MMBT2222ALP4 40V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR Features Mechanical Data Case: X2-DFN1006-3 Low Collector-Emitter Saturation Voltage, V CE(sat) Case Material: Molded Plastic,Gree Molding Compound. Ultra-Small Leadless Surface Mount Package UL Flammability Classification Rating 94V-0 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Moisture Sensitivity: Level 1 per J-STD-020 Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Terminals: Finish NiPdAu over Copper leadframe. Solderable per MIL-STD-202, Method 208 e4 Weight: 0.0009 grams (Approximate) X2-DFN1006-3 C B B C E E Top View Bottom View Device Symbol Device Schematic Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel MMBT2222ALP4-7B 2S 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBT2222ALP4 Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V 75 V CBO Collector-Emitter Voltage V 40 V CEO Emitter-Base Voltage 6 V V EBO Collector Current - Continuous 600 mA I C Peak Collector Current 800 mA I CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) P 460 mW D Power Dissipation (Note 6) P 1 W D Thermal Resistance, Junction to Ambient (Note 5) 272 C/W R JA Thermal Resistance, Junction to Ambient (Note 6) 120 C/W R JA Thermal Resistance, Junction to Lead (Note 7) R 110 C/W JL Operating and Storage Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 8,000 V 3B Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device surface mounted on minimum recommended pad layout FR-4 PCB with single sided 1oz copper, in still air conditions the device is measured when operating in a steady-state condition. The entire exposed collector pad is attached to the heatsink. 6. Same as note 5, except device is surface mounted on 25mm X 25mm collector pad heatsink with 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 August 2012 MMBT2222ALP4 Diodes Incorporated www.diodes.com Document number: DS35506 Rev. 3 - 2