Product Information

NTH4L160N120SC1

NTH4L160N120SC1 electronic component of ON Semiconductor

Datasheet
MOSFET SIC MOS TO247-4L 1200V 160MOHM INDUSTRY PART

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 13.5688 ea
Line Total: USD 13.57

510 - Global Stock
Ships to you between
Thu. 23 May to Mon. 27 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
615 - WHS 1


Ships to you between Thu. 23 May to Mon. 27 May

MOQ : 1
Multiples : 1

Stock Image

NTH4L160N120SC1
ON Semiconductor

1 : USD 6.877
10 : USD 6.854
25 : USD 5.957
100 : USD 5.7615
250 : USD 5.7615
450 : USD 5.29
900 : USD 5.1865
2700 : USD 5.0025

     
Manufacturer
Product Category
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Hts Code
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MOSFET SiC Power, Single N-Channel, TO247-4L 1200 V, 160 m , 17.3 A NTH4L160N120SC1 Features Typ. R = 160 m www.onsemi.com DS(on) Ultra Low Gate Charge (Q = 34 nC) G(tot) High Speed Switching with Low Capacitance (C = 49.5 pF) oss V R MAX I MAX (BR)DSS DS(ON) D 100% Avalanche Tested 1200 V 224 m 20 V 17.3 A T = 175C J This Device is PbFree and is RoHS Compliant D Typical Applications UPS DC/DC Converter G Boost Inverter S1: Kelvin Source MAXIMUM RATINGS (T = 25C unless otherwise noted) S2: Power Source J S1 S2 Parameter Symbol Value Unit NCHANNEL MOSFET DraintoSource Voltage V 1200 V DSS GatetoSource Voltage V 15/+25 V GS Recommended Operation Values T < 175C V 5/+20 V C GSop of GatetoSource Voltage Steady T = 25C Continuous Drain I 17.3 A C D Current (Note 2) State D Power Dissipation P 111 W S2 D S1 (Note 2) G TO2474L Steady T = 100C Continuous Drain I 12.3 A C D CASE 340CJ Current (Notes 1, 2) State Power Dissipation P 55.5 W D MARKING DIAGRAM (Notes 1, 2) Pulsed Drain Current T = 25C I 69 A A DM (Note 3) Operating Junction and Storage Temperature T , T 55 to C J stg Range +175 AYWWZZ NTH4L160 Source Current (Body Diode) I 11 A S N120SC1 Single Pulse DraintoSource Avalanche E 128 mJ AS Energy (I = 16 A, L = 5 mH) (Note 4) L(pk) Maximum Lead Temperature for Soldering T 300 C L (1/8 from case for 5 s) A = Assembly Location Stresses exceeding those listed in the Maximum Ratings table may damage the Y = Year device. If any of these limits are exceeded, device functionality should not be WW = Work Week assumed, damage may occur and reliability may be affected. ZZ = Lot Traceability 1. JA is constant value to follow guide table of LV/HV discrete final datasheet NTH4L160N120SC1 = Specific Device Code generation . 2. The entire application environment impacts the thermal resistance values shown, they are not constants and are only valid for the particular conditions noted. ORDERING INFORMATION 3. Repetitive rating, limited by max junction temperature. Device Package Shipping 4. EAS of 128 mJ is based on starting T = 25C L = 5 mH, I = 16 A, J AS V = 120 V, V = 18 V. DD GS NTH4L160N120SC1 TO2474L 30 ea / Tube Semiconductor Components Industries, LLC, 2019 1 Publication Order Number: April, 2021 Rev. 3 NTH4L160N120SC1/DNTH4L160N120SC1 THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Max Unit JunctiontoCase Steady State (Note 2) R 1.35 C/W JC JunctiontoAmbient Steady State (Notes 1, 2) R 40 JA ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 1 mA 1200 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T I = 1 mA, referenced to 25C 0.6 V/C (BR)DSS J D Temperature Coefficient Zero Gate Voltage Drain Current I V = 0 V, T = 25C 100 A DSS GS J V = 1200 V DS T = 175C 1 mA J GatetoSource Leakage Current I V = +25/15 V, V = 0 V 1 A GSS GS DS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V V = V , I = 2.5 mA 1.8 3.1 4.3 V GS(TH) GS DS D Recommended Gate Voltage V 5 +20 V GOP DraintoSource On Resistance R V = 20 V, I = 12 A, T = 25C 160 224 m DS(on) GS D J V = 20 V, I = 12 A, T = 175C 271 377 GS D J Forward Transconductance g V = 20 V, I = 12 A 3.2 S FS DS D CHARGES, CAPACITANCES & GATE RESISTANCE Input Capacitance C V = 0 V, f = 1 MHz, V = 800 V 665 pF ISS GS DS Output Capacitance C 49.5 OSS Reverse Transfer Capacitance C 4.3 RSS Total Gate Charge Q V = 5/20 V, V = 600 V, 34 nC G(TOT) GS DS I = 16 A D Threshold Gate Charge Q 6 G(TH) GatetoSource Charge Q 12.5 GS GatetoDrain Charge Q 9.6 GD GateResistance R f = 1 MHz 1.4 G SWITCHING CHARACTERISTICS, VGS = 10 V TurnOn Delay Time t V = 5/20 V, 11 20 ns d(ON) GS V = 800 V, DS Rise Time t 10 20 r I = 16 A, D R = 6 G TurnOff Delay Time t 14 25 d(OFF) inductive load Fall Time t 7 14 f TurnOn Switching Loss E 104 J ON TurnOff Switching Loss E 32 OFF Total Switching Loss E 136 tot DRAINSOURCE DIODE CHARACTERISTICS Continuous DrainSource Diode Forward I V = 5 V, T = 25C 11 A SD GS J Current Pulsed DrainSource Diode Forward I 69 SDM Current (Note 3) Forward Diode Voltage V V = 5 V, I = 6 A, T = 25C 4 V SD GS SD J V = 5/20 V, I = 16 A, Reverse Recovery Time t 15 ns RR GS SD dI /dt = 1000 A/ s S Reverse Recovery Charge Q 47 nC RR www.onsemi.com 2

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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