MMBT3906FA 40V PNP SMALL SIGNAL TRANSISTOR IN DFN0806 Features Mechanical Data BV > -40V Case: X2-DFN0806-3 CEO I = -200mA high Collector Current Case Material: Molded Plastic, Green Molding Compound. C P = 435mW Power Dissipation UL Flammability Classification Rating 94V-0 D 2 package footprint, 16 times smaller than SOT23 0.48mm Moisture Sensitivity: Level 1 per J-STD-020 0.4mm height package minimizing off-board profile Terminals: Finish NiPdAu, Solderable per MIL-STD-202, Complementary NPN Type MMBT3904FA e4 Method 208 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Weight: 0.0008 grams (approximate) Halogen and Antimony Free. Green Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability C X2-DFN0806-3 B B C E E Top View Device Schematic Device Symbol Bottom View Top View Ordering Information (Note 4) Product Marking Reel size (inches) Tape width (mm) Quantity per reel MMBT3906FA-7B 3N 7 8 10,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See MMBT3906FA Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -6.0 V EBO Continuous Collector Current I -200 mA C Peak Pulse Collector Current I -500 mA CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) P 435 mW D Thermal Resistance, Junction to Ambient (Note 5) 287 C/W R JA Thermal Resistance, Junction to Lead (Note 6) 150 C/W R JL Operating and Storage and Temperature Range -55 to +150 T , T C J STG ESD Ratings (Note 7) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 200 V B Notes: 5. For the device mounted on minimum recommended pad layout 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady state condition. The entire exposed collector pad is attached to the heatsink. 6. Thermal resistance from junction to solder-point (on the exposed collector pad). 7. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 July 2013 MMBT3906FA Diodes Incorporated www.diodes.com Document number: DS36017 Rev. 1 - 2