X-On Electronics has gained recognition as a prominent supplier of G3R45MT17D SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. G3R45MT17D SiC MOSFETs are a product manufactured by GeneSiC Semiconductor. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

G3R45MT17D GeneSiC Semiconductor

G3R45MT17D electronic component of GeneSiC Semiconductor
G3R45MT17D GeneSiC Semiconductor
G3R45MT17D SiC MOSFETs
G3R45MT17D  Semiconductors

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See Product Specifications
Part No. G3R45MT17D
Manufacturer: GeneSiC Semiconductor
Category: SiC MOSFETs
Description: SiC MOSFETs 1700V 45mohm TO-247-3 G3R SiC MOSFET
Datasheet: G3R45MT17D Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 41.09 ea
Line Total: USD 41.09 
Availability - 15
Ship by Wed. 14 May to Fri. 16 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
15
Ship by Wed. 14 May to Fri. 16 May
MOQ : 1
Multiples : 1
1 : USD 41.09
2 : USD 38.85
10 : USD 37.352

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the G3R45MT17D from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the G3R45MT17D and other electronic components in the SiC MOSFETs category and beyond.

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TM G3R45MT17D 1700 V 45 m SiC MOSFET Silicon Carbide MOSFET VDS = 1700 V N-Channel Enhancement Mode DS(ON)(Typ.) R = 45 m ID (TC = 100C) = 37 A Features Package D G3R Technology with +15 V Gate Drive Softer RDS(ON) v/s Temperature Dependency LoRing - Electromagnetically Optimized Design G RoHS Smaller RG(INT) and Lower QG Low Device Capacitances (C , C ) OSS RSS S Superior Cost-Performance Index D = Drain Robust Body Diode with Low VF and Low QRR G = Gate TO-247-3 Industry-Leading UIL & Short-Circuit Robustness S = Source REACH Advantages Applications Compatible with Commercial Gate Drivers Electric Vehicle Fast Charging Low Conduction Losses at all Temperatures Solar Inverters Reduced Ringing Traction Inverters Faster and More Efficient Switching Smart Grid and HVDC Lesser Switching Spikes and Lower Losses High Voltage DC-DC Converters Better Power Density and System Efficiency Switched Mode Power Supply Ease of Paralleling without Thermal Runaway Wind Energy Converters Higher System Reliability Pulsed Power Absolute Maximum Ratings (At T = 25C Unless Otherwise Stated) C Parameter Symbol Conditions Values Unit Note Drain-Source Voltage V V = 0 V, I = 100 A 1700 V DS(max) GS D Gate-Source Voltage (Dynamic) VGS(max) -10 / +20 V Gate-Source Voltage (Static) V Recommended Operation -5 / +15 V GS(op) T = 25C, V = -5 / +15 V 52 C GS Continuous Forward Current ID TC = 100C, VGS = -5 / +15 V 37 A Fig. 15 TC = 135C, VGS = -5 / +15 V 27 Pulsed Drain Current I t 3s, D 1%, V = 15 V, Note 1 120 A Fig. 14 D(pulse) P GS Power Dissipation P T = 25C 364 W Fig. 16 D c Non-Repetitive Avalanche Energy EAS L = 3.9 mH, IAS = 17.5 A 592 mJ Operating and Storage Temperature T , T -55 to 175 C j stg Thermal/Package Characteristics Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Thermal Resistance, Junction - Case R 0.30 0.41 C/W Fig. 13 thJC Weight WT 6.1 g Mounting Torque T Screws to Heatsink 1.1 Nm M Note 1: Pulse Width t Limited by T P j(max) Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R45MT17D/G3R45MT17D.pdf Page 1 of 14TM G3R45MT17D 1700 V 45 m SiC MOSFET Electrical Characteristics (At T = 25C Unless Otherwise Stated) C Values Parameter Symbol Conditions Unit Note Min. Typ. Max. Drain-Source Breakdown Voltage V V = 0 V, I = 100 A 1700 V DSS GS D Zero Gate Voltage Drain Current I V = 1700 V, V = 0 V 1 A DSS DS GS V = 0 V, V = 20 V 100 DS GS Gate Source Leakage Current IGSS nA V = 0 V, V = -10 V -100 DS GS VDS = VGS, ID = 30.0 mA 1.8 2.70 Gate Threshold Voltage V V Fig. 9 GS(th) VDS = VGS, ID = 30.0 mA, Tj = 175C 1.90 V = 10 V, I = 35 A 16.8 DS D Transconductance g S Fig. 4 fs V = 10 V, I = 35 A, T = 175C 17.4 DS D j V = 15 V, I = 35 A 45 62 GS D Drain-Source On-State Resistance R m Fig. 5-8 DS(ON) V = 15 V, I = 35 A, T = 175C 94 GS D j Input Capacitance Ciss 3199 Output Capacitance C 86 pF Fig. 11 oss Reverse Transfer Capacitance C 15.3 rss Coss Stored Energy Eoss 57 J Fig. 12 V = 1000 V, V = 0 V DS GS C Stored Charge Q 172 nC oss oss f = 1 MHz, VAC = 25mV Effective Output Capacitance (Energy Co(er) 114 Related) pF Note 2 Effective Output Capacitance (Time Co(tr) 172 Related) Gate-Source Charge Q 33 gs V = 1000 V, V = -5 / +15 V DS GS Gate-Drain Charge Q I = 35 A 37 nC Fig. 10 gd D Per IEC607478-4 Total Gate Charge Q 106 g Internal Gate Resistance R f = 1 MHz, V = 25 mV 1.3 G(int) AC Turn-On Switching Energy EOn 751 (Body Diode) T = 25C, V = -5/+15V, R = 1 , L = j GS G(ext) J Fig. 22,26 60.0 H, I = 35 A, V = 1200 V Turn-Off Switching Energy D DD EOff 345 (Body Diode) Turn-On Delay Time t 33 d(on) V = 1200 V, V = -5/+15V DD GS Rise Time tr 19 RG(ext) = 1 , L = 60.0 H, ID = 35 A ns Fig. 24 Turn-Off Delay Time t 17 d(off) Timing relative to V , Inductive load DS Fall Time t 12 f *The chip technology was characterized up to 200 V/ns. The measured dV/dt was limited by measurement test setup and package. Note 2: C , a lumped capacitance that gives same stored energy as C while V is rising from 0 to 1000V. o(er) OSS DS C , a lumped capacitance that gives same charging times as C while V is rising from 0 to 1000V. o(tr) OSS DS Rev 21/May Latest Version at: www.genesicsemi.com/sic-mosfet/G3R45MT17D/G3R45MT17D.pdf Page 2 of 14

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

DIODES, TRANSISTORS AND SIMILAR SEMICONDUCTOR DEVICES; PHOTOSENSITIVE SEMICONDUCTOR DEVICES,
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