SPD06N80C3 TM CoolMOS Power Transistor Product Summary Features V 800 V DS New revolutionary high voltage technology R T = 25C 0.9 DS(on)max j Extreme dv/dt rated Q 31 nC g,typ High peak current capability 1) Qualified according to JEDEC for target applications Pb-free lead plating RoHS compliant PG-TO252-3 Ultra low gate charge Ultra low effective capacitances TM CoolMOS 800V designed for: Industrial application with high DC bulk voltage Switching Application ( i.e. active clamp forward ) Type Package Marking SPD06N80C3 PG-TO252-3 06N80C3 Maximum ratings, at T =25 C, unless otherwise specified j Parameter Symbol Conditions Value Unit I T =25C 6 Continuous drain current A D A T =100C 3.8 A 2) 18 I T =25C Pulsed drain current D,pulse A E I =1.2A, V =50V Avalanche energy, single pulse 230 mJ AS D DD 2),3) E I =6A, V =50V 0.2 Avalanche energy, repetitive t AR D DD AR 2),3) I 6 A Avalanche current, repetitive t AR AR MOSFET dv /dt ruggedness dv /dt V =0640V 50 V/ns DS V 20 Gate source voltage static V GS 30 AC (f >1 Hz) Power dissipation P T =25C 83 W tot A T , T Operating and storage temperature -55 ... 150 C j stg Rev. 2.91 page 1 2011-09-27SPD06N80C3 Maximum ratings, at T =25 C, unless otherwise specified j Value Parameter Symbol Conditions Unit Continuous diode forward current I 6 A S T =25C A 2) I 18 Diode pulse current S,pulse 4) dv /dt 4 V/ns Reverse diode dv /dt Values Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics R Thermal resistance, junction - case - - 1.5 K/W thJC SMD version, device R on PCB, minimal - - 62 thJA footprint Thermal resistance, junction - ambient SMD version, device 2 on PCB, 6 cm cooling - 35 - 5) area Soldering temperature, reflow T reflow MSL1 - - 260 C sold soldering Electrical characteristics, at T =25 C, unless otherwise specified j Static characteristics Drain-source breakdown voltage V V =0V, I =250A 800 - - V (BR)DSS GS D V V =0V, I =6A Avalanche breakdown voltage - 870 - (BR)DS GS D V V =V , I =0.25mA Gate threshold voltage 2.1 3 3.9 GS(th) DS GS D V =800V, V =0V, DS GS I Zero gate voltage drain current - - 10 A DSS T =25C j V =800V, V =0V, DS GS - 50 - T =150C j I V =20V, V =0V Gate-source leakage current - - 100 nA GSS GS DS V =10V, I =3.8A, GS D R Drain-source on-state resistance - 0.78 0.9 DS(on) T =25C j V =10V, I =3.8A, GS D - 2.1 - T =150C j R Gate resistance f =1MHz, open drain - 1.2 - G Rev. 2.91 page 2 2011-09-27