ZXTP5240F 40V PNP LOW SATURATION TRANSISTOR IN SOT23 Features Mechanical Data BV > -40V Case: SOT23 CEO I = -2A high Continuous Collector Current Case Material: Molded Plastic, Green Molding Compound. C I = -3A Peak Pulse Current UL Flammability Classification Rating 94V-0 CM Low Saturation Voltage -225mV Max I = -1A. Moisture Sensitivity: Level 1 per J-STD-020 C R = 90m at 0.5A for a Low Equivalent On-Resistance Terminals: Finish Matte Tin Plated Leads, Solderable per CE(SAT) 730mW Power Dissipation MIL-STD-202, Method 208 Complimentary NPN Type: ZXTN4240F Weight 0.008 grams (Approximate) Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. Green Device (Note 3) Application Qualified to AEC-Q101 Standards for High Reliability Gate Driving MOSFETs and IGBTs Load Switch DC-DC Converters Battery Charging SOT23 E C C B B E Top View Device Symbol Top View Pin-Out Ordering Information (Note 4) Product Marking Reel Size (inches) Tape Width (mm) Quantity per Reel ZXTP5240F-7 2D5 7 8 3,000 Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See ZXTP5240F Absolute Maximum Ratings ( TA = +25C, unless otherwise specified.) Characteristic Symbol Value Unit Collector-Base Voltage V -40 V CBO Collector-Emitter Voltage V -40 V CEO Emitter-Base Voltage V -5 V EBO Peak Pulse Collector Current I -3 A CM Continuous Collector Current -2 A IC Base Current -300 mA I B Thermal Characteristics ( T = +25C, unless otherwise specified.) A Characteristic Symbol Value Unit Power Dissipation (Note 5) P 730 mW D Power Dissipation (Note 6) P 600 mW D Thermal Resistance, Junction to Ambient Air (Note 5) R 171 C/W JA Thermal Resistance, Junction to Ambient Air (Note 6) R 209 C/W JA Thermal Resistance, Junction to Lead (Note 7) R 75 C/W JL Operating and Storage Temperature Range T , T -55 to +150 C J STG ESD Ratings (Note 8) Characteristic Symbol Value Unit JEDEC Class Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine Model ESD MM 400 V C Notes: 5. For a device mounted with the collector lead on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB device is measured under still air conditions whilst operating in a steady-state. 6. Same as note (5), except the device is mounted on minimum recommended pad layout. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. 2 of 7 ZXTP5240F April 2018 Diodes Incorporated www.diodes.com Document number: DS39609 Rev. 2 - 2