ZXTP25020BFHTA Diodes Incorporated

ZXTP25020BFH 20V, SOT23, PNP medium power transistor Summary BV > -40V CEX BV > -20V CEO BV > -7V ECO I = -4A C(cont) R = 32 m CE(sat) V < -60mV 1A CE(sat) P = 1.25W D Complementary part number ZXTN25020BFH Description C Advanced process capability and package design have been used to maximize the power handling and performance of this small outline transistor. The compact size and ratings of this device make it ideally B suited to applications where space is at a premium. Features High power dissipation SOT23 package E High peak current Low saturation voltage 40V forward blocking voltage 7V reverse blocking voltage E Applications MOSFET and IGBT gate driving C DC - DC converters Motor drive B High side driver Pinout - top view Battery charging Ordering information Device Reel size Tape width Quantity per reel (inches) (mm) ZXTP25020BFHTA 7 8 3,000 Device marking 1A9 Issue 2 - March 2008 1 www.zetex.com Zetex Semiconductors plc 2008ZXTP25020BFH Absolute maximum ratings Parameter Symbol Limit Unit Collector-base voltage V -40 V CBO Collector-emitter voltage (forward blocking) V -40 V CEX Collector-emitter voltage V -20 V CEO Emitter-collector voltage (reverse blocking) V -7 V ECO Emitter-base voltage V -7 V EBO (b) I -4 A Continuous collector current C Peak pulse current I -10 A CM (a) P 0.73 W Power dissipation at T =25C D amb Linear derating factor 5.84 mW/C (b) P 1.05 W Power dissipation at T =25C D amb Linear derating factor 8.4 mW/C (c) P 1.25 W Power dissipation at T =25C D amb Linear derating factor 9.6 mW/C (d) P 1.81 W Power dissipation at T =25C D amb Linear derating factor 14.5 mW/C Operating and storage temperature range T , T -55 to 150 C j stg Thermal resistance Parameter Symbol Limit Unit (a) R 171 C/W Junction to ambient JA (b) R 119 C/W Junction to ambient JA (c) R 100 C/W Junction to ambient JA (d) R 69 C/W Junction to ambient JA NOTES: (a) For a device surface mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. (b) Mounted on 25mm x 25mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (c) Mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2 oz copper in still air conditions. (d) As (c) above measured at t<5secs. Issue 2 - March 2008 2 www.zetex.com Zetex Semiconductors plc 2008