minimum recommended pad layout (MRP) 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except the device is mounted with the exposed collector pad on 15mm x 15mm 1oz copper. 7. Same as Note 5, except the device is mounted with the exposed collector pad on 25mm x 25mm 1oz copper. 8. Same as Note 5, except the device is mounted with the exposed collector pad on 50mm x 50mm 1oz copper. 9. Thermal resistance from junction to solder-point (on the exposed collector pad). 10. Refer to JEDEC specification JESD22-A114 and JESD22-A115. Thermal Characteristics and Derating Information 140.0 3 T =25C 2oz copper A 120.0 2 100.0 1oz copper 80.0 1 1oz copper 60.0 2oz copper 40.0 0 0 500 1000 1500 2000 2500 0 500 1000 1500 2000 2500 Copper Area (sqmm) Copper Area (sqmm) FCX558 2 of 7 April 2017 Diodes Incorporated Datasheet Number: DS33059 Rev. 7 - 2 www.diodes.com Thermal Resistance (C/W) Maximum Power (W)