PD - 95536 IRFB23N20DPbF IRFS23N20DPbF SMPS MOSFET IRFSL23N20DPbF HEXFET Power MOSFET Applications V R max I DSS DS(on) D High frequency DC-DC converters 200V 0.10 24A Lead-Free Benefits Low Gate-to-Drain Charge to Reduce Switching Losses Fully Characterized Capacitance Including Effective C to Simplify Design, (See OSS App. Note AN1001) Fully Characterized Avalanche Voltage 2 and Current TO-220AB D Pak TO-262 IRFB23N20D IRFS23N20D IRFSL23N20D Absolute Maximum Ratings Parameter Max. Units I T = 25C Continuous Drain Current, V 10V 24 D C GS I T = 100C Continuous Drain Current, V 10V 17 A D C GS I Pulsed Drain Current 96 DM P T = 25C Power Dissipation 3.8 W D A P T = 25C Power Dissipation 170 D C Linear Derating Factor 1.1 W/C V Gate-to-Source Voltage 30 V GS dv/dt Peak Diode Recovery dv/dt 3.3 V/ns T Operating Junction and -55 to + 175 J T Storage Temperature Range STG C Soldering Temperature, for 10 seconds 300 (1.6mm from case ) Mounting torqe, 6-32 or M3 screw 10 lbfin (1.1Nm) Typical SMPS Topologies Telecom 48V input Forward Converter Notes through are on page 11 www.irf.com 1 IRFB/IRFS/IRFSL23N20DPbF Static T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions V Drain-to-Source Breakdown Voltage 200 V V = 0V, I = 250A (BR)DSS GS D V /T Breakdown Voltage Temp. Coefficient 0.26 V/C Reference to 25C, I = 1mA (BR)DSS J D R Static Drain-to-Source On-Resistance 0.10 V = 10V, I = 14A DS(on) GS D V Gate Threshold Voltage 3.0 5.5 V V = V , I = 250A GS(th) DS GS D 25 V = 200V, V = 0V DS GS I Drain-to-Source Leakage Current A DSS 250 V = 160V, V = 0V, T = 150C DS GS J Gate-to-Source Forward Leakage 100 V = 30V GS I nA GSS Gate-to-Source Reverse Leakage -100 V = -30V GS Dynamic T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions g Forward Transconductance 13 S V = 50V, I = 14A fs DS D Q Total Gate Charge 57 86 I = 14A g D Q Gate-to-Source Charge 14 21 nC V = 160V gs DS Q Gate-to-Drain Mille) Charge 27 40 V = 10V, gd GS t Turn-On Delay Time 14 V = 100V d(on) DD t Rise Time 32 I = 14A r D ns t Turn-Off Delay Time 26 R = 4.6 d(off) G t Fall Time 16 V = 10V f GS C Input Capacitance 1960 V = 0V iss GS C Output Capacitance 300 V = 25V oss DS C Reverse Transfer Capacitance 65 pF = 1.0MHz rss C Output Capacitance 2200 V = 0V, V = 1.0V, = 1.0MHz oss GS DS C Output Capacitance 120 V = 0V, V = 160V, = 1.0MHz oss GS DS C eff. Effective Output Capacitance 220 V = 0V, V = 0V to 160V oss GS DS Avalanche Characteristics Parameter Typ. Max. Units E Single Pulse Avalanche Energy 250 mJ AS I Avalanche Current 14 A AR E Repetitive Avalanche Energy 17 mJ AR Thermal Resistance Parameter Typ. Max. Units R Junction-to-Case 0.90 JC R Case-to-Sink, Flat, Greased Surface 0.50 C/W CS R Junction-to-Ambient 62 JA R Junction-to-Ambient 40 JA Diode Characteristics Parameter Min. Typ. Max. Units Conditions D I Continuous Source Current MOSFET symbol S 24 (Body Diode) showing the G I Pulsed Source Current integral reverse SM 96 S (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 14A, V = 0V SD J S GS t Reverse Recovery Time 200 300 ns T = 25C, I = 14A rr J F Q Reverse RecoveryCharge 1300 1940 nC di/dt = 100A/s rr t Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L +L ) on S D 2 www.irf.com