ZXTP2008G Green 30V PNP LOW SATURATION TRANSISTOR IN SOT223 Features Mechanical Data BV > -30V CEO Case: SOT223 I = -5.5A Continuous Collector Current C Case Material: Molded Plastic. Green Molding Compound. I = -20A Peak Pulse Current UL Flammability Rating 94V-0 CM Low Saturation Voltage V < -60mV max -1A CE(SAT) Moisture Sensitivity: Level 1 per J-STD-020 R = 31m -5.5A for Low Equivalent On-Resistance SAT Terminals: Finish Matte Tin Plated Leads. Solderable per MIL- Exceptional Gain Linearity Down to -10mA STD-202, Method 208 Weight: 0.112 grams (Approximate) h Specified up to -20A for High Gain Hold Up FE Lead-Free Finish RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Applications Qualified to AEC-Q101 Standards for High Reliability DC-DC Converters MOSFET Gate Drivers Charging Circuits Power Switches Motor Control SOT223 Device Schematic Pin-Out Top View Top View Ordering Information (Note 4) Part Number Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXTP2008GTA ZXTP2008 7 12 1,000 Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied. 2. See ZXTP2008G Absolute Maximum Ratings ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Collector-Base Voltage -50 V V CBO Collector-Emitter Voltage -30 V V CEO Emitter-Base Voltage -7 V V EBO Continuous Collector Current -5.5 A I C Peak Pulse Current I -20 A CM Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit 3.0 (Note 5) Power Dissipation 24 W P D Linear Derating Factor mW/C 1.6 (Note 6) 12.8 (Note 5) R 42 JA Thermal Resistance, Junction to Ambient (Note 6) R 78 C/W JA Thermal Resistance, Junction to Lead (Note 7) R 8.8 JL Operating and Storage Temperature Range T T -55 to +150 C J, STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 52mm x 52mm 2oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in steady-state. 6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTP2008G December 2015 Diodes Incorporated www.diodes.com Document number: DS33708 Rev. 2 - 2