Effective January 2020 Technical Data 10515 Supersedes February 2016 0603ESDA-MLP ESD suppressor Applications Pb ESD port protection for mobile/smart phones Game console ESD port protection High speed ESD data port protection Set-top-boxes Tablets, notebooks, netbooks, laptops High definition television (HDTV) Media players Digital cameras Medical equipment Computers and peripherals ESD port protection Product features Consumer electronics AEC-Q200 qualified Ultra-low capacitance (0.05 pF) ideal for high speed data applications Ordering Provides Electro Static Discharge (ESD) Specify part number and packaging suffix protection with fast response time (<1 ns) (e.g. 0603ESDA-MLP7) 0603ESDA-MLP = part allowing equipment to pass IEC 61000-4-2 number, 7 = packaging suffix) Level 4 test Singleline, bi-directional device Packaging suffixes 0603 (1608 metric) compact design utilizes 7 (Tape and reel, 5 000 parts per less board space 7 diameter reel) Technical Data 10515 0603ESDA-MLP Effective January 2020 ESD suppressor Product specifications ESD ESD capability capability Rated Attenuation Leakage IEC61000-4- IEC61000-4- voltage Clamping Trigger Capacitance Capacitance change (06 current 2 Direct 2 Air ESD pulse 1 2 3 (V ) voltage voltage 1 MHz (pF) 1 MHz (pF) GHz) (dB) 12 V (nA) discharge discharge withstand dc dc 4 Part number maximum (V) typical (V) typical typical maximum typical typical (kV) typical (kV) typical typical 0603ESDA-MLP 30 35 300 0.05 0.15 -0.2 <0.1 8 15 >1000 1. Clamping voltage: Per IEC61000-4-2, Level 4 waveform (8 kV direct 30 A) measured 30 ns after initial 3. Minor shifting in characteristics may be observed over multiple ESD pulses at very rapid rate. pulse. 4. Part number definition: 0603ESDA-MLP 2. Trigger voltage: Trigger measurement made using Transmission Line Pulse (TLP) method. 0603ESDA= Product code and size -MLP= Form designation Dimensionsmm in Design considerations The location in the circuit for the 0603ESDA-MLP has to be carefully determined. For better performance, the device should be placed as close to the signal input as possible and ahead of any other component. Due to the high current associated with an ESD event, it is recommended to use a 0-stub pad design (pad directly on the signal/data line and second pad directly on common ground). General specifications Operating temperature: - 55 C to +125 C Storage temperature (component): - 55 C to +125 C Load humidity: 12 VDC per EIA/IS- 722 +85 C, 85% relative humidity for 1 000 hours Thermal shock: 10 cycles, - 55 C to +125 C, 30 minute dwell time Moisture resistance: MIL-STD-202G, method 106G, 10 cycles Mechanical shock: EIA/IS- 722 paragraph 4.9 Mechanical vibration: EIA/IS- 722 paragraph 4.10 Resistance to solvent: EIA/IS- 722 paragraph 4.11 2 www.eaton.com/electronics