BSL215C H6327 Infineon

BSL215C H6327 electronic component of Infineon
BSL215C H6327 Infineon
BSL215C H6327 MOSFETs
BSL215C H6327  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of BSL215C H6327 MOSFETs across the USA, India, Europe, Australia, and various other global locations. BSL215C H6327 MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

Part No. BSL215C H6327
Manufacturer: Infineon
Category: MOSFETs
Description: Infineon Technologies MOSFET SMALL SIGNALP-CH
Datasheet: BSL215C H6327 Datasheet (PDF)
Price (USD)
1: USD 0.6638 ea
Line Total: USD 0.66 
Availability : 750
  
Ship by Tue. 30 Sep to Mon. 06 Oct
QtyUnit Price
1$ 0.6638
10$ 0.5276
30$ 0.471
100$ 0.2979
500$ 0.2471
1000$ 0.2339

Availability 750
Ship by Tue. 30 Sep to Mon. 06 Oct
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 0.6638
10$ 0.5276
30$ 0.471
100$ 0.2979
500$ 0.2471
1000$ 0.2339

   
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Package Case
Series
Transistor Type
Brand
Forward Transconductance Min
Fall Time
Id Continuous Drain Current
Pd Power Dissipation
Qg Gate Charge
Rds On Drain Source Resistance
Rise Time
Typical Turn Off Delay Time
Typical Turn On Delay Time
Vds Drain Source Breakdown Voltage
Vgs Gate Source Voltage
Vgs Th Gate Source Threshold Voltage
Rohs Mouser
Height
Length
Width
Forward Transconductance - Min
Cnhts
Hts Code
Mxhts
Product Type
Factory Pack Quantity :
Subcategory
Taric
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
LoadingGif
 
Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the BSL215C H6327 from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the BSL215C H6327 and other electronic components in the MOSFETs category and beyond.

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BSL215C OptiMOS2 + OptiMOS-P 2 Small Signal Transistor Product Summary Features P N Complementary P + N channel V -20 20 V DS Enhancement mode R V =4.5 V 150 140 mW DS(on),max GS Super Logic level (2.5V rated) V =2.5 V 280 250 GS Avalanche rated I -1.5 1.5 A D Qualified according to AEC Q101 100% lead-free RoHS compliant PG-TSOP6 Halogen free according to IEC61249-2-21 6 5 4 1 2 3 Type Package Tape and Reel Information Marking Lead Free Packing BSL215C PG-TSOP-6 H6327: 3000 pcs / reel sPH Yes Non dry 1) Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit P N I T =25C Continuous drain current -1.5 1.5 A D A T =70C -1.2 1.2 A I T =25C Pulsed drain current -6 6 D,pulse A P: I =-1.5A, D E N: I =1.5A, Avalanche energy, single pulse 11 3.7 mJ AS D R =25W GS Gate source voltage V 12 V GS P T =25C Power dissipation 0.5 W tot A T , T -55 ... 150 Operating and storage temperature C j stg ESD class JESD22-A114-HBM 0 (<250V) Soldering temperature T 260 C solder 55/150/56 IEC climatic category DIN IEC 68-1 1) Remark: only one of both transistors active Rev.2.2 page 1 2013-11-06BSL215C Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics P Thermal resistance, junction - 2) R - - 250 K/W thJA minimal footprint ambient N Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics V V =0V, I =-250A Drain-source breakdown voltage P - - -20 V (BR)DSS GS D V =0V, I =250A N 20 - - GS D V V =V , I =-11A Gate threshold voltage P -1.2 -0.9 -0.6 GS(th) DS GS D N V =V , I =3.7A 0.7 0.95 1.2 DS GS D V =-20V, V =0V, DS GS Zero gate voltage drain current P I - - -1 A DSS T =25C j V =20V, V =0V, DS GS N - - 1 T =25C j V =-20V, V =0V, DS GS P - - -100 T =150C j V =20V, V =0V, DS GS N - - 100 T =150C j Gate-source leakage current P I V =12V, V =0V - - 100 nA GSS GS DS N P R V =-2.5V, I =-1.1A - 163 280 mW DS(on) GS D Drain-source on-state resistance N V =2.5V, I =0.7A - 173 250 GS D V =-4.5V, I =-1.5A P - 102 150 GS D V =4.5V, I =1.5A N - 108 140 GS D V >2 I R , DS D DS(on)max Transconductance P g - 4.5 - S fs I =-1.2A D V >2 I R , DS D DS(on)max N - 4 - I =1.2A D 2) 2 Performed on 40mm FR4 PCB. The traces are 1mm wide, 70 m thick and 20mm long they are present on both sides of the PCB Rev.2.2 page 2 2013-11-06

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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