X-On Electronics has gained recognition as a prominent supplier of NTMS4801NR2G mosfet across the USA, India, Europe, Australia, and various other global locations. NTMS4801NR2G mosfet are a product manufactured by ON Semiconductor. We provide cost-effective solutions for mosfet, ensuring timely deliveries around the world.

NTMS4801NR2G

NTMS4801NR2G electronic component of ON Semiconductor
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Part No.NTMS4801NR2G
Manufacturer: ON Semiconductor
Category:MOSFET
Description: ON Semiconductor MOSFET NFET SO8 30V 9.9A 12.5mOhm
Datasheet: NTMS4801NR2G Datasheet (PDF)
This product is classified as Large/Heavy, additional shipping charges may apply. A customer service representative may contact you after ordering to confirm exact shipping charges



Price (USD)

1323: USD 0.328 ea
Line Total: USD 433.94

Availability - 0
MOQ: 1323  Multiples: 1323
Pack Size: 1323
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Ships to you between Thu. 30 May to Wed. 05 Jun

MOQ : 2500
Multiples : 2500
2500 : USD 0.2668
5000 : USD 0.2441
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Ships to you between Thu. 30 May to Wed. 05 Jun

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Ships to you between Thu. 30 May to Wed. 05 Jun

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2500 : USD 0.3053

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RoHS - XON
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Id - Continuous Drain Current
Vds - Drain-Source Breakdown Voltage
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Pd - Power Dissipation
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4801N AYWW NTMS4801N MOSFET Power, N-Channel, SO-8 30 V, 12 A Features NTMS4801N THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit C/W JunctiontoAmbient Steady State (Note 1) R 88.5 JA JunctiontoAmbient t 10 s (Note 1) R 60.5 JA JunctiontoFoot (Drain) R 23 JF JunctiontoAmbient Steady State (Note 2) R 156 JA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Surfacemounted on FR4 board using 1 in sq pad size. 2. Surfacemounted on FR4 board using the minimum recommended pad size. ELECTRICAL CHARACTERISTICS (T = 25C unless otherwise specified) J Parameter Symbol Test Condition Min Typ Max Unit OFF CHARACTERISTICS DraintoSource Breakdown Voltage V V = 0 V, I = 250 A 30 V (BR)DSS GS D DraintoSource Breakdown Voltage V /T 7.0 mV/C (BR)DSS J Temperature Coefficient Zero Gate Voltage Drain Current I T = 25C 1.0 A DSS J V = 0 V, V = 24 V GS DS T = 85C 10 J GatetoSource Leakage Current I V = 0 V, V = 20 V 100 nA GSS DS GS ON CHARACTERISTICS (Note 3) Gate Threshold Voltage V 1.0 2.5 V V = V , I = 250 A GS(TH) GS DS D Negative Threshold Temperature V /T 6.0 mV/C GS(TH) J Coefficient DraintoSource On Resistance R V = 10 V, I = 12 A 7.0 9.0 m DS(on) GS D V = 4.5 V, I = 10 A 9.5 12.5 GS D Forward Transconductance g V = 1.5 V, I = 12 A 26 S FS DS D CHARGES, CAPACITANCES AND GATE RESISTANCE Input Capacitance C 1630 2201 pF iss Output Capacitance C 288 389 V = 0 V, f = 1.0 MHz, V = 25 V oss GS DS Reverse Transfer Capacitance C 150 225 rss Total Gate Charge Q 12.2 14 nC G(TOT) Threshold Gate Charge Q 1.8 G(TH) V = 4.5 V, V = 15 V, I = 12 A GS DS D GatetoSource Charge Q 5.1 GS GatetoDrain Charge Q 4.4 GD Total Gate Charge Q V = 10 V, V = 15 V, I = 12 A 25 nC G(TOT) GS DS D SWITCHING CHARACTERISTICS (Note 4) TurnOn Delay Time t 10.5 ns d(on) Rise Time t 3.7 r V = 10 V, V = 15 V, GS DS I = 1.0 A, R = 6.0 D G TurnOff Delay Time t 29 d(off) Fall Time t 9.8 f DRAINSOURCE DIODE CHARACTERISTICS Forward Diode Voltage V T = 25C 0.73 1.0 V SD J V = 0 V, I = 2.1 A GS S T = 125C 0.6 J

Tariff Desc

8541.21.00 16 No - - With a dissipation rate of less than 1 W Free

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