ON Semiconductor Is Now To learn more about onsemi, please visit our website at www.onsemi.com onsemi andand other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba onsemi or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided as-is and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. Typical parameters which may be provided in onsemi data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and holdo nsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. Other names and brands may be claimed as the property of others. NTNS3C94NZ MOSFET Single N-Channel, Small Signal, XLLGA3, 0.62 x 0.62 x 0.4 mm www.onsemi.com 12 V, 384 mA MOSFET Features V R MAX I MAX (BR)DSS DS(on) D Single NChannel MOSFET 0.48 4.5 V Ultra Small and Thin Package (0.62 x 0.62 x 0.4 mm) 0.54 3.7 V Low R Solution in 0.62 x 0.62 mm Package DS(on) 12 V 0.60 3.3 V 384 mA 1.8 V Gate Voltage Rating 0.80 2.5 V These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant 1.90 1.8 V Applications NChannel MOSFET Small Signal Load Switch D (3) Analog Switch High Speed Interfacing Optimized for Power Management in Ultra Portable Products G (1) MAXIMUM RATINGS (T = 25C unless otherwise stated) J Parameter Symbol Value Units Drain-to-Source Voltage V 12 V DSS S (2) Gate-to-Source Voltage V 8 V GS Continuous Drain Steady T = 25C I 384 mA MARKING A D Current (Note 1) State DIAGRAM T = 85C 277 A 3 1 t 5 s T = 25C 413 A XLLGA3 E M 2 CASE 713AE Power Dissipa- Steady T = 25C P 120 mW A D 1 tion (Note 1) State E = Specific Device Code t 5 s T = 25C 140 A M = Date Code Pulsed Drain Current I 115 A t = 10 s p DM Operating Junction and Storage T , -55 to C J Temperature T 150 STG ORDERING INFORMATION Source Current (Body Diode) (Note 2) I 157 mA S Device Package Shipping Lead Temperature for Soldering Purposes T 260 C L (1/8 from case for 10 s) NTNS3C94NZT5G XLLGA3 8000 / (PbFree) Tape & Reel Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be For information on tape and reel specifications, assumed, damage may occur and reliability may be affected. including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications THERMAL RESISTANCE RATINGS Brochure, BRD8011/D. Parameter Symbol Max Units Junction-to-Ambient Steady State (Note 1) R 1040 C/W JA Junction-to-Ambient t 5 s (Note 1) R 900 JA 1. Surface Mounted on FR4 Board using the minimum recommended pad size, 2 (or 2 mm ), 1 oz Cu. 2. Pulse Test: pulse width 300 s, duty cycle 2%. Semiconductor Components Industries, LLC, 2016 1 Publication Order Number: June, 2019 Rev. 1 NTNS3C94NZ/D