NTLJD3115P MOSFET Power, Dual, P-Channel, WDFN 2X2 mm -20 V, -4.1 A Features www.onsemi.com WDFN Package Provides Exposed Drain Pad for Excellent Thermal Conduction V R MAX I MAX (Note 1) (BR)DSS DS(on) D 2x2 mm Footprint Same as SC88 100 m 4.5 V Lowest R Solution in 2x2 mm Package DS(on) 20 V 135 m 2.5 V 4.1 A 1.8 V R Rating for Operation at Low Voltage Gate Drive Logic DS(on) 200 m 1.8 V Level Low Profile (< 0.8 mm) for Easy Fit in Thin Environments S1 S2 Bidirectional Current Flow with Common Source Configuration This is a PbFree Device G1 G2 Applications Optimized for Battery and Load Management Applications in Portable Equipment LiIon Battery Charging and Protection Circuits D1 D2 High Side Load Switch PCHANNEL MOSFET PCHANNEL MOSFET MARKING D2 MAXIMUM RATINGS (T = 25C unless otherwise noted) J D1 DIAGRAM Parameter Symbol Value Unit 1 6 WDFN6 JDM DraintoSource Voltage V 20 V DSS 2 5 CASE 506AN 3 4 GatetoSource Voltage V 8.0 V GS Pin 1 JD = Specific Device Code Continuous Drain I A T = 25C 3.3 D Steady A Current (Note 1) M = Date Code State T = 85C 2.4 A = PbFree Package t 5 s T = 25C 4.1 A (Note: Microdot may be in either location) Power Dissipation Steady P 1.5 W D PIN CONNECTIONS (Note 1) State T = 25C A t 5 s 2.3 D1 Continuous Drain I A S1 D1 T = 25C 2.3 A D 1 6 Current (Note 2) T = 85C 1.6 Steady A State G1 Power Dissipation P 0.71 W 2 5 G2 D T = 25C A (Note 2) D2 Pulsed Drain Current t = 10 s I 20 A p DM D2 3 4 S2 Operating Junction and Storage Temperature T , T 55 to C J STG 150 (Top View) Source Current (Body Diode) (Note 2) I 1.9 A S ORDERING INFORMATION Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) Device Package Shipping Stresses exceeding those listed in the Maximum Ratings table may damage the NTLJD3115PT1G WDFN6 3000/Tape & Reel device. If any of these limits are exceeded, device functionality should not be (PbFree) assumed, damage may occur and reliability may be affected. 1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq NTLJD3115PTAG WDFN6 3000/Tape & Reel 2 oz including traces). (PbFree) 2. Surface Mounted on FR4 Board using the minimum recommended pad size 2 For information on tape and reel specifications, of 30 mm , 2 oz Cu. including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Semiconductor Components Industries, LLC, 2013 1 Publication Order Number: May, 2019 Rev. 7 NTLJD3115P/DNTLJD3115P THERMAL RESISTANCE RATINGS Parameter Symbol Max Unit SINGLE OPERATION (SELFHEATED) JunctiontoAmbient Steady State (Note 3) R 83 JA JunctiontoAmbient Steady State Min Pad (Note 4) R 177 C/W JA JunctiontoAmbient t 5 s (Note 3) R 54 JA DUAL OPERATION (EQUALLY HEATED) JunctiontoAmbient Steady State (Note 3) R 58 JA JunctiontoAmbient Steady State Min Pad (Note 4) R 133 C/W JA JunctiontoAmbient t 5 s (Note 3) R 40 JA 3. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq 2 oz including traces). 2 4. Surface Mounted on FR4 Board using the minimum recommended pad size (30 mm , 2 oz Cu). www.onsemi.com 2