X-On Electronics has gained recognition as a prominent supplier of NVBG040N120SC1 SiC MOSFETs across the USA, India, Europe, Australia, and various other global locations. NVBG040N120SC1 SiC MOSFETs are a product manufactured by ON Semiconductor. We provide cost-effective solutions for SiC MOSFETs, ensuring timely deliveries around the world.

NVBG040N120SC1 ON Semiconductor

NVBG040N120SC1 electronic component of ON Semiconductor
NVBG040N120SC1 ON Semiconductor
NVBG040N120SC1 SiC MOSFETs
NVBG040N120SC1  Semiconductors

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See Product Specifications
Part No. NVBG040N120SC1
Manufacturer: ON Semiconductor
Category: SiC MOSFETs
Description: SiC MOSFETs Silicon Carbide (SiC) MOSFET, N-Channel - EliteSiC, 40 mohm, 1200 V, M1, D2PAK-7L Silicon Carbide MOSFET, N?Channel, 1200 V, 40 m?, D2PAK?7L
Datasheet: NVBG040N120SC1 Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)
1: USD 24.5973 ea
Line Total: USD 24.6 
Availability - 0
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
0
Ship by Thu. 26 Jun to Wed. 02 Jul
MOQ : 800
Multiples : 800
800 : USD 44.2509

0
Ship by Thu. 03 Jul to Tue. 08 Jul
MOQ : 1
Multiples : 1
1 : USD 24.1626
30 : USD 23.2281

0
Ship by Tue. 24 Jun to Thu. 26 Jun
MOQ : 1
Multiples : 1
1 : USD 24.5973
10 : USD 20.0516
25 : USD 20.0061
100 : USD 18.4838
250 : USD 18.4838
800 : USD 18.4838
2400 : USD 18.4838
4800 : USD 18.2225

   
Manufacturer
Product Category
Mounting Style
Transistor Polarity
Number of Channels
Vds - Drain-Source Breakdown Voltage
Id - Continuous Drain Current
Rds On - Drain-Source Resistance
Vgs - Gate-Source Voltage
Vgs th - Gate-Source Threshold Voltage
Qg - Gate Charge
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Channel Mode
Tradename
Package / Case
Hts Code
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the NVBG040N120SC1 from our SiC MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the NVBG040N120SC1 and other electronic components in the SiC MOSFETs category and beyond.

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MOSFET SiC Power, Single N-Channel, D2PAK-7L 1200 V, 40 m , 60 A NVBG040N120SC1 Features Typ. R = 40 m DS(on) www.onsemi.com Ultra Low Gate Charge (Typ. Q = 106 nC) G(tot) Low Effective Output Capacitance (Typ. C = 139 pF) oss V R MAX I MAX (BR)DSS DS(ON) D 100% Avalanche Tested AECQ101 Qualified and PPAP Capable 1200 V 56 m 20 V 60 A This Device is PbFree and is RoHS Compliant Drain (TAB) Typical Applications Automotive On Board Charger Automotive DC/DC Converter for EV/HEV Gate (Pin 1) MAXIMUM RATINGS (T = 25C unless otherwise noted) J Parameter Symbol Value Unit Driver Source (Pin 2) DraintoSource Voltage V 1200 V DSS GatetoSource Voltage V +25/15 V Power Source (Pins 3, 4, 5, 6, 7) GS Recommended Operation Values T < 175C V +20/5 V C GSop NCHANNEL MOSFET of Gate Source Voltage Continuous Drain Steady T = 25C I 60 A C D State Current (Note 1) Power Dissipation P 357 W D (Note 1) Steady T = 100C Continuous Drain I 43 A C D Current (Note 1) State Power Dissipation P 178 W D D2PAK7L (Note 1) CASE 418BJ Pulsed Drain Current (Note 2) T = 25C I 240 A A DM Single Pulse Surge T = 25C, t = 10 s, I 416 A A p DSC MARKING DIAGRAM Drain Current Capa- R = 4.7 G bility AYWWZZ Operating Junction and Storage Temperature T , T 55 to C J stg Range +175 NVBG 040120SC1 Source Current (Body Diode) I 36 A S Single Pulse DraintoSource Avalanche E 578 mJ AS A = Assembly Location Energy (I = 34 A , L = 1 mH) (Note 3) L pk Y = Year Maximum Lead Temperature for Soldering, T 300 C L WW = Work Week 1/8 from Case for 10 Seconds ZZ = Lot Traceability NVBG040120SC1 = Specific Device Code Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The entire application environment impacts the thermal resistance values shown, ORDERING INFORMATION they are not constants and are only valid for the particular conditions noted. See detailed ordering and shipping information on page 6 of 2. Repetitive rating, limited by max junction temperature. this data sheet. 3. E of 578 mJ is based on starting T = 25C L = 1 mH, I = 34 A, V = AS J AS DD 120 V, V = 18 V. GS Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: May, 2021 Rev. 1 NVBG040N120SC1/DNVBG040N120SC1 Table 1. THERMAL CHARACTERISTICS Parameter Symbol Max Units Thermal Resistance JunctiontoCase (Note 1) R 0.42 C/W JC Thermal Resistance JunctiontoAmbient (Note 1) R 40 C/W JA Table 2. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise stated) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 1 mA 1200 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T I = 1 mA, refer to 25C 0.45 V/C (BR)DSS J D Temperature Coefficient Zero Gate Voltage Drain Current I V = 0 V T = 25C 100 A DSS GS J V = 1200 V DS T = 175C 1 mA J GatetoSource Leakage Current I V = +25/15 V, V = 0 V 1 A GSS GS DS ON CHARACTERISTICS (Note 2) Gate Threshold Voltage V V = V , I = 10 mA 1.8 3 4.3 V GS(TH) GS DS D Recommended Gate Voltage V 5 +20 V GOP DraintoSource On Resistance R V = 20 V, I = 35 A, T = 25C 40 56 m DS(on) GS D J V = 20 V, I = 35 A, T = 175C 71 100 m GS D J Forward Transconductance g V = 20 V, I = 35 A 20 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C V = 0 V, f = 1 MHz, 1789 pF ISS GS V = 800 V DS Output Capacitance C 139 OSS Reverse Transfer Capacitance C 12.5 RSS Total Gate Charge Q V = 5/20 V, V = 600 V, 106 nC G(TOT) GS DS I = 47 A D Threshold Gate Charge Q 18 G(TH) GatetoSource Charge Q 34 GS GatetoDrain Charge Q 26 GD GateResistance R f = 1 MHz 2 G SWITCHING CHARACTERISTICS TurnOn Delay Time t V = 5/20 V, V = 800 V, 17 30 ns d(ON) GS DS I = 47 A, R = 4.7 , D G Rise Time t 20 36 r Inductive Load TurnOff Delay Time t 30 48 d(OFF) Fall Time t 9 18 f TurnOn Switching Loss E 366 J ON TurnOff Switching Loss E 200 OFF Total Switching Loss E 566 TOT DRAINSOURCE DIODE CHARACTERISTICS Continuous DrainSource Diode Forward I V = 5 V, T = 25C 36 A SD GS J Current Pulsed DrainSource Diode Forward Current I V = 5 V, T = 25C 240 A SDM GS J (Note 2) Forward Diode Voltage V V = 5 V, I = 17.5 A, T = 25C 3.7 V SD GS SD J www.onsemi.com 2

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