Product Information

NTMS4177PR2G

NTMS4177PR2G electronic component of ON Semiconductor

Datasheet
P-Channel 30 V 6.6A (Ta) 840mW (Ta) Surface Mount 8-SOIC

Manufacturer: ON Semiconductor
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1: USD 0.8267 ea
Line Total: USD 0.83

755 - Global Stock
Ships to you between
Fri. 17 May to Wed. 22 May
MOQ: 1  Multiples: 1
Pack Size: 1
Availability Price Quantity
755 - WHS 1


Ships to you between
Fri. 17 May to Wed. 22 May

MOQ : 1
Multiples : 1

Stock Image

NTMS4177PR2G
ON Semiconductor

1 : USD 0.8267
10 : USD 0.6749
30 : USD 0.5979
100 : USD 0.5228
500 : USD 0.4775
1000 : USD 0.4539

     
Manufacturer
Product Category
RoHS - XON
Icon ROHS
Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
Rds On - Drain-Source Resistance
Transistor Polarity
Vgs - Gate-Source Breakdown Voltage
Vgs th - Gate-Source Threshold Voltage
Minimum Operating Temperature
Maximum Operating Temperature
Pd - Power Dissipation
Mounting Style
Package / Case
Packaging
Technology
Number of Channels
Vgs - Gate-Source Voltage
Qg - Gate Charge
Channel Mode
Configuration
Series
Brand
Forward Transconductance - Min
Fall Time
Rise Time
Factory Pack Quantity :
Typical Turn-Off Delay Time
Height
Length
Transistor Type
Type
Width
Cnhts
Hts Code
Mxhts
Product Type
Subcategory
Taric
Typical Turn-On Delay Time
Category
Brand Category
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NTMS4177P MOSFET Power, P-Channel, SOIC-8 -30 V, -11.4 A Features NTMS4177P THERMAL RESISTANCE RATINGS Rating Symbol Max Unit JunctiontoAmbient Steady State (Note 3) R 82 JA JunctiontoAmbient t10 s (Note 3) R 50 JA C/W JunctiontoFOOT (Drain) R 20 JF JunctiontoAmbient Steady State (Note 4) R 148 JA 3. Surfacemounted on FR4 board using 1 inch sq pad size, 1 oz Cu. 4. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise noted)jk J Characteristic Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage Tem- V /T 29 (BR)DSS J mV/C perature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 J DSS V = 0 V, GS A V = 24 V DS T = 85C 5.0 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 5) Gate Threshold Voltage V V = V , I = 250 A 1.5 2.5 V GS(TH) GS DS D Negative Threshold Temperature Coeffi- V /T 6.0 GS(TH) J mV/C cient DraintoSource On Resistance R V = 10 V I = 11.4 A 10 12 DS(on) GS D m V = 4.5 V I = 9.1 A 15 19 GS D Forward Transconductance g V = 1.5 V I = 11.4 A 30 S FS DS D CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance C 3100 ISS V = 0 V, f = 1.0 MHz, GS Output Capacitance C 550 pF OSS V = 24 V DS Reverse Transfer Capacitance C 370 RSS Total Gate Charge Q 29 G(TOT) Threshold Gate Charge Q 3.3 G(TH) V = 4.5 V, V = 15 V, GS DS nC I = 11.4 A D GatetoSource Charge Q 10 GS GatetoDrain Charge Q 13 GD Total Gate Charge Q V = 10 V, V = 15 V, 55 G(TOT) GS DS nC I = 11.4 A, D Gate Resistance R 2.0 4.0 G SWITCHING CHARACTERISTICS (Note 6) TurnOn Delay Time t 18 d(ON) Rise Time t 13 r V = 10 V, V = 15 V, GS DD ns I = 1.0 A, R = 6.0 D G TurnOff Delay Time t 64 d(OFF) Fall Time t 36 f DRAINTOSOURCE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.73 1.0 V SD V = 0 V J GS I = 2.1 A D T = 125C 0.54 J Reverse Recovery Time t 34 RR ns Charge Time T 18 a V = 0 V, d /d = 100 A/ s, GS IS t I = 2.1 A S Discharge Time T 16 b Reverse Recovery Time Q 30 nC RR 5. Pulse Test: pulse width 300 s, duty cycle 2%. 6. Switching characteristics are independent of operating junction temperatures.

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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