IRFSL4020PBF Infineon

IRFSL4020PBF electronic component of Infineon
IRFSL4020PBF Infineon
IRFSL4020PBF MOSFETs
IRFSL4020PBF  Semiconductors
Images are for reference only, See Product Specifications

X-On Electronics has gained recognition as a prominent supplier of IRFSL4020PBF MOSFETs across the USA, India, Europe, Australia, and various other global locations. IRFSL4020PBF MOSFETs are a product manufactured by Infineon. We provide cost-effective solutions for MOSFETs, ensuring timely deliveries around the world.

Part No. IRFSL4020PBF
Manufacturer: Infineon
Category: MOSFETs
Description: Transistor: N-MOSFET; unipolar; 200V; 18A; 100W; TO262
Datasheet: IRFSL4020PBF Datasheet (PDF)
Price (USD)
100: USD 1.1778 ea
Line Total: USD 117.78 
Availability : 0
  
QtyUnit Price
100$ 1.1778

Availability 0
Ship by Tue. 02 Sep to Thu. 04 Sep
MOQ : 1
Multiples : 1
QtyUnit Price
1$ 5.173
3$ 3.066
4$ 2.0002
26$ 1.2874


Availability 0
Ship by Thu. 04 Sep to Wed. 10 Sep
MOQ : 100
Multiples : 50
QtyUnit Price
100$ 1.1778

   
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Transistor Type
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Typical Turn-On Delay Time
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Notes:- Show Stocked Products With Similar Attributes.

We are delighted to provide the IRFSL4020PBF from our MOSFETs category, at competitive rates not only in the United States, Australia, and India, but also across Europe and beyond. A long established and extensive electronic component distribution network has enhanced our global reach and dependability, ensuring cost savings through prompt deliveries worldwide. Client satisfaction is at the heart of our business, where every component counts and every customer matters. Our technical service team is ready to assist you. From product selection to after-sales support, we strive to deliver a seamless and satisfying experience. Are you ready to experience the best in electronic component distribution? Contact X-ON Electronics today and discover why X-On are a preferred choice for the IRFSL4020PBF and other electronic components in the MOSFETs category and beyond.

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IRFS4020PbF IRFSL4020PbF Features Key Parameters Key parameters optimized for Class-D audio V 200 V DS amplifier applications m R typ. 10V 85 DS(ON) Low R for improved efficiency DSON Q typ. 18 nC g Low Q and Q for better THD and improved Q typ. 6.7 nC G SW sw R typ. 3.2 efficiency G(int) T max 175 C J Low Q for better THD and lower EMI RR 175C operating junction temperature for D D ruggedness D Can deliver up to 300W per channel into 8 load in half-bridge configuration amplifier S S D D G G G 2 D Pak TO-262 S IRFS4020PbF IRFSL4020PbF GD S Gate Drain Source Description This Digital Audio MOSFET is specifically designed for Class-D audio amplifier applications. This MOSFET utilizes the latest processing techniques to achieve low on-resistance per silicon area. Furthermore, Gate charge, body-diode reverse recovery and internal Gate resistance are optimized to improve key Class-D audio amplifier performance factors such as efficiency, THD and EMI. Additional features of this MOSFET are 175C operating junction temperature and repetitive avalanche capability. These features combine to make this MOSFET a highly efficient, robust and reliable device for ClassD audio amplifier applications. Absolute Maximum Ratings Parameter Max. Units V Drain-to-Source Voltage 200 V DS V Gate-to-Source Voltage 20 GS I T = 25C Continuous Drain Current, V 10V 18 A D C GS I T = 100C Continuous Drain Current, V 10V 13 D C GS Pulsed Drain Current I 52 DM Power Dissipation P T = 25C 100 W D C Power Dissipation P T = 100C 52 D C Linear Derating Factor 0.70 W/C T Operating Junction and -55 to + 175 J T Storage Temperature Range C STG Soldering Temperature, for 10 seconds 300 (1.6mm from case) Thermal Resistance Parameter Typ. Max. Units Junction-to-Case R 1.43 C/W JC Junction-to-Ambient (PCB Mount) R 40 JA Notes through are on page 2 www.irf.com 1 05/14/09 Electrical Characteristics T = 25C (unless otherwise specified) J Parameter Min. Typ. Max. Units Conditions BV Drain-to-Source Breakdown Voltage 200 V V = 0V, I = 250A DSS GS D V / T Breakdown Voltage Temp. Coefficient 0.23 V/C Reference to 25C, I = 1mA DSS J D m R Static Drain-to-Source On-Resistance 85 105 V = 10V, I = 11A DS(on) GS D V Gate Threshold Voltage 3.0 4.9 V V = V , I = 100A GS(th) DS GS D V / T Gate Threshold Voltage Coefficient -13 mV/C GS(th) J I Drain-to-Source Leakage Current 20 A V = 200V, V = 0V DSS DS GS 250 V = 200V, V = 0V, T = 125C DS GS J I Gate-to-Source Forward Leakage 100 nA V = 20V GSS GS Gate-to-Source Reverse Leakage -100 V = -20V GS g Forward Transconductance 24 S V = 50V, I = 11A fs DS D Q Total Gate Charge 18 29 g Q Pre-Vth Gate-to-Source Charge 4.5 V = 100V gs1 DS Q Post-Vth Gate-to-Source Charge 1.4 nC V = 10V gs2 GS Q Gate-to-Drain Charge 5.3 I = 11A gd D Q Gate Charge Overdrive 6.8 See Fig. 6 and 18 godr Q Switch Charge (Q + Q ) 6.7 sw gs2 gd R Internal Gate Resistance 3.2 G(int) t Turn-On Delay Time 7.8 V = 100V, V = 10V d(on) DD GS t Rise Time 12 I = 11A r D t Turn-Off Delay Time 16 ns R = 2.4 d(off) G t Fall Time 6.3 f C Input Capacitance 1200 V = 0V iss GS C Output Capacitance 91 pF V = 50V oss DS C Reverse Transfer Capacitance 20 = 1.0MHz, See Fig.5 rss C eff. Effective Output Capacitance 110 V = 0V, V = 0V to 160V oss GS DS L Internal Drain Inductance 4.5 Between lead, D D nH 6mm (0.25in.) G L Internal Source Inductance 7.5 from package S S and center of die contact Avalanche Characteristics Parameter Typ. Max. Units Single Pulse Avalanche Energy E 94 mJ AS Avalanche Current I See Fig. 14, 15, 16a, 16b A AR Repetitive Avalanche Energy E mJ AR Diode Characteristics Parameter Min. Typ. Max. Units Conditions I T = 25C Continuous Source Current 18 MOSFET symbol S C (Body Diode) A showing the I Pulsed Source Current 52 integral reverse SM (Body Diode) p-n junction diode. V Diode Forward Voltage 1.3 V T = 25C, I = 11A, V = 0V SD J S GS t Reverse Recovery Time 82 120 ns T = 25C, I = 11A rr J F Q Reverse Recovery Charge 280 420 nC di/dt = 100A/s rr Repetitive rating pulse width limited by max. junction temperature. R is measured at Starting T = 25C, L = 1.62mH, R = 25 , I = 11A. Limited by Tjmax. See Figs. 14, 15, 17a, 17b for repetitive J G AS Pulse width 400s duty cycle 2%. avalanche information. 2 www.irf.com

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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