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MOSFET - Power, Single 2 N-Channel, D PAK7 60 V, 3.7 m , 127 A NTBGS3D5N06C Features www.onsemi.com Low R to Minimize Conduction Losses DS(on) Low Q and Capacitance to Minimize Driver Losses G Lowers Switching Noise/EMI V R MAX I MAX (BR)DSS DS(ON) D These Devices are PbFree, Halogen Free/BFR Free and are RoHS 3.7 m 12 V Compliant 60 V 127 A 4.1 m 10 V Typical Applications Power Tools, Battery Operated Vacuums 1. Gate D (Pin 4, tab) UAV/Drones, Material Handling 2. Source BMS/Storage, Home Automation 3. Source 4. Drain 5. Source MAXIMUM RATINGS (T = 25C unless otherwise noted) J 6. Source G (Pin 1) Parameter Symbol Value Unit 7. Source DraintoSource Voltage V 60 V DSS S (Pins 2,3,5,6,7) GatetoSource Voltage V 20 V GS NCHANNEL MOSFET Continuous Drain I 127 A D Current R (Note 2) JC Steady T = 25C C State Power Dissipation P 115 W D MARKING R (Note 2) JC 4 DIAGRAM Continuous Drain I 22 A D Current R JA 1 (Notes 1, 2) Steady 2 BGS3D5 3 T = 25C A 5 State N06C 6 7 Power Dissipation P 3.7 W D AYWWG 2 R (Notes 1, 2) D PAK7 JA CASE 221BP Pulsed Drain Current T = 25C, t = 100 s I 491 A A p DM BGS3D5N06C= Specific Device Code Operating Junction and Storage Temperature T , T 55 to C J stg A = Assembly Location Range +175 Y = Year Source Current (Body Diode) I 95 A WW = Work Week S G = PbFree Package Single Pulse DraintoSource Avalanche E 176 mJ AS Energy (I = 18.8 A , L = 1 mH) L pk Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) ORDERING INFORMATION Stresses exceeding those listed in the Maximum Ratings table may damage the Device Package Shipping device. If any of these limits are exceeded, device functionality should not be 2 assumed, damage may occur and reliability may be affected. NTBGS3D5N06C D PAK7 800 / Tape & 2 1. Surfacemounted on FR4 board using a 1 in , 1 oz. Cu pad. Reel (PbFree) 2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: November, 2020 Rev. 1 NTBGS3D5N06C/D